[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.5573/JSTS.2016.16.3.367

Electro-Thermal Modeling and Experimental Validation of Integrated Microbolometer with ROIC

Kim, Gyungtae (Department of Electronics, Chungnam National University)
Kim, Taehyun (National Nanofab Center)
Kim, Hee Yeoun (National Nanofab Center)
Park, Yunjong (Department of Electronics, Chungnam National University)
Ko, Hyoungho (Department of Electronics, Chungnam National University)

Publication Information

JSTS:Journal of Semiconductor Technology and Science / v.16, no.3, 2016 , pp. 367-374 More about this Journal

Abstract

This paper presents an electro-thermal modeling of an amorphous silicon (a-Si) uncooled microbolometer. This modeling provides a comprehensive solution for simulating the electro-thermal characteristics of the fabricated microbolometer and enables electro-thermal co-simulation between MEMS and CMOS integrated circuits. To validate this model, three types of uncooled microbolometers were fabricated using a post-CMOS surface micromachining process. The simulation results show a maximum discrepancy of 2.6% relative to the experimental results.

Keywords

Microbolometer; infrared (IR) sensor; electro-thermal modeling;

Citations & Related Records

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