• ETRI Journal
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• 제27권2호
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• pp.133-139
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• 2005

A monolithic microwave integrated circuit (MMIC) chip set consisting of a power amplifier, a driver amplifier, and a frequency doubler has been developed for automotive radar systems at 77 GHz. The chip set was fabricated using a 0.15 ${\mu}$ gate-length InGaAs/InAlAs/GaAs metamorphic high electron mobility transistor (mHEMT) process based on a 4-inch substrate. The power amplifier demonstrated a measured small signal gain of over 20 dB from 76 to 77 GHz with 15.5 dBm output power. The chip size is 2mm${\times}$ 2mm. The driver amplifier exhibited a gain of 23 dB over a 76 to 77 GHz band with an output power of 13 dBm. The chip size is 2.1mm${\times}$ 2mm. The frequency doubler achieved an output power of -6 dBm at 76.5 GHz with a conversion gain of -16 dB for an input power of 10 dBm and a 38.25 GHz input frequency. The chip size is 1.2mm ${\times}$ 1.2mm. This MMIC chip set is suitable for the 77 GHz automotive radar systems and related applications in a W-band.

• JSTS:Journal of Semiconductor Technology and Science
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• 제3권1호
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• pp.47-54
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• 2003

New efficiency enhancement techniques have been devised and implemented to InGaP/GaAs HBT MMIC power amplifiers for W-CDMA mobile terminals applications. Two different types of bias current control circuits that select the efficient quiescent currents in accordance with the required output power levels are proposed for overall power efficiency improvement. A dual chain power amplifier with single matching network composed of two different parallel-connected power amplifier is also introduced. With these efficiency enhancement techniques, the implemented MMIC power amplifiers presents power added efficiency (PAE) more than 14.8 % and adjacent channel leakage ratio(ACLR) lower than -39 dBc at 20 dBm output power and PAE more than 39.4% and ACLR lower than -33 dBc at 28 dBm output power. The average power usage efficiency of the power amplifier is improved by a factor of more than 1.415 with the bias current control circuits and even up to a factor of 3 with the dual chain power amplifier.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 하계종합학술대회 논문집
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• pp.265-268
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• 1999

In this paper, a wideband MMIC distributed amplifier was designed using the fabricated PHEMT with the unit gate width of 80 ${\mu}{\textrm}{m}$ and 4 gate fingers at our Lab. S$_{21}$ gains are 7.1 ~ 10.0 ㏈. Input and output reflection coefficients obtained from the distributed amplifier in the frequency range of DC~25 ㎓ are lower then -8 ㏈. A chip size of the designed wideband MMIC distributed amplifier is 1.9 mm $\times$ 1.1 mm.

• 전기전자학회논문지
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• 제28권1호
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• pp.33-37
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• 2024

본 논문에서는 0.25 ㎛ 게이트 길이를 갖는 GaN HEMT 기술을 사용하여 개발한 X-대역 저잡음 증폭기 MMIC의 특성을 기술한다. 개발된 GaN 기반 X-대역 저잡음 증폭기 MMIC는 9 GHz ~ 10 GHz의 동작 주파수 대역에서 22.75 dB ~ 25.14 dB의 소신호 이득과 1.84 dB ~ 1.94 dB의 잡음지수 특성을 나타내었다. 입력 반사 손실 특성과 출력 반사 손실 특성은 각각 -11.36 dB ~ -24.49 dB, -11.11 dB ~ -17.68 dB를 얻었으며 40 dBm (10 W)의 입력 전력에 성능 열화 없이 정상적으로 동작하였다. MMIC의 크기는 3.67 mm × 1.15 mm이다. 개발된 GaN 기반 저잡음 증폭기 MMIC는 X-대역의 다양한 응용에 적용 가능하다.

• 한국전자파학회논문지
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• 제20권3호
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• pp.264-272
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• 2009

본 논문에서는 다수의 MMIC 전력증폭기 칩과 박막 기판을 결합하여 MIC 모듈을 구성함으로써 Ka-대역 중심주파수에서 10 W의 출력 전력을 낼 수 있는 전력증폭기 모듈을 설계 및 제작하였다. 전력증폭기 모듈의 제작에는 밀리미터파 대역에 적합한 수정된 형태의 윌킨슨 전력분배기/합성기를 사용하였고, 모듈의 구성 과정에서 발생할 수 있는 손실을 줄이고 공진을 억제하기 위해 CBFGCPW-Microstrip 천이 구조를 활용하였다 전력증폭기 모듈은 총 7개의 MMIC 칩으로 구성되었으며 MMIC 칩을 펄스 모드로 동작시키기 위해 칩의 게이트에 펄스 전압을 인가하는 게이트 전압 제어기가 설계되고 적용되었다. 제작된 전력증폭기 모듈의 측정 결과 58 dB의 전력 이득과 39.6 dBm의 포화 출력 전력을 얻을 수 있었다.

• 한국전자파학회:학술대회논문집
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• 한국전자파학회 2000년도 종합학술발표회 논문집 Vol.10 No.1
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• pp.197-201
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• 2000

In this paper, a MMIC(Monolithic Microwave Integrated Circuit) broadband drive amplifier for wireless communication system has designed using active feedback method. The MMIC brodband amplifier was designed using 0.5$\mu\textrm{m}$ MESFET of ETRI library. Simulation results show that gain is 22 dB, and gain flatness ${\pm}$1 dB. Maximum output power 15 dBm and noise figure 2.5 dB in bandwidth 500 MHz ～3.0 GHz. The MMIC Broadband amplifer's chip area is 14mm${\times}$1.4mm.

• 한국전자파학회논문지
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• 제26권7호
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• pp.620-626
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• 2015

본 논문에서는 2차 전역통과 필터를 이용하여 입력정합을 수행하고, LC 병렬공진 회로를 이용하여 트랜지스터의 출력 리액턴스를 최소화하는 기법을 적용함으로써 2~6 GHz에서 동작하는 광대역 GaN 전력증폭기 MMIC를 설계 및 제작하였다. 광대역 손실정합을 위해 사용된 2차 전역통과 필터는 트랜지스터의 채널 저항 효과를 보상하기 위해 비대칭적 구조를 사용하였다. Win Semiconductors사의 $0.25{\mu}m$ GaN HEMT 파운드리 공정으로 제작된 MMIC 칩은 크기가 $2.6mm{\times}1.3mm$이며, 주파수 대역 내에서 약 13 dB의 평탄한 이득 특성과 10 dB 이상의 우수한 입력정합 특성을 보였다. 포화출력 조건에서 측정된 출력전력은 2~6 GHz에서 38.6~39.8 dBm의 값을 보였고, 전력부가효율은 31.3~43.4 %을 나타내었다.

• 한국군사과학기술학회지
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• 제26권3호
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• pp.227-233
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• 2023

In this paper, to substitute the existing TWTA(Travailing Wave Tube Amplifier) component in small radar system, we developed the Ku band SSPA(Solid-State Power Amplifier) based on the fabrication of power MMIC (Monolithic Microwave Integrated Circuit) chips. For the development of the 500 W SSPA, the 40 W-grade power MMIC was designed by ADS(Advanced Design System) at Keysight company with UMS GH015 library, and was processed by UMS foundry service. And 70 W main power modules were achieved the 2-way T-junction combiner method by using the 40 W-grade power MMICs. Finally, the 500 W SSPA was fabricated by the wave guide type power divider between the drive power amplifier and power modules, and power combiner with same type between power modules and output port. The electrical properties of this SSPA had 504 W output power, -58.11 dBc spurious, 1.74 °/us phase variation, and -143 dBm/Hz noise level.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권2호
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• pp.125-131
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• 2002

This paper presents MMIC drive and power amplifiers covering 6-18 ㎓. For simple wideband impedance matching and less sensitivity to fabrication variation, modified distributed topologies are employed in the both amplifiers. Cascade amplifiers with a self-biasing circuit through feedback resistors are used as unit gain blocks in the drive amplifier, resulting in high gain, high stability, and compact chip size. Self impedance matching and high-pass, low-pass impedance matching networks are used in the power amplifier. In measured results, the drive amplifier showed good return losses ($S_11,{\;}S_{22}{\;}<{\;}-10.5{\;}dB$), gain flatness ($S_{21}={\;}16{\;}{\pm}0.6{\;}dB$), and $P_{1dB}{\;}>{\;}22{\;}dBm$ over 6-18 GHz. The power amplifier showed $P_{1dB}{\;}>{\;}28.8{\;}dBm$ and $P_{sat}{\;}{\approx}{\;}30.0{\;}dBm$ with good small signal characteristics ($S_{11}<-10{\;}dB,{\;}S_{22}{\;}<{\;}-6{\;}dB,{\;}and{\;}S_{21}={\;}18.5{\;}{\pm}{\;}1.25{\;}dB$) over 6-18 GHz.

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권2호
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• pp.139-142
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• 2008

An X-band MMIC power amplifier for radar application is developed using $0.25-{\mu}m$ gate length GaAs pHEMT technology. A bus-bar power combiner at output stage is used to minimize the combiner size and to simplify bias network. The fabricated power amplifier shows 38.75 dBm (7.5 Watt) Psat at 10 GHz. The chip size is $3.5\;mm{\times}3.9\;mm$.