Fabrication and Performance Evaluation of Temperature Sensor Matrix Using a Flexible Printed Circuit Board for the Visualization of Temperature Field
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Ahn, Cheol-Hee
(School of Mechanical Engineering Pusan National University)
Kim, Hyung-Hoon (School of Mechanical Engineering Pusan National University) Cha, Je-Myung (School of Mechanical Engineering Pusan National University) Kwon, Bong-Hyun (School of Mechanical Engineering Pusan National University) Ha, Man-Yeong (School of Mechanical Engineering Pusan National University) Park, Sang-Hu (School of Mechanical Engineering Pusan National University) Jeong, Ji-Hwan (School of Mechanical Engineering Pusan National University) Kim, Kui-Soon (Department of Aerospace Engineering Pusan National University) Cho, Jong-Rae (Division of Mechanical and Information Engineering Korea Maritime University) Son, Chang-Min (Rolls-Royce International limited) Lee, Jung-Ho (Korea Institute of Machinery and Materials) Go, Jeung-Sang (School of Mechanical Engineering Pusan National University) |
1 | S.Y. Xiao, L.F. Che, X.X. Li, Y.L. Wang, 2007, "A novel fabrication process of MEMS devices on polyimide flexible substrates," Microelectronic Engineering, Vol.85, pp. 452-457 DOI ScienceOn |
2 | Fukang Jiang, Gwo-Bn Lee, Yu-Chong Tai, Chih-Ming Ho, 1999, "A flexible micromachine-based shear-stress sensor array and its application to separation-point detection," Sensors and Actuators, Vol.79, pp. 194-203 |
3 | Kui Liu, Wei-zheng Yuan, Jin-jun Deng, Bing-he Ma, Cheng-yu Jiang, 2007, "Detection of the boundary-layer separation point based on the flexible sensor arrays," Microsystem Technology, Vol.14, pp. 1-6 DOI ScienceOn |
4 | Bonnie T. Chia, Duo-Ru Chang, Hsin-Hung Liao, Yao-Joe Yang, Wen-Pin Shih, Fu-Yu Chang, Kuang-Chao Fan, 2007, "Temperature Sensor Array Using Flexible Substrate," IEEE 20th International Conference , pp.589-592 |
5 | Takao Someya, Tsuyoshi Sekitani, Shingo Iba, Yusaku Kato, Hiroshi Kawaguchi, Takayasu Sakurai, 2004, "A large-area, flexible pressure sensor matrix with organic field-effect transistors for artificial skin applications," Proceedings of National Academy of Sciences of the United States of America, Vol. 101, No. 27, pp.9966-9970 DOI ScienceOn |
6 | Ogam technology, www.ogamtech.com |
7 | Frank P. Incropera, David P. DeWitt, 2001, "Introduction of the heat transfer 4th Edition," John Wiley & Sons Inc, pp.370-406 |
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