• Journal of information and communication convergence engineering
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• v.15 no.4
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• pp.232-236
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• 2017

A digital vacuum pressure sensor is designed, fabricated, and characterized using a packaged MEMS analog Pirani gauge. The packaged MEMS analog Pirani gauge requires a current source to heat up a heater in the Pirani gauge. To investigate the feasibility of digitization for the analog Pirani gauge, its implementation is performed with a zero-temperature coefficient current source and microcontroller that are commercially available. The measurement results using the digital vacuum pressure sensor showed that its operating range is 0.05-760 Torr, which is the same as the measurement results of the packaged MEMS analog pressure sensor. The results confirm that it is feasible to integrate the analog Pirani gauge with a commercially available current source and microcontroller. The successful hybrid integration of the analog Pirani gauge and digital circuits is an encouraging result for monolithic integration with a precision current source and ADCs in the state of CMOS dies.

• Transactions on Electrical and Electronic Materials
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• v.7 no.4
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• pp.184-188
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• 2006

This work describes efforts in the fabrication and testing of robust microelectromechanical systems (MEMS). Robustness is typically achieved by investigating non-silicon substrates and materials for MEMS fabrication. Some of the traditional MEMS fabrication techniques are applicable to robust MEMS, while other techniques are drawn from other technology areas, such as electronic packaging. The fabrication technologies appropriate for robust MEMS are illustrated through laminated polymer membrane based pressure sensor arrays. Each array uses a stainless steel substrate, a laminated polymer film as a suspended movable plate, and a fixed, surface micromachined back electrode of electroplated nickel. Over an applied pressure range from 0 to 34 kPa, the net capacitance change was approximately 0.14 pF. An important attribute of this design is that only the steel substrate and the pressure sensor inlet is exposed to the flow; i.e., the sensor is self-packaged.

• Journal of Mechanical Science and Technology
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• v.20 no.4
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• pp.505-512
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• 2006

This paper presents an integrated multifunctional sensor based on MEMS technology, which can be used or embedded in mobile devices for environmental monitoring. An absolute pressure sensor, a temperature sensor and a humidity sensor are integrated in one silicon chip of which the size is $5mm\times5mm$. The pressure sensor uses a bulk-micromachined diaphragm structure with the piezoresistors. For temperature sensing, a silicon temperature sensor based on the spreading-resistance principle is designed and fabricated. The humidity sensor is a capacitive humidity sensor which has the polyimide film and interdigitated capacitance electrodes. The different piezoresistive orientation is used for the pressure and temperature sensor to avoid the interference between sensors. Each sensor shows good sensor characteristics except for the humidity sensor. However, the linearity and hysteresis of the humidity sensor can be improved by selecting the proper polymer materials and structures.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.51-56
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• 2017

In this paper, we have developed a differential pressure flow sensor designed as a single capacitive type. And the sensor was fabricated using a MEMS process. Differential pressure flow sensors are the most commonly used sensors for industrial applications. The sensing diaphragm and bonding joint of the MEMS pressure sensor are easily broken at high pressure. In this paper, we proposed a structure in which the diaphragm of the sensor was not broken at a pressure exceeding the proof pressure, and the differential pressure sensor was designed and manufactured accordingly. The operating characteristics of the sensor were evaluated at a pressure three times higher than the sensor operating pressure (0-3 bar). The developed sensor was $3.0{\times}3.0mm$ and measured with a LCR meter (HP 4284a) at a pressure between 0 and 3 bar. It showed 3.67 pF at 0 bar and 5.13 pF at 3 bar. The sensor operating pressure (0-3 bar) developed a pressure sensor with hysteresis of 0.37%.

• Journal of Sensor Science and Technology
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• v.14 no.4
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• pp.265-271
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• 2005

In this study, a variable capacitive pressure sensor is fabricated for TPMS (Tire Pressure Monitoring System). This study is for developing sensors which consecutively measure the tire pressure given as 30 psi from the industrial standard. For improving non-linearity of the prior capacitive pressure sensors, it is suggested that touch mode capacitive pressure sensor be applied. In addition, initial capacitance is designed as small as possible for the conformity to the wireless sensor. ANSYS, commercial FEA package, is used for designing and simulating the sensor. The device is progressed by MEMS (Micro Electro Mechanical Systems) fabrication and packaged with PDMS. The result is obtained sensitivity, 1 pF/psi, through a pressure test. The simulation result is discrepant from experiment one. Wafer's uniformity is presumed as the main reason of discrepancy.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.11
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• pp.1-8
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• 2005

In this paper, we present design and prototyping of a low-cost, integrated multi-functional micro health sensor chip that can be used or embedded in widely consumer devices, such as cell phone and PDA, for monitoring environmental condition including air pressure, temperature and humidity. This research's scope includes basic individual sensor study, architecture for integrating sensors on a chip, fabrication process compatibility and test/evaluation of prototype sensors. The results show that the integrated TPH sensor has good characteristics of ${\pm}\;1\%FS$ of linearity and hysteresis for pressure sensor and temperature sensor and of ${\pm}\;5\%FS$ of linearity and hysteresis But if we use 3rd order approximation for humidity sensor, full scale error becomes much smaller and this will be one of our future study.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.5
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• pp.350-354
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• 2020

In this study, a pressure sensor for each displacement was fabricated based on the silicon-based pressure sensor obtained through simulation results. Wires were bonded to the pressure sensor, and a piezoresistive pressure sensor was inserted into the printed circuit board (PCB) base by directly connecting a micro-electro-mechanical system (MEMS) sensor and a readout integrated circuit (ROIC) for signal processing. In addition, to prevent exposure, a non-conductive liquid silicone was injected into the sensor and the entire ROIC using a pipette. The packaging proceeded to block from the outside. Performing such packaging, comparing simple contact with strong contact, and confirming that the measured pulse wavelength appears accurately.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.511-512
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• 2012

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.4
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• pp.905-912
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• 2011

Interaocular pressure (IOP) sensor and external coil to detect the resonance frequency of the IOP sensor are designed and implemented using MEMS technology. The IOP sensor is designed using 3-D electromagnetic (EM) simulation. The resonance frequency of IOP sensor needs to be lower than that of the external coil. Additionally, the resonance frequency of the IOP sensor needs to be located near the resonance frequency of the coil to get the sufficient amplitude of phase variation. The frequency where the phase peak appears must be constant according to the distance between the IOP sensor and the external coil. From the measurement results, we demonstrated that the designed IOP sensor has the same resonance frequency with various distances between the IOP sensor and the coil.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.36 no.10
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• pp.1017-1025
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• 2008

The air data system(ADS) was developed for unmanned aerial vehicle(UAV) in this paper. Generally, the ADS helps flight control computer(FCC) to control the UAV above the stall speed and to hold the given altitude. The accurate measurement of airspeed and altitude of UAV is important because it indicates a flight performance and assures a safe flight. The ADS consists of MEMS pressure sensors, a lowpass filter, a micro controller unit and a pitot-tube. The ADS errors were reduced by pressure and temperature compensation of MEMS sensors. Finally, the altitude and airspeed data of the ADS was compared with GPS data in the flight test.