• KSTLE International Journal
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• 제5권1호
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• pp.32-35
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• 2004

The purpose of this study is to investigate the effects of the structure and mechanical properties of laser-processed pads on their polishing behavior such as their removal rate and WIWNU (within wafer non-uniformity) during the chemical mechanical planarization (CMP) process. The holes on the pad acted as the reservoir of slurry particles and enhanced the removal rate. Without grooves, no effective removal of wafers was possible. When the length of the circular-type grooves was increased, higher removal rates and lower wafer non-uniformity were measured. The removal rate and non-uniformity linearly increased as the elastic modulus of the top pad increased. Higher removal rates and lower non-uniformity were measured as the hardness of the pad increased.

• Tribology and Lubricants
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• 제33권3호
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• pp.106-111
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• 2017

Sapphire is an anisotropic material with excellent physical and chemical properties and is used as a substrate material in various fields such as LED (light emitting diode), power semiconductor, superconductor, sensor, and optical devices. Sapphire is processed into the final substrate through multi-wire saw, double-side lapping, heat treatment, diamond mechanical polishing, and chemical mechanical polishing. Among these, chemical mechanical polishing is the key process that determines the final surface quality of the substrate. Recent studies have reported that the material removal characteristics during chemical mechanical polishing changes according to the crystal orientations, however, detailed analysis of this phenomenon has not reported. In this work, we carried out chemical mechanical polishing of C(0001), R($1{\bar{1}}02$), and A($11{\bar{2}}0$) substrates with different sapphire crystal planes, and analyzed the effect of crystal orientation on the material removal characteristics and their correlations. We measured the material removal rate and frictional force to determine the material removal phenomenon, and performed nano-indentation to evaluate the material characteristics before and after the reaction. Our findings show that the material removal rate and frictional force depend on the crystal orientation, and the chemical reaction between the sapphire substrate and the slurry accelerates the material removal rate during chemical mechanical polishing.

• 한국수소및신에너지학회논문집
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• 제35권2호
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• pp.115-120
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• 2024

In this study, the extent of water removal in the high-moisture coal was measured. The simplified adsorption model was developed to predict the extent of water removal. The water removal was observed to increase up to 25% at saturation condition of 25℃. The modeling work shows that adsorption contributes the water removal only by 3%, whereas other factors such as CO₂ solubility and wettability would be responsible for the water removal.

• Tribology and Lubricants
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• 제34권3호
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• pp.115-122
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• 2018

Chemical mechanical polishing (CMP) is a hybrid processing method in which the surface of a wafer is planarized by chemical and mechanical material removal. Since mechanical material removal in CMP is caused by the rolling or sliding of abrasive particles, interfacial friction during processing greatly influences the CMP results. In this paper, the trend of tribology research on CMP process is discussed. First, various friction force monitoring methods are introduced, and three elements in the CMP tribo-system are defined based on the material removal mechanism of the CMP process. Tribological studies on the CMP process include studies of interfacial friction due to changes in consumables such as slurry and polishing pad, modeling of material removal rate using contact mechanics, and stick-slip friction and scratches. The real area of contact (RCA) between the polishing pad and wafer also has a significant influence on the polishing result in the CMP process, and many researchers have studied RCA control and prediction. Despite the fact that the CMP process is a hybrid process using chemical reactions and mechanical material removal, tribological studies to date have yet to clarify the effects of chemical reactions on interfacial friction. In addition, it is necessary to clarify the relationship between the interface friction phenomenon and physical surface defects in CMP, and the cause of their occurrence.

• Tribology and Lubricants
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• 제37권6호
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• pp.208-212
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• 2021

Chemical mechanical polishing (CMP) is a key technology used for the global planarization of thin films in semiconductor production and smoothing the surface of substrate materials. CMP is a type of hybrid process using a material removal mechanism that forms a chemically reacted layer on the surface of a material owing to chemical elements included in a slurry and mechanically removes the chemically reacted layer using abrasive particles. Sapphire is known as a material that requires considerable time to remove materials through CMP owing to its high hardness and chemical stability. This study introduces a technology using electrolytic ionization and ultraviolet (UV) light in sapphire CMP and compares it with the existing CMP method from the perspective of the material removal rate (MRR). The technology proposed in the study experimentally confirms that the MRR of sapphire CMP can be increased by approximately 29.9, which is judged as a result of the generation of hydroxyl radicals (·OH) in the slurry. In the future, studies from various perspectives, such as the material removal mechanism and surface chemical reaction analysis of CMP technology using electrolytic ionization and UV, are required, and a tribological approach is also required to understand the mechanical removal of chemically reacted layers.

• Journal of Dental Anesthesia and Pain Medicine
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• 제18권5호
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• pp.277-285
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• 2018

Chemo-mechanical caries removal methods are known to be more effective compared with conventional methods in pain reduction. $Carie-care^{TM}$, a chemo-mechanical caries removal agent, was introduced in 2010 but a systematic review of its efficacy has not yet been performed. The purpose of this study was to investigate the effectiveness of $Carie-care^{TM}$ on the outcomes of treatment of caries in children and adolescents. The primary outcome was pain while the secondary outcomes included complete caries removal (CCR), time, need for local anesthesia and behavioral response changes. A Comprehensive literature search was performed in PubMed, EMBASE, and the Cochrane Library up to 30 September 2018. The following keywords were used in the search: 'chemo-mechanical caries removal agent', 'dental caries', 'Carie-care', 'chemo-mechanical caries removal', 'chemo-mechanical caries excavation', other related keywords, and their combinations. From 942 studies identified, 16 were analyzed. Finally, 4 studies met the eligibility criteria and 260 teeth in 120 children and adolescents were included in this review. This review showed that $Carie-care^{TM}$ reduces pain during caries treatment but requires a longer time for effective treatment than conventional methods. Local anesthesia was not required in the Chemo-mechanical caries removal (CMCR) group. In addition, dental anxiety decreased compared to the control group, and co-operation was more positive. Therefore, it may be a useful alternative to conventional methods in children and adolescents, but further verification through additional studies is needed.

• Journal of Mechanical Science and Technology
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• 제14권9호
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• pp.913-919
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• 2000

The purpose of this study was to develop a new element removal method for ESO (Evolutionary Structural Optimization), which is one of the topology optimization methods. ESO starts with the maximum allowable design space and the optimal topology emerges by a process of removal of lowly stressed elements. The element removal ratio of ESO is fixed throughout topology optimization at 1 or 2%. BESO (bidirectional ESO) starts with either the least number of elements connecting the loads to the supports, or an initial design domain that fits within the maximum allowable domain, and the optimal topology evolves by adding or subtracting elements. But the convergence rate of BESO is also very slow. In this paper, a new element removal method for ESO was developed for improvement of the convergence rate. Then it was applied to the same problems as those in papers published previously. From the results, it was verified that the convergence rate was significantly improved compared with ESO as well as BESO.

• 대한기계학회논문집B
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• 제26권4호
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• pp.547-554
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• 2002

We are facing the serious environmental pollution difficulties such as acid rain, green house effects, etc. The gaseous matter NOx, SOx, VOCs which are regarded as main factors for these current pollutions are mainly emitted from power plants and vehicles. Therefore several leading countries are regulating the emissions strictly, especially the exhaust emissions from a Diesel engine without an aftertreatment device. The objective of this study is to find out soot and NO removal characteristics focused on the emissions of a Diesel engine by using nonthermal plasma for each engine speeds and loads. Electrostatic precipitator(wire-to-plate type reactor) is used for soot removal. Radicals generated from outer air and put into a mixing chamber in the end of exhaust line are used for NO removal. Concentration of exhaust emissions is analyzed from the gas analyzer(KaneMay) and FTIR to estimate by-products.

• 한국입자에어로졸학회지
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• 제5권1호
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• pp.9-16
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• 2009

Pressure drop and particle removal efficiency of two commercial fibrous medium filters were measured with 20~1,000 nm sized aerosolized KCl particles. Pressure drop and particle removal efficiency were also theoretically predicted and the results qualitatively agreed with the experimental data. For this given particle removal efficiency, a filter design method for obtaining minimum pressure drop (and therefore minimum fan power) was suggested in this study by selecting solidity and fiber diameter as parameters. Therefore, by carrying out theoretical and experimental approaches together, this paper introduced a way of finding conditions for low pressure drop and high performance of a fibrous filter, especially if the filter would be used in mechanical ventilation system.

• Restorative Dentistry and Endodontics
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• 제30권3호
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• pp.149-157
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• 2005

본 연구는 우식의 기계적 제거와 기계화학적 제거의 효과를 비교, 평가하고자 하였으며, 기계적 제거방법은 저속의 round bur로, 기계 화학적 제거 방법은 Carisolv로 우식을 제거한 후, 잔존 우식을 확인하여 소요시간을 측정하였고, 또 실험실에서 발치한 우식 대구치 20개를 위 두 가지 방법으로 우식을 제거 후, Villanueva bone stain액으로 염색하고 표본을 제작 후 관찰하여 다음의 결론을 얻었다; 1.우식제거에 평균소요시간은 기계화학적 제거가 기계적인 제거보다 1.5배 더 길게 나타났다 (P < 0.05). 2, 우식제거에 평균소요시간은 소구치보다 대구치에서 더 길었고, 전치에서 가장 적은것으로 나타났다 (P < 0.05) 3 상 · 하악에서는 차이가 없었다 (P > 0.05) 4. 기계화학적 방법으로 우식 상아질을 제거 시 잔존 우식 상아질이 관찰되었으며 두 방법 모두 우식 상아질을 제거한 표면에서는 도말층을 관찰할 수 없었다.