• Title/Summary/Keyword: MFIs

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Microstructure and Electrical Properties of the Pt/Pb1.1Zr0.53Ti0.47O3/PbO/Si (MFIS) Using the PbO Buffer Layer (PbO 완충층을 이용한 Pt/Pb1.1Zr0.53Ti0.47O3/PbO/Si (MFIS)의 미세구조와 전기적 특성)

  • Park, Chul-Ho;Song, Kyoung-Hwan;Son, Young-Guk
    • Journal of the Korean Ceramic Society
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    • v.42 no.2 s.273
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    • pp.104-109
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    • 2005
  • To study the role of PbO as the buffer layer, Pt/PZT/PbO/Si with the MFIS structure was deposited on the p-type (100) Si substrate by the r.f. magnetron sputtering with $Pb_{1.1}Zr_{0.53}Ti_{0.47}O_3$ and PbO targets. When PbO buffer layer was inserted between the PZT thin film and the Si substrate, the crystallization of the PZT thin films was considerably improved and the processing temperature was lowered. From the result of an X-ray Photoelectron Spectroscopy (XPS) depth profile result, we could confirm that the substrate temperature for the layer of PbO affects the chemical states of the interface between the PbO buffer layer and the Si substrate, which results in the inter-diffusion of Pb. The MFIS with the PbO buffer layer show the improved electric properties including the high memory window and low leakage current density. In particular, the maximum value of the memory window is 2.0V under the applied voltage of 9V for the Pt/PZT(200 nm, $400^{\circ}C)/PbO(80 nm)/Si$ structures with the PbO buffer layer deposited at the substrate temperature of $300^{\circ}C$.

Effect of ${Y_2}{O_3}$Buffer Layer on the Characteristics of Pt/$YMnO_3$/$Y_2$$O_3$/Si(MFIS) Structure (Pt/$YMnO_3$/$Y_2$$O_3$/Si(MFIS) 구조의 특성에 미치는 ${Y_2}{O_3}$층의 영향)

  • Yang, Jeong-Hwan;Sin, Ung-Cheol;Choe, Gyu-Jeong;Choe, Yeong-Sim;Yun, Sun-Gil
    • Korean Journal of Materials Research
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    • v.10 no.4
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    • pp.270-275
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    • 2000
  • The Pt/YMnO$_3$/Y$_2$O$_3$/Si structure for metal/ferroelectric/insulator/semiconductor(MFIS)-FET was fabricated and effect of $Y_2$O$_3$layer on the properties of MFIS structure was investigated. The $Y_2$O$_3$ thin films on p-type Si(111) substrate deposited by Pulsed Laser Deposition were crystallized along (111) orientation irrespective of the deposition temperatures. Ferroelectric YMnO$_3$ thin films deposited directly on p-type Si (111) by MOCVD resulted in Mn deficient layer between Si and YMnO$_3$. However, YMnO$_3$ thin films having good quality and stoichiometric composition can be obtained by adopting $Y_2$O$_3$ buffer layer. The memory window of the $Y_2$O$_3$thin films with YMnO$_3$ film is greater than that of the YMnO$_3$ thin films without $Y_2$O$_3$ film after the annealing at 85$0^{\circ}C$ in vacuum ambient(100mtorr). The memory window is 1.3V at an applied voltage of 5V.

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Interest Rate Caps in Microfinance: Issues and Challenges

  • Mia, Md Aslam
    • The Journal of Industrial Distribution & Business
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    • v.8 no.3
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    • pp.19-22
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    • 2017
  • Purpose - To control exorbitant interest rates, implementation of an interest rate ceiling is a standard practice in microfinance. However, there are pros and cons of such market intervention. Hence, the aim of this short note is to highlight issues and challenges regarding the interest rate cap in microfinance, both from the perspective of clients and institutions. Research design, data, and methodology - While the nature of this short note is explanatory and descriptive, the research methodology used relevant data from the MixMarket and Microcredit Regulatory Authority (MRA) annual reports in Bangladesh. Results - We argue that an interest rate ceiling is detrimental both for the clients and microfinance institutions (MFIs). This market intervention substantially reduces the outreach of MFIs and clients are most likely to pay a higher price in the long-run. Additionally, an interest rate cap also puts severe pressure on new-born and high-cost MFIs to cope with the interest rate ceiling. Conclusions - Although market intervention may be necessary in the short-run, it should not be the ultimate solution to abate high interest in microfinance. Understanding the operational dynamics of MFIs, as well as promoting productivity, efficiency and competition could help to lower the interest rates.

Electrical Properties of Pt/$LiNbO_3$/AIN/Si(100) structures (Pt/$LiNbO_3$/AIN/Si(100) 구조의 전기적 특성)

  • 정순원;정상현;인용일;김광호
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.58-61
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    • 2001
  • Metal-insulator-semiconductor (MIS) C-V properties with high dielectric AIN thin films showed no hysteresis and good interface properties. The dielectric constant of the AIN film calculated from the capacitance at the accumulation region in the capacitance-voltage(C-V) characteristics was about 8. The C-V characteristics of MFIS capacitor showed a hysteresis loop due to the ferroelectric nature of the LiNbO$_3$ thin films. Typical dielectric constant value of LiNbO$_3$ film of MFIS device was about 23. The memory window width was about 1.2V at the gate voltage of $\pm$5 V ranges. Typical gate leakage current density of the MFIS structure was the order of 10$^{-9}$ A/cm$^2$ at the range of within $\pm$500 kV/cm. The ferroelectric capacitors showed no polarization degradation up to about 10$^{11}$ switching cycles when subjected to symmetric bipolar voltage pulse(peak-to-peak 8V, 50% duty cycle) in the 500kHz.

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Characterization of BLT/insulator/Si structure using $ZrO_2$ and $CeO_2$ insulator ($ZrO_2$$CeO_2$ 절연체를 이용한 BLT/절연체/Si 구조의 특성)

  • Lee, Jung-Mi;Kim, Kyoung-Tae;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05c
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    • pp.186-189
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    • 2003
  • The MFIS capacitors were fabricated using a metalorganic decomposition method. Thin layers of $ZrO_2$ and $CeO_2$ were deposited as a buffer layer on Si substrate and BLT thin films were used as a ferroelectric layer. The electrical and structural properties of the MFIS structure were investigated. X -ray diffraction was used to determine the phase of the BLT thin films and the quality of the $ZrO_2$ and $CeO_2$ layer. AES show no interdiffusion and the formation of amorphous $SiO_2$ layer is suppressed by using the $ZrO_2$ and $CeO_2$ film as buffer layer between the BLT film and Si substrate. The width of the memory window in the C-V curves for the $BLT/ZrO_2/Si$ and $BLT/CeO_2/Si$ structure is 2.94 V and 1.3V, respectively. The experimental results show that the BLT-based MFIS structure is suitable for non-volatile memory FETs with large memory window.

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Structural and electrical properties of MFISFET using a $Pt/Bi_{3.25}La_{0.75}Ti_3O_{12}/CeO_2/Si$ structure ($Pt/Bi_{3.25}La_{0.75}Ti_3O_{12}/CeO_2/Si$ 구조를 이용한 MFISFET의 구조 및 전기적 특성)

  • Kim, K.T.;Kim, C.I.;Lee, C.I.;Kim, T.A.
    • Proceedings of the KIEE Conference
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    • 2004.11a
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    • pp.183-186
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    • 2004
  • The metal-ferroelectric-insulator-semiconductor(MFIS) capacitors were fabricated using a metalorganic decomposition (MOD)method. The $CeO_2$ thin films were deposited as a buffer layer on Si substrate and $Bi_{3.25}La_{0.75}Ti_3O_{12}$ (BLT) thin films were used as a ferroelectric layer. The electrical and structural properties of the MFIS structure were investigated by varying the $CeO_2$ layer thickness. The width of the memory window in the capacitance-voltage (C-V)curves for the MFIS structure decreased with increasing thickness of the $CeO_2$ layer. Auger electron spectroscopy (AES) and transmission electron microscopy (TEM) show no interdiffusion by using the $CeO_2$ film as buffer layer between the BLT film and Si substrate. The experimental results show that the BLT-based MFIS structure is suitable for non-volatile memory field-effect-transistors (FETs) with large memory window.

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Fabrications and properties of MFIS capacitor using $LiNbO_3$/AIN structure ($LiNbO_3$/AIN 구조를 이용한 MFIS 커패시터의 제작 및 특성)

  • 이남열;정순원;김용성;김진규;정상현;김광호;유병곤;이원재;유인규
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.07a
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    • pp.743-746
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    • 2000
  • Metal-ferroelectric-insulator-semiconductor(MFIS) devices using Pt/$LiNbO_3$/Si structure were successfully fabricated. The dielectric constant of the AIN film calculated from the capacitance in the accumulation region in the capacitance-voltage(C-V) curve was about 8.2. The gate leakage current density of MIS devices using a aluminum electrode showed the least value of 1$\times$$1O^{-8}$A/$cm^2$ order at the electric field of 500kV/cm. The dielectric constant of $LiNbO_3$film on AIN/Si structure was about 23 derived from 1MHz capacitance-voltage (C-V) measurement and the resistivity of the film at the field of 500kV/cm was about 5.6$\times$ $1O^{13}$ $\Omega$.cm.

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Fintech in Microfinance: a new direction for Microfinance institutions in Vietnam

  • DANG, Thuy T.;VU, Huong Quynh
    • Asian Journal of Business Environment
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    • v.10 no.3
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    • pp.13-22
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    • 2020
  • Purpose: Vietnam's financial sector has grown substantially but microfinance institutions (MFIs) still face up many challenges in providing financial services to underserved customer segments, including small businesses, rural populations, and urban migrants. The recent worldwide explosion of fintech, including in Vietnam, promises to fill this gap. The purpose of this paper is to analyze fintech activities in microfinance sector and recommend for fintech adoption of MFIs in Vietnam. Research Design, Data and Methodology: The paper's data is mainly based on international organizations such as Asia Development Bank (ADB), Food and Agriculture Organization of the United Nations (FAO) and Vietnamese organizations such as Vietnam Microfinance Working Group. The authors suggest new directions for microfinance activities in Vietnam. Results: In recent years, the application of fintech in microfinance sector has brought many good results, such as improving the quality of products and services, easy access to many customer groups, and scaling up the operating model. Conclusion: MFIs in Vietnam have developed new products and services by applying fintech. The application of technology and digital solution has supported MFIs in Vietnam to gradually achieve targeted growth through expanding geographical inclusion/scale, enhancing product supply/provision, helping in-depth customer understanding as well as improving operational efficiency.

Fabrication and Characterization of MFIS-FET using Au/SBT/LZO/Si structure

  • Im, Jong-Hyun;Lee, Gwang-Geun;Kang, Hang-Sik;Jeon, Ho-Seung;Park, Byung-Eun;Kim, Chul-Ju
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.174-174
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    • 2008
  • Non-volatile memories using ferroelectric-gate field-effect transistors (Fe-FETs) with a metal/ferroelectric/semiconductor gate stack (MFS-FETs) make non-destructive read operation possible. In addition, they also have features such as high switching speed, non-volatility, radiation tolerance, and high density. However, the interface reaction between ferroelectric materials and Si substrates, i.e. generation of mobile ions and short retention, make it difficult to obtain a good ferroelectric/Si interface in an MFS-FET's gate. To overcome these difficulties, Fe-FETs with a metal/ferroelectric/insulator/semiconductor gate stack (MFIS-FETs) have been proposed, where insulator as a buffer layer is inserted between ferroelectric materials and Si substrates. We prepared $SrBi_2Ta_2O_9$ (SBT) film as a ferroelectric layer and $LaZrO_x$ (LZO) film as a buffer layer on p-type (100) silicon wafer for making the MFIS-FET devices. For definition of source and drain region, phosphosilicate glass (PSG) thin film was used as a doping source of phosphorus (P). Ultimately, the n-channel ferroelectric-gate FET using the SBT/LZO/Si Structure is fabricated. To examine the ferroelectric effect of the fabricated Fe-FETs, drain current ($I_d$) versus gate voltage ($V_g$) characteristics in logarithmic scale was measured. Also, drain current ($I_d$) versus drain voltage ($V_d$) characteristics of the fabricated SBT/LZO/Si MFIS-FETs was measured according to the gate voltage variation.

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