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http://dx.doi.org/10.4313/JKEM.2020.33.5.350

The Electric Control Method on the Packaging Technology for Non-Conductive Materials Using the Surface Processing Cavity Pressure Sensor  

Lee, Sun-Jong (Department of Semiconductor and Electrical System, Semiconductor Convergence Campus of KOREA PolyTechnic)
Woo, Jong-Chang (Department of Semiconductor Process Equipment, Semiconductor Convergence Campus of KOREA PolyTechnic)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.33, no.5, 2020 , pp. 350-354 More about this Journal
Abstract
In this study, a pressure sensor for each displacement was fabricated based on the silicon-based pressure sensor obtained through simulation results. Wires were bonded to the pressure sensor, and a piezoresistive pressure sensor was inserted into the printed circuit board (PCB) base by directly connecting a micro-electro-mechanical system (MEMS) sensor and a readout integrated circuit (ROIC) for signal processing. In addition, to prevent exposure, a non-conductive liquid silicone was injected into the sensor and the entire ROIC using a pipette. The packaging proceeded to block from the outside. Performing such packaging, comparing simple contact with strong contact, and confirming that the measured pulse wavelength appears accurately.
Keywords
Piezoresistive; Pressure; Sensor; Packaging; MEMS;
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Times Cited By KSCI : 2  (Citation Analysis)
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