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http://dx.doi.org/10.5407/JKSV.2010.7.2.017

Fabrication and Performance Evaluation of Temperature Sensor Matrix Using a Flexible Printed Circuit Board for the Visualization of Temperature Field  

Ahn, Cheol-Hee (School of Mechanical Engineering Pusan National University)
Kim, Hyung-Hoon (School of Mechanical Engineering Pusan National University)
Cha, Je-Myung (School of Mechanical Engineering Pusan National University)
Kwon, Bong-Hyun (School of Mechanical Engineering Pusan National University)
Ha, Man-Yeong (School of Mechanical Engineering Pusan National University)
Park, Sang-Hu (School of Mechanical Engineering Pusan National University)
Jeong, Ji-Hwan (School of Mechanical Engineering Pusan National University)
Kim, Kui-Soon (Department of Aerospace Engineering Pusan National University)
Cho, Jong-Rae (Division of Mechanical and Information Engineering Korea Maritime University)
Son, Chang-Min (Rolls-Royce International limited)
Lee, Jung-Ho (Korea Institute of Machinery and Materials)
Go, Jeung-Sang (School of Mechanical Engineering Pusan National University)
Publication Information
Journal of the Korean Society of Visualization / v.7, no.2, 2010 , pp. 17-21 More about this Journal
Abstract
This paper presents the fabrication and performance measurement of a temperature sensor array on a flexible substrate attachable to a curved surface using MEMS technology. Specifically, the fabrication uses the well-developed printed circuit board fabrication technology for complex electrode definition. The temperature sensor array are lifted off with a $10{\times}10$ matrix in a $50\;mm{\times}50\;mm$ to visualize temperature distribution. Copper is used as temperature sensing material to measure the change in resistances with temperature increase. In a thermal oven with temperature control, the temperature sensor array is Characterized. The constant slope of resistance change is obtained and temperature distribution is measured from the relationship between resistance and temperature.
Keywords
Temperature Sensor Array; Flexible Printed Circuit Board; Resistance Temperature Detector; MEMS Fabrication Process;
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