The Effect of Mechanical Properties of Polishing Pads on Oxide CMP(Chemical Mechanical Planarization) |
Hong, Yi-Koan
(Department of Metallurgy and Materials Engineering, Hanyang University)
Eom, Dae-Hong (Department of Metallurgy and Materials Engineering, Hanyang University) Kang, Young-Jae (Department of Metallurgy and Materials Engineering, Hanyang University) Park, Jin-Goo (Department of Metallurgy and Materials Engineering, Hanyang University) Kim, Jae-Seok (SKC Co.) Kim, Geon (SKC Co.) Lee, Ju-Yeol (SKC Co.) Park, In-Ha (SKC Co.) |
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2 | S. H. Li and R. O. Miller, Semiconductors and Semimetals, Vol. 63, p. 158 (2000) |
3 | W. J. Patrick, W. L. Guthrie, C. L. Standley and P. M. Schiable, J. Electrochem. Soc., 138, 1778 (1991) |
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