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Evaluation of Particle Removal Efficiency during Jet Spray and Megasonic Cleaning for Aluminum Coated Wafers  

Choi, Hoomi (SKKU Advanced Institute of Nanotechnology)
Min, Jaewon (Samsung Electronics)
Kulkarni, Atul (School of Mechanical Engineering)
Ahn, Youngki (School of Mechanical Engineering)
Kim, Taesung (SKKU Advanced Institute of Nanotechnology)
Publication Information
Journal of the Semiconductor & Display Technology / v.11, no.3, 2012 , pp. 7-11 More about this Journal
Abstract
Among various wet cleaning methods, megasonic and jet spray gained their popularity in single wafer cleaning process for the efficient removal of particulate contaminants from the wafer surface. In the present study, we evaluated these two cleaning methods for particle removal efficiency (PRE) and pattern damage on the aluminum layered wafer surface. Also the effect of $CO_2$ dissolved water in jet spray cleaning is assessed by measuring PRE. It is observed that the jet spray cleaning process is more effective in terms of PRE and pattern damage compared to megasonic cleaning and the mixing of $CO_2$ in the water during jet sprays further increases the PRE. We believe that the outcome of the present study is useful for the semiconductor cleaning process engineers and researchers.
Keywords
Wet cleaning; Particle removal efficiency; Pattern damage; Functional water;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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