• Transactions of Materials Processing
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• v.13 no.3
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• pp.242-247
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• 2004

Literature review on reliability test method for developing high performance optical/thermofluidic components. Since the miniaturization by the conventional mechanical process is limited to milli-structure, i.e. $10^{-3}m$, new technology for fabricating of mechanical components is needed to match cost, reliability, and integrability criteria of micro-structure. Although numbers of various researches on MEMS/MOEMS devices and components, including material characterization, design and optimization, system validation, etc., the lack of standards and specifications make the researches and developments difficult. For that reason, this paper is intended to propose the methods of reliability test for measuring the mechanical property of optical/ thermofluidic components.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.3
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• pp.367-374
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• 2016

This paper presents an electro-thermal modeling of an amorphous silicon (a-Si) uncooled microbolometer. This modeling provides a comprehensive solution for simulating the electro-thermal characteristics of the fabricated microbolometer and enables electro-thermal co-simulation between MEMS and CMOS integrated circuits. To validate this model, three types of uncooled microbolometers were fabricated using a post-CMOS surface micromachining process. The simulation results show a maximum discrepancy of 2.6% relative to the experimental results.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2003.05a
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• pp.147-150
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• 2003

The purpose of this research was to develope components of micro solid propellant thruster. Micro solid propellant thruster had four basic components: combustion chamber, nozzle, solid propellant and micro heater for ignition. A performance of micro heater and characteristic of solid propellant was investigated. Micro heater was fabricated by conventional MEMS process and Platinum layer was used for heating element. Effect of geometry parameters on micro heater was tested. The temperature responses of heater with respect to each parameters was compared for a given electrical power. The characteristic of solid propellant(HTPB/AP) was investigated to obtain burning velocity in small chamber. Additionally, a capacity of filling propellant with high viscosity in small chamber was checked to guarantee for the micro fabrication.

• ETRI Journal
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• v.35 no.4
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• pp.603-609
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• 2013

In this paper, we present a 600-V reverse conducting insulated gate bipolar transistor (RC-IGBT) for soft and hard switching applications, such as general purpose inverters. The newly developed RC-IGBT uses the deep reactive-ion etching trench technology without the thin wafer process technology. Therefore, a freewheeling diode (FWD) is monolithically integrated in an IGBT chip. The proposed RC-IGBT operates as an IGBT in forward conducting mode and as an FWD in reverse conducting mode. Also, to avoid the destructive failure of the gate oxide under the surge current and abnormal conditions, a protective Zener diode is successfully integrated in the gate electrode without compromising the operation performance of the IGBT.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.2
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• pp.23-34
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• 2013

Over the past several decades in the microelectronics industry, devices have gotten smaller, thinner, and lighter, without any accompanying degradation in quality, performance, and reliability. One permanent and deniable trend in packaging as well as wafer fabrication industry is system integration. The proliferating options for system integration, recently, are driving change across the overall semiconductor industry, requiring more investment in developing, ramping and supporting new die-, wafer- and board-level solution. The trend toward 3D system integration and miniaturization in a small form factor has accelerated even more with the introduction of smartphones and tablets. In this paper, the key issues and state of the art for system integration in the packaging process are introduced, especially, focusing on ease transition to next generation packaging technologies like through silicon via (TSV), 3D wafer-level fan-out (WLFO), and chip-on-chip interconnection. In addition, effective solutions like fine pitch copper pillar and MEMS packaing of both advanced and legacy products are described with several examples.

• Journal of Mechanical Science and Technology
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• v.20 no.10
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• pp.1646-1652
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• 2006

A model of mechanical behavior of microcantilever due to intrinsic strain during deposition of MEMS structures is derived. A linear ordinary differential equation is derived for the beam deflection as a function of the thickness of the deposited layer. Closed-form solutions are not possible, but numerical solutions are plotted for various dimensionless ratios of the beam stiffness, the intrinsic strain, and the elastic moduli of the substrate and deposited layer. This model predicts the deflection of the cantilever as a function of the deposited layer thickness and the residual stress distribution during deposition. The usefulness of these equations is that they are indicative of the real time behavior of the structures, i.e. it predicts the deflection of the beam continuously during deposition process.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.10
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• pp.1936-1941
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• 2009

This paper deals with a new methodology for topology optimization in which the topology of the design domain may change during the shape optimization process. To achieve this, the concept of the topological gradient is introduced to compute the sensitivity of an objective function when a small hole is drilled in the domain. Based on shape and topological sensitivity values, the shape and topology of the design domain may be simultaneously changed during design iterations if necessary. To verify the advantages and also to facilitate understanding of the method itself, two electrostatic design problems have been tested by using 2D finite element analysis: the first is the inverse problem of a simple dielectric model and the second is the rotor design of a MEMS actuator.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1414-1415
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• 2006

Air-gap type film bulk acoustic wave resonator device using ZnO for piezoelectric layer and sacrifice layer, deposited by RF magnetron sputter with various conditions, fabricated in this study. Also, membrane$(SiO_2)$ and top and bottom electrode(both Al) of piezoelectric layer deposited by RF magnetron sputter. Using micro electro mechanical systems(MEMS) technique, sacrifice layer removed and then air-gap formed. The results of each process checked by XRD, AFM, SEM to obtain good quality device.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.2
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• pp.89-92
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• 2010

A bolometer sensor used in an infrared thermal imaging system has many advantages on the process because it does not need a separate cooling system and its manufacturing is easy. However the sensitivity of the bolometer is low and the fixed pattern noise(FPN) is large, because the bolometer sensor is made by micro electro mechanical systems (MEMS). These problems can be fixed-by using the high performance readout integrated circuit(ROIC) with noise reduction techniques. In this paper, we propose differential delta sampling circuit to remove the mismatch noise of ROIC itself, the FPN of the bolometer. And for reduction of FPN noise, the reference signal compensation circuit which compensate the reference signal by using on-resistance of MOS transistor was proposed.

• Journal of Electrical Engineering and Technology
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• v.7 no.2
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• pp.212-220
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• 2012

In the current paper, the optimization shape of a polysilicon variable-capacitance micromotor (VCM) was determined using the seeker optimization algorithm (SOA). The optimum goal of the algorithm was to find the maximum torque value and minimum ripple torque by varying the geometrical parameters. The optimization process was performed using a combination of SOA and the finite-element method (FEM). The fitness value was calculated via FEM analysis using COMSOL3.4, and SOA was realized by MATLAB7.4. The proposed method was applied to a VCM with eight and six poles at the stator and rotor, respectively. For comparison, this optimization was also performed using the genetic algorithm. The results show that the optimized micromotor using SOA had a higher torque value and lower torque ripple, indicating the validity of this methodology for VCM design.