• Journal of the Korean Society for Precision Engineering
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• v.33 no.11
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• pp.899-904
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• 2016

ELID grinding is an excellent technique for the mirror grinding of the variety of the advanced metallic or nonmetallic materials. The focus of this study is the development of an automatic-control electrolysis-speed device for the automation of the ELID-grinding process. For the development of the automatic-control electrolysis-speed device, analysis experiments regarding the ELID cycle and oxide-layer removal and creation were conducted according to a truing and dressing process. Also, a comparative experiment was conducted to confirm the variance of the electrolysis speed in accordance with changes of the voltage. The experiment results for the developed automatic-control electrolysis-speed device show that the developed device could control the electrolysis speed according to voltage changes through the use of the data that are monitored during the ELID-grinding process.

• 보존과학연구
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• s.19
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• pp.109-132
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• 1998

According to excavation of Imdang site, these sites were excavated place to a various of sites from Early lron period to the Koryo Kingdom. Artifacts to be conserved were excavated from A, D and E district. Metal artifacts were excavated from D and E district and lacquer ware artifacts were excavated from Adistrict. Metal artifacts including lacquer ware iron sword, imitative bronze mirror, Osujen and bronze artifact with letter and so on. Bronze artifacts were covered with soil and rust and performed consolidation after passivation treatment with Benzotriazole solution. Also, iron artifacts performed desalting treatment with 0.1M sesquicarbonate solution. After desalinization, adhesive of these artifacts were processed with Araldite(rapid type) after consolidation with20%∼30% NAD-10 solution. Lacquer ware artifacts remained fragments of lacquer to be all corroded and soiled. Therefore these artifacts retained its original form. Fragments of lacquer joined with Caparol 1%∼3% solution and the soil of relics coated with PSNY 3%∼6% solution. There were many kinds of lacquer were. Lacquer ware artifacts presumed to a string instrument that provide important clues for lacquer ware research. As for lacquer fragments inquire, paints grain size were $2∼5\mum$ and conformed to vanished three times.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.3
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• pp.785-792
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• 1994

Ferrite is widely used in the material of magnetic head, but is difficult of grinding because of their brittleness and hardness. Therefore, diamond wheel with superabrasive is required for surface grinding of this brittle material. But the conventional dressing method can not apply to the diamond wheel with superabrasive. In this study describes a newly proposed method for carrying out effective inprocess dressing of diamond wheel with superabrasive. Using the IEDD the surface roughness of workpiece was improved and grinding force was very low. Resently IEDD is good method to obtain the efficiency grinding and surface grinding of brittle materials.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.6
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• pp.1133-1138
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• 2007

DLLs(Delay Locked Loops) have widely been used in many systems in order to achieve the clock synchronization. A SMD (Synchronous Mirror Delay) structure is used both for skew reduction and for DCC (Duty Cycle Correction). In this paper, a SMD based DLL with DCC using Reduced Delay Lines is proposed in order to reduce the clock skew and correct the duty cycle. The merged structure allows the forward delay array to be shared between the DLL and the DCC, and yields a 25% saving in the number of the required delay cells. The designed chip was fabricated using a $0.25{\mu}m$ 1-poly, 4-metal CMOS process. Measurement results showed the 3% duty cycle error when the input signal ranges from 80% to 20% and the clock frequency ranges from 400MHz to 600MHz. The locking operation needs 3 clock and duty correction requires only 5 clock cycles as feature with SMD structure.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.2
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• pp.138-143
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• 2000

The establishment of a practical ultra-precision grinding technique using Diamond and CBN wheels is one of the major key technolo-gies to improve production techniques for machine-to-difficult materials without finishing process such as lapping and polishing. But the special efficient dressing technique for ultra-fine grit type grinding wheels to stabilize the grinding ability was not developed. Recently electrolytic in-process dressing technique is proposed to ultra-fine grit type metal bonded diamond wheels to protrude abra-sives continuously from the tool surface. This technology can be widely used to surface grinding and cylindrical grinding but cannot be used efficiently to internal grinding because of the electrode attachment trouble. This paper describes the effect of interval type electrolytic dressing as proposed newly to cast iron bonded diamond wheel for efficient internal grinding with mirror type high quality ground surface.

• Journal of the Korean Vacuum Society
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• v.5 no.2
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• pp.147-155
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• 1996

Optical properties of $TiO_2/M/Ag/M/TiO_2$ films have been changed with the diffusion barrier metal M. Optimum opticla properties of $TiO_2/M/Ag/M/TiO_2$ as the transparent heat mirror film, could be obtained with Ti among diffusion barrier metals of Ti, Cu, Zr and Al. $TiO_2/M/Ag/M/TiO_2$ film, which was fabricated by sputtering of 18 nm-thick $TiO_2$ and Ag, and 4nm-thick Ti, showed maximum transimittance of 89% at visible wavelength and infrared reflectance of 97% at wavelength of 3000 nm. Optical properties of this film was not degraded by Xenon-sunshine weather test for 240 hours. For specimens with barrier layers of Cu, Zr, and Al, degradation of optical properties by weather test was increased in a sequence of films with Cu, Zr, and Al barrier layers.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.4
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• pp.343-346
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• 2010

We have investigated growth of CdTe thin films by using (As, GaAs) buffer layers for application of large scale IR focal plane arrays(IFPAs). Buffer layers were grown by molecular beam epitaxy(MBE), which reduced the lattice mismatch of CdTe/Si and prevented native oxide on Si substrates. CdTe thin films were grown by metal organic chemical deposition system(MOCVD). As a result, polycrystalline CdTe films were grown on Si(100) and arsenic coated-Si(100) substrate. In other case, single crystalline CdTe(400) thin film was grown on GaAs coated-Si(100) substrate. Moreover, we observed hillock structure and mirror like surface on the (400) orientated epitaxial CdTe thin film.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.921-926
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• 1997

SOI(Silicon On lnsulator) technology is many advantages in the gabrication of MOS(Metal-Oxide Semiconductor) and CMOS(Complementary MOS) structures. These include high speed, lower dynamic power consumption,greater packing density, increased radiation tolearence et al. In smiple form of bonded SOL wafer manufacturing, creation of a bonded SOI structure involves oxidizing at least one of the mirror polished silicon surfaces, cleaning the oxidized surface and the surface of the layer to which it will be bonded,bringing the two cleanded surfaces together in close physical proximity, allowing the subsequent room temperature bonding to proceed to completion, and than following this room temperature joining with some form of heat treatment step,and device wafer is thinned to the target thickness. This paper has been performed to investigate the possibility of the bonded SOI wafer manufacturing Especially, we focused on the bonding quality and thinning method. Finally,we achieved the bonded SOI wafer that Si layer thickness is below 3 .mu. m and average roughness is below 5.angs.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.917-921
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• 2000

One of the major limitations of productivity and quality in machining is machining accuracy of the machine tools. The machining accuracy is affected by geometric, volumetric errors of the machine tools. This paper suggests the enhancement method of machining accuracy for precision machining of high quality metal reflection mirror or optics lens, etc. In this paper, we study 1) the compensation of linear pitch error with NC controller compensation function using laser interferometer measurement, 2) the method for enhancing the accuracy of NC milling machining by modeling and compensation of volumetric error, 3) the generation of the parabolic face profile. And the method is verified by the parabolic face machining experiment with a vertical three axes NC milling machine. After this study, we will inspect using On-machine measurement and study the repetitive machining by a compensated path

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.591-596
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• 2000

The needs of ultra precision machined parts is increase every days. But the experimental data of nonferrous metal is insufficient. The cutting behavior in micro cutting area is different from that of traditional cutting because of the size effect. Al6061 is widely used as optical parts such as LASER reflector's mirror or multimedia instrument. Al6061 opper is machined by ultra precision machine with natural diamond tool. From the experiment and discussion on the cutting force and worked surface roughness as the variable spindle speed, feed rate and depth of cut. As a result, the cutting force increases as the increasing depth of cut, but the worked surface roughness does not increase so much. The surface roughness is good when spindle sped is above 1200rpm, and feed rate is small. The influence of depth of cut is very small.