• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
• /
• 2006.11a
• /
• pp.269-272
• /
• 2006

The use of packaged skid in oil and gas plant has increased dramatically over the decades, replacing loose supply equipment. Most equipment is installed on structural skid in manufacturer's shop. As Oil and Gas Plants are constructed at inaccessible area, the demands of packaged skids are increased. The packaged skid have advantages comparing to loose supply equipment in inaccessible area. The packaged skid is small complex plant consists of process, mechanical, piping, instrument, electrical and structural steel. This paper examines advantages and problems of packaged skid, based on previous experience. EPC company consider key factors such as manufacturing period, construction periods, equipment quality and costs.

• Journal of KIBIM
• /
• v.10 no.4
• /
• pp.70-80
• /
• 2020

In the MEP(Mechanical Electrical and Plumbing) field, the utilization of BIM-based drawings is lower than in the architectural and structural sectors, and the limited BIM collaboration problem caused by different levels of BIM utilization in each field is becoming a serious problem in adoption and utilizing BIM. Therefore, this study analyzed the current status of BIM application in the field of mechanical equipment in the construction industry and analyzed the practical problems and limitations of adoption and utilizing BIM from a corporate perspective based on Delphi analysis techniques. Based on the results of the analysis, the limitations of the current MEP BIM application were classified into economic, technical, institutional, and social factors to derive detailed items, and, accordingly, the improvement measures were classified as institutional, policy, and technical measures. As a result, the company intends to maximize the value of BIM utilization in the MEP field by presenting improvement plans to activate BIM in the field of mechanical equipment based on the opinions of the company, thereby laying the foundation for BIM in the construction industry by creating a collaborative BIM environment for each sector in the domestic construction industry.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.13 no.10
• /
• pp.812-816
• /
• 2000

It is very important to understand the correlation of between inter dielectric(ILD) CMP process and various facility factors supplied to equipment to equipment system. In this paper, the correlation between the various facility factors supplied to CMP equipment system and ILD-CMP process was studied. To prevent the partial over-polishing(edge hot-spot) generated in the wafer edge area during polishing, we analyze various facilities supplied at supply system. With facility shortage of D.I water(DIW) pressure, we introduced an adding purified $N_2$(P$N_2$)gas in polishing head cleaning station for increasing a cleaning effect. DIW pressure and P$N_2$gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. We estimated two factors (DIW pressure and P$N_2$gas) for the improvement of CMP process. Especially, we obtained a uniform planarity in patterned wafer and prohibited more than 90% wafer edge over-polishing. In this study, we acknowledged that facility factors supplied to equipment system played an important role in ILD-CMP process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.16 no.5
• /
• pp.365-371
• /
• 2003

We prepared silicon on insulator(SOI) wafer pairs of Si/1800${\AA}$ -SiO$_2$ ∥ 1800${\AA}$ -SiO$_2$/Si using water direct bonding method. Wafer pairs bonded at room-temperature were annealed by a normal furnace system or a fast linear annealing(FLA) equipment, and the micro-structure of bonding interfaces for each annealing method was investigated. Upper wafer of bonded pairs was polished to be 50 $\mu\textrm{m}$ by chemical mechanical polishing(CMP) process to confirm the real application. Defects and bonding area of bonded water pairs were observed by optical images. Electrical and mechanical properties were characterized by measuring leakage current for sweeping to 120 V, and by observing the change of wafer curvature with annealing process, respectively. FLA process was superior to normal furnace process in aspects of bonding area, I-V property, and stress generation.

• International Journal of Air-Conditioning and Refrigeration
• /
• v.16 no.2
• /
• pp.64-69
• /
• 2008

Electronic and telecommunication industries are constantly striving towards miniaturization of electronic devices. Miniaturization of chips creates extra space on PCBs that can be populated with additional components, which decreases the heat transfer surface area and generates very high heat flux. Even though an air-cooling technology for telecommunication equipment has been developed in accordance with rapid growth in electrical industry, it is confronted with the limitation of cooling capacity due to the rapid increase of heat density. In this study, liquid-cooling heat exchangers were designed and tested by varying geometry and operating conditions. In addition, air-cooling heat exchangers were tested to provide performance data for the comparison with the liquid-cooling heat exchangers. The liquid-cooling heat exchangers had twelve rectangular channels with different flow paths of 1, 2, and 12. Silicon rubber heaters were used to control the heat load to the heat exchangers. Heat input ranged from 293 to 800W, and inlet temperatures of working fluid varied from 15 to $27^{\circ}C$. The heat transfer coefficients were strongly affected by flow conditions. All liquid-cooling heat exchangers showed higher cooling performance than the air-cooling heat exchanger. The heat exchanger with 2-paths could provide more controllability on the maximum temperature than the others.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.19 no.10
• /
• pp.710-717
• /
• 2007

Electric and telecommunication industries are constantly striving towards miniaturization of electronic devices. Miniaturization of chips creates extra space on PCBs that can be populated with additional components, which decreases the heat transfer surface area and generates very high heat flux. Even though an air-cooling technology for telecommunication equipment has been developed in accordance with rapid growth in electrical industry, it is confronted with the limitation of cooling capacity due to the rapid increase of heat density. In this study, liquid-cooling heat exchangers with MPCM slurries were designed and tested by varying geometry and operating conditions. The liquid-cooling heat exchangers with 4-paths showed higher cooling performance than the others. The cooling performance of liquid cooling heat exchanger with MPCM slurries was more enhanced than that of the air cooling system. It's performance was also slightly superior to that of the water cooling system at the inlet temperature of $19^{\circ}C$.

• Journal of Applied Reliability
• /
• v.7 no.1
• /
• pp.23-29
• /
• 2007

Probe card is a test component which is to classify the known good die with electrical contact before the packaging in the ATE (automatic testing equipment). Conventional probe tip was mostly needle type, it has been difficult to meet with conventional type, because of decreasing chip size, pad to pad pitch and pads size increasingly. For that reason, probe cards using MEMS (micro electro mechanical system) technology have been developed for various semiconductor chips. In this paper, Area Array type MEMS Probe tip was designed,, fabricated, and characterized its mechanical and electrical properties. The authors found that good electrical characteristics under $1{\Omega}$ were acquired with gold (Au) and aluminium (Al) pad contact test over 0.5gf and 4gf respectively. And, contact resistance variation under $0.1{\Omega}$ were achieved with 100,000 times of repetition test. And, insertion loss (IS) for high frequency operation was ascertained over 300MHz at -3dB loss.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.59 no.6
• /
• pp.1011-1016
• /
• 2010

It is an important issue to electric power system operations that it can reliably supply large-capacity power to consumption area as due to increasing power demand growth. For this purpose, The FACTS equipment based on Power IT technology with the existing mechanical compensators has been applied to power system. Therefore we suggest on this paper that a plan for coordination control of multiple power compensation equipment in order to increase the utilization of each facility and secure operation margin capacity. As the result of simulation, it is possible to cope actively with a suddenly changed power system. This helps greatly for the voltage stability and supply reliability in a suddenly changed power system.

• Journal of Advanced Marine Engineering and Technology
• /
• v.28 no.6
• /
• pp.938-945
• /
• 2004

Intrinsic safety is generally considered the safest method of operating electrical instrumention in potentially explosive atmospheres. The method of intrinsic safety limits the energy passing into the hazardus area. The energy limitation is provided by the use of safety barriers which are mounted in the safe area. Because of the energy limitation, regardless of the fault in the hazardous area, sufficient energy cannot be released to ignite the explosive atmosphere. The following industries are known to have hazardous locations: chemical. munitions, petrochemical, auto(paint spray booths), grain, waste water, printing, distillers, pharmaceutical. breweries, cosmetics, and utilities. In this paper, a isolator type barrier for ship(LNG, LPG, etc,) and test equipment confidence are proposed. The test equipments are designed for mechanical electrical life time test and vibration. All of test results satisfy the goal and the studied barrier shows the improved confidence.

• Transactions of the Korean Society of Automotive Engineers
• /
• v.22 no.3
• /
• pp.33-41
• /
• 2014

Fretting is a kind of surface degradation mechanism observed in mechanical components and structures. When two pieces of materials, pressed together by an external static load, are subjected to a transverse cyclic loading or various vibrations, so that one contacting face is relatively displaced cyclically parallel to the other face, wear of the mating surfaces occurs. These fretting damages may be observed in electrical connectors for automotive components, where there are special environments and various vibration conditions. This study aims to evaluate the usefulness of fretting test equipment that was developed for reliability test of electrical connector. Fretting tests were carried out using tin coated connectors and friction force, contact resistance, contact area and roughness of contact region were investigated. The following results that will be helpful to understand the fretting wear mechanism, increase process the contact resistance and contact area were obtained. (1) In the same frequency and slip amplitude, the friction force, roughness and contact area increased rapidly until about $10^3$ cycles, after which it was slightly changed. (2) In the various frequency and slip amplitude, the contact area increased with slip amplitude and cyclic numbers, but it did not depend on cyclic frequency. (3) The surface roughness of contact region did not depend on the cyclic frequency. From these results, the applicability of the fretting wear test equipment and reliability of connector were discussed.