• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.5
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• pp.358-363
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• 2010

The polishing pad is important element for polishing characteristic such as material removal rate(MRR) and within wafer non-uniformity(WIWNU) in the chemical mechanical planarization(CMP). The result of the viscoelasticity measurement shows that 1st elastic modulus is increased and 2nd elastic modulus is decreased when the top pad is thickened. The finite element analysis(FEA) was conducted to predict characteristic of polishing behavior according to the pad thickness. The result of polishing experiment was similar with the FEA, and it shows that the 1st elastic modulus affects instantaneous deformation of pad related to MRR. And the 2nd elastic modulus has an effect on WIWNU due to the viscoelasticity deformation of pad.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.7 s.238
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• pp.983-989
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• 2005

The effects of mechanical parameters on the characteristics of chemical mechanical polishing(CMP) can be directly evaluated by friction force. The piezoelectric quartz sensor for friction force measurement was installed, and friction force could be detected during CMP process. Furthermore, friction energy can be calculated by multiplying relative velocity by integration of the friction force throughout the polishing time. $SiO_2$ slurry for interlayer dielectric(ILD) CMP was used in this experiment to consider the relation of frictional characteristics and polishing results. From this experiment, it is proven that the friction energy is an essential factor of removal rate. Also, the friction force is related to removal amount per unit length(dH/ds) and friction energy has corelation to the removal rate(dH/dt) and process temporature. Moreover, within wafer non-unifornity(WIWNU) is related to coefficient of friction because of the mechanical moment equilibrium. Therefore, the prediction of polishing result would be possible by measuring friction force.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.1
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• pp.69-74
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• 2015

Cadmium telluride (CdTe) is being developed for thin film of the X-Ray detector recently. But a rough surface of the CdTe should be improved for resolution and signal speed. This paper shows the study on the improvement of surface roughness and removal rate by applying Chemical Mechanical Polishing. The conventional potassium hydroxide (KOH) based colloidal silica slurry could not realize a mirror surface without physical defects, resulting in low material removal rate and many scratches on surface. In order to enhance chemical reaction such as form oxidized layer on the surface of cadmium telluride, we used hydrogen peroxide ($H_2O_2$) as an oxidizer. Consequently, in case of 3 wt% concentration of hydrogen peroxide, the highest MRR (938 nm/min) and the lowest surface roughness ($R_{p-v}=10.69nm$, $R_a=0.8nm$) could be obtained. EDS was also used to confirm the generated oxide of cadmium telluride surface.

• Proceedings of the SAREK Conference
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• 2008.11a
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• pp.537-540
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• 2008

A numerical study has been carried out on the optimization of an air cleaning system which was installed in a heating, ventilation and air conditioning system (HVAC) system of subway station for particle removal. Required particle removal efficiencies of three different air cleaning systems were calculated from ventilation rate, and indoor/outdoor concentration of PM10. Mass balance equations of PM10 were used to solve the required particle removal efficiencies. Fibrous filter was considered as an air cleaning system. Calculations were carried out about two different places which were waiting area and platform of subway station, respectively. This study proposed optimized design and operation condition of each air cleaning system.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.59-62
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• 2012

This test method covers a procedure for measuring particle removal characteristic of equipment fan filter unit(EFFU) installed inside of semiconductor process equipments, FPD manufacturing equipments and so on. Since EFFU is a combination of air filter and the assembly of fan, motor and frame, the integrity of these parts is very important for the performance of EFFU. So a conventional particle removal test method for air filters is not suitable for EFFU particle removal performance. This test method defines an evaluation method for EFFU which is installed inside an enclosed space to remove particles that are generated inside process equipment. The particle removal performance of EFFUs is usually depending on the performance of filter media and air flow rate. To understand a performance of an EFFU, the filter media characteristic, air flow rate and the integrity of EFFU parts should be considered simultaneously. This test method is intended to demonstrate the system performance of an EFFU and successfully evaluated EFFU performance characteristics.

• Journal of the Korean Society of Visualization
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• v.19 no.3
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• pp.130-135
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• 2021

Water vapor has received worldwide large attention due to its broad technological implications ranged from resource production and environmental remediation. Especially, one of the typical areas where the water vapor is important is the removal of PM (particulate matter) which causes a critical hazard to human health. However, most vapor-based PM removal methods are limited in removing PM2.5 by using relatively large water droplets and consume large energy. Here, we propose a superhydrophilic thermally-insulated macroporous membrane to generate steam flow. The water vapor directly captures PM with steam flow and hygroscopic characteristic of PM. The steam, the cluster of water vapor, from the membrane gives rise to high removal efficiencies compared to those of the control case without light illumination. To reveal PM removal mechanism, the steam flow and PM were quantitatively analyzed using PIV measurement. The proposed steam generator could be utilized as an economical and ecofriendly platform for effective PM removal at a fairly low cost in a sustainable, energy-free, and harmless-to-human manner.

• Journal of Mechanical Science and Technology
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• v.16 no.6
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• pp.757-761
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• 2002

When a layer of cylindrical composite component containing an axisymmetric residual stress state is removed from the inner or outer surface, the dimension of the remaining material changes to balance internal forces. Therefore, in order to machine cylindrical composite components within tolerances, it is important to know dimensional changes caused by residual stress redistribution in the body. In this study, analytical solutions for dimensional changes and the redistribution of residual stresses due to the layer removal from a residually stressed cylindrically orthotropic cylinder were developed. The cylinder was assumed to have axisymmetric radial, tangential and axial residual stresses. The result of this study is useful in cases where the initial residual stress distribution in the component has been measured by a non-destructive technique such as neutron diffraction with no information on the effect of layer removal operation on the dimensional changes.

• Journal of Environmental Science International
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• v.26 no.2
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• pp.201-210
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• 2017

This study was conducted to estimate the removal efficiency of algae by a mechanical Screw Brush Cone Filter in a lake. The device used a stainless steel cone-shaped filter with a screw brush. The ability of the developed device to remove algae larger than $20{\mu}m$ in Lake ChaSa, Gwangyang city was tested from August to September 2014. The results show that the removal rates for chlorophyll-a, suspended solids and volatile suspended solids were 44-87%(mean 61%), 35-54%(mean 40%), and 37-46%(mean 43%), respectively. This study also discusses equipment and device operation costs and device application problems, and suggests in situ. solutions to these problems.

• Journal of the Semiconductor & Display Technology
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• v.11 no.3
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• pp.7-11
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• 2012

Among various wet cleaning methods, megasonic and jet spray gained their popularity in single wafer cleaning process for the efficient removal of particulate contaminants from the wafer surface. In the present study, we evaluated these two cleaning methods for particle removal efficiency (PRE) and pattern damage on the aluminum layered wafer surface. Also the effect of $CO_2$ dissolved water in jet spray cleaning is assessed by measuring PRE. It is observed that the jet spray cleaning process is more effective in terms of PRE and pattern damage compared to megasonic cleaning and the mixing of $CO_2$ in the water during jet sprays further increases the PRE. We believe that the outcome of the present study is useful for the semiconductor cleaning process engineers and researchers.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.11
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• pp.46-52
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• 2004

CMP (Chemical-Mechanical Polishing) is a process in which both chemical and mechanical mechanisms act simultaneously to produce the planarized wafer. CMP process is an extensive usage and continuing high growth rates in the semiconductor industry. The understanding of the process, however, is much slower. The nature of material removal from the wafer is still undefined and ambiguous. Material removal rate according to the slurry flow rate is also undefined and ambiguous. Thus, in this study, the basic mechanism of material removal rate as slurry flow rate is defined in terms of energy supply and energy loss.