• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.1047-1050
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• 2000

As the progress of new industrial products or parts technology, the precise and fine machining technologies are needed more and more. Micro fabrication technology of these products are usally consisted of mechanical machining or MEMS technology. Direct machining by mechanical method is not applicable to mass production. MEMS technology also has several problems such as low mechanical strength, bad surface roughness and difficulty of 3 dimensional machining. In this study, we introduce several micro fabrication technology to make micro molds and dies and our project to develop these machining technology.

• 센서학회지
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• 제20권1호
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• pp.40-45
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• 2011

Microcantilevers have been actively used in probe-based microscopy and gravimetric sensing for biological or chemical analytes. To integrate actuation or detection schemes in the structure, typical fabrication processes include several photolithographic steps along with conventional MEMS fabrication. In this paper, a simple and straightforward way to fabricate and operate silicon microcantilever mass sensors is presented. The fabricated microcantilever sensors which can be electrostatically actuated require only two photolithographic steps. Resonant characteristics of fabricated microcantilevers are measured with a custom optical-lever and results show size-dependent quality factors. Using a $40\;{\mu}m$ long, $7\;{\mu}m$ wide, and $3\;{\mu}m$ thick cantilever, we achieved subfemtogram mass resolution in a 1 Hz bandwidth.

• 한국가시화정보학회지
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• 제7권2호
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• pp.17-21
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• 2010

This paper presents the fabrication and performance measurement of a temperature sensor array on a flexible substrate attachable to a curved surface using MEMS technology. Specifically, the fabrication uses the well-developed printed circuit board fabrication technology for complex electrode definition. The temperature sensor array are lifted off with a $10{\times}10$ matrix in a $50\;mm{\times}50\;mm$ to visualize temperature distribution. Copper is used as temperature sensing material to measure the change in resistances with temperature increase. In a thermal oven with temperature control, the temperature sensor array is Characterized. The constant slope of resistance change is obtained and temperature distribution is measured from the relationship between resistance and temperature.

• JSTS:Journal of Semiconductor Technology and Science
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• 제5권1호
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• pp.38-44
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• 2005

Pyrolyzed polyimide is explored in terms of MEMS material. This paper describes chemical, electrical, mechanical properties of pyrolyzed polyimide (PIX-1400) thin film as MEMS material. When polyimide thin film was pyrolyzed at $800^{\circ}C$ for 60 minutes in $N_{2}$ ambient, the residual ratio of pyrolyzed film thickness measured with a surface profiler is about 49 %, and the resistivity is about $2.17{\times}10^{-2}\;{Omega}cm$. From the result of the load-deflection test, the estimated Young's modulus and initial average stress of pyrolyzed polyimide are 67 GPa and 30 MPa, respectively. As one demonstration of MEMS structures of pyrolyzed polyimide, the fabrication method of the microbridge structure is proposed for a micro heater and a resonator.

• 센서학회지
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• 제26권2호
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• pp.91-95
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• 2017

Recently, infrared (IR) spectrometers have been required in various fields such as environment, safety, mobile, automotive, and military. This IR dispersive sensor detection method of substances is widely used. In this study, we fabricated a silicon (Si) prism-based near infrared (NIR) spectrometer utilizing micro electro mechanical system (MEMS) technology. Si prism-based NIR spectrometer utilizing MEMS technology consists of upper, middle, and lower substrates. The upper substrate passes through the incident IR ray selectively. The middle substrate, acting as a prism, disperses and separates the incident IR beam. The lower substrate has an amorphous Si (a-Si)-based bolometer array to detect the IR spectrum. The fabricated Si prism-based NIR spectrometer utilizing MEMS technology has the advantage of a simple structure, easy fabrication steps, and a wide NIR region operating range.

• 제어로봇시스템학회논문지
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• 제14권4호
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• pp.361-364
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• 2008

Tips of probe card were fabricated using MEMS technology. P-type silicon wafer with $SiO_2$ layer was used as a substrate for fabricating the probe card. Ni-Cr and Au used as seed layer for electroplating Ni were deposited on the silicon wafer. Line patterns for probing devices were formed on silicon wafer by electroplating Ni through mold which formed by MEMS technology. Bridge structure was formed by wet-etching the silicon substrate. AZ-1512 photoresist was used for protection layer of back side and DNB-H100PL-40 photoresist was used for patterning of the front side. The mold with the thickness of $60{\mu}m$ was also formed using THB-120N photoresist and probe tip with thickness of $50{\mu}m$ was fabricated by electroplating process.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권2호
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• pp.102-110
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• 2002

In this paper, we present the fabrication of tunable capacitors and 3-dimensional inductors. This work was related to fabricated 3-dimensional device for need of micro device in developing new intelligence age. This device was fabricated by electroplating used electroplating PR and high-vacuum evaporation of metal. Fabricated micro-inductor is consisted of air-bridge on electroplating rod and electroplated core. Micro-capacitor is consisted of thin metal membrane and electroplated core. Electroplating material is used Cu metal solvent. Air-gap between metal-layers function as almost perfect isolation layer. The most advantage of our micro-inductor and micro-capacitor compared to present device is a possibility that can fabricate on RF MEMS(microelectro-mechanical systems) application with high performance and various function. In this paper, we present the fabrication of tunable capacitors and 3-dimensional inductors. This work was related to fabricated 3-dimensional device for need of micro-device in developing new intelligence age. This device was fabricated by electroplating used electroplating PR and high-vacuum evaporation of metal. Fabricated micro-inductor is consisted of air-bridge on electroplating rod and electroplated core. Micro-capacitor is consisted of thin metal membrane and electroplated core. Electroplating material is used Cu metal solvent. Air-gap between metal-layers function as almost perfect isolation layer. The most advantage of our micro-inductor and micro-capacitor compared to present device is a possibility that can fabricate on RF MEMS application with high performance and various functions.

• 대한전자공학회논문지TC
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• 제39권11호
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• pp.40-46
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• 2002

본 논문에서는 CPW MMIC 실장시 발생되는 기생 공진 현상을 제거하기 위한 새로운 구조의 실리콘 MEMS 패키지를 제안하였다. 또한 세 가지 형태의 실리콘 칩 캐리어(gold-plated high resistivity, lightly doped, high resistivity) 상에 GaAs CPW 패턴을 제작하고 해석/측정함으로써, 제안된 패키지의 성능을 확인하였다. 해석 및 측정 결과 제안된 MEMS 패키지는 비저항이(resistivity) 15 ${\Omega}{\cdot}$㎝인 실리콘 캐리어(carrier)를 사용함으로써 기생 공진 현상을 효과적으로 억제시킬 수 있었다.

• Journal of Advanced Marine Engineering and Technology
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• 제29권5호
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• pp.482-487
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• 2005

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.601-602
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• 2013