Effect of Crystal Orientation on Material Removal Characteristics in Sapphire Chemical Mechanical Polishing |
Lee, Sangjin
(Precision Manufacturing & Control R&D Group, Korea Institute of Industrial Technology)
Lee, Sangjik (Precision Manufacturing & Control R&D Group, Korea Institute of Industrial Technology) Kim, Hyoungjae (Precision Manufacturing & Control R&D Group, Korea Institute of Industrial Technology) Park, Chuljin (Precision Manufacturing & Control R&D Group, Korea Institute of Industrial Technology) Sohn, Keunyong (Department of Nanoscience and Engineering, Center for Nanomanufacturing, Inje University) |
1 | Shi, X., Pan, G., Zhou, Y., Xu, L., Zou, C., Gong, H., "A study of chemical products formed on sapphire (0001) during chemical-mechanical polishing", Surface and Coating Techonology, Vol. 270, pp. 206-220, 2015. DOI |
2 | Zhou, P., Gao, P. F., Wang, W. F., Wen, D. H., "Anisotropic Lapping of Single Crystal Sapphire", Advanced Materials Research, Vol. 102, pp. 502-505, 2010. |
3 | Budnikov, A. T., Vovk, E. A., Krivonogov, S. I., Danko, A. Y., Lukiyenko, O. A., "Anisotropy of sapphire properties associated with chemical mechani-cal polishing with silica", Functional Materials, Vol. 17, pp. 488-494, 2010. |
4 | Wang, Y. G., Zhang, L. C., "On the chemo mechanical polishing for nano-scale surface finish of brittle wafers", Recent Patents on Nanotechnology, Vol. 4, pp. 70-77, 2010. DOI |
5 | Zhu, H., Tessaroto, L. A., Sabia, R., Greenhut, V. A., Smith, M., Niesz, D. E., "Chemical Mechanical Polishing (CMP) anisotropy in sapphire", Applied Surface Science, Vol. 236, pp. 120-130, 2004. DOI |
6 | Preston, F. W., "The theory and design of plate glass polishing machines", J. Soc. Glass Tech, Vol. 11, pp. 214-256, 1927. |
7 | Jo, W. S., Lee, S. J., Kim, H. J., Lee, T. G., Lee, S. B., "A study of material removal characteristics by friction monitoring system of sapphire wafer in single side DMP", J. Korean Soc. Tribol, Lubr, Eng, Vol. 32, pp. 56-60, 2016. |
8 | Toshiro K. Doi, Toshio Kasai, Hans K. Tonshoff, "Lapping and polishing", Handbook of Ceramic Grinding & Polishing, pp. 354-442, 1999. |
9 | Lee, K, Y., Lee, C. B., Kim, S. I., Lee, C. W., "the measurement errors of elastic modulus and hardness due to the different indentation speed", Vol. 19, pp. 360-364, 2010. DOI |
10 | Neeuw, N. H., Parker, S. C., "Effect of Che-misorption and Physisorption of Water on the Surface Structure and Stability of a-alumina", Journal of the American Ceramic Society, Vol. 82, pp. 3209-2316, 1999. |
11 | Zhou, Y., Pan, G., Shi, X., Gong, H., Xu, L., Zou, C., "AFM and XPS studies on material removal mechanism of sapphire wafer during Chemical Mechanical Polishing (CMP), Journal of Materials Science : Materials in Electronics, Vol. 26, pp. 9921-9928, 2015. DOI |