Performance Characteristics of Liquid-Cooling Heat Exchangers with MPCM Slurry Designed for Telecommunication Equipment |
Jeon, Jong-Ug
(Graduate School of Mechanical Engineering, Korea University)
Kim, Yong-Chan (Department Mechanical Engineering, Korea University) Choi, Jong-Min (Department of Mechanical Engineering, Hanbat National University) Hyun, Dong-Soo (Department of Mechanical Engineering, Hanbat National University) Yun, Rin (Department of Mechanical Engineering, Hanbat National University) |
1 | Inaba, H., 2000, New challenge in advanced thermal energy transportation using functionally thermal fluids, International Journal Thermal Science, Vol. 39, pp. 991-1003 DOI ScienceOn |
2 | Lee, Y.J., Choi, J. K. and Lee, J. G., 2003, An experimental study for manufacturing MPCM slurry and its application to a cooling system, Korean Journal of Air-Conditioning and Refrigeration Engineering, Vol. 15, No.5, pp.352-359 |
3 | Lee, H., Jeong, Y., Shin, J., Baek, J., Kang, M. and Chun, K., 2004, Package embedded heat exchanger for stacked multi-chip module, Sensors and actuators, Vol. 114, pp. 204-21l DOI ScienceOn |
4 | Incropera, F. P., 1995, Liquid Cooling of Electronic Devices by Single-Phase Convection, Jone Willy & Sons, Inc |
5 | jeon, J., Kim, Y., Choi, J. M. and Heo, J, 2005, Experimental study on the performance of an air-cooling system for telecommunication equipment, Proceedings of the SAREK, 05-W-051, pp.323-328 |
6 | Kim, M. J. and Park, K. W., 2005, Heat transfer characteristics of micro-encapsulated phase change material slurry, Proceedings of the SAREK, 05-W-030, pp. 193-198 |
7 | Kim, W. T. and Kim, K. S., 1996, Forced convective cooling characteristics with stacked modules of multi-PCB's in telecommunication cabinet, Korean Journal of Air-Conditioning and Refrigeration Engineering, Vol. 8, No.2, pp.230-239 |