• The Journal of Korea Robotics Society
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• v.8 no.1
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• pp.29-36
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• 2013

This paper presents a sensitivity optimization of a MEMS (microelectromechanical systems) gyroscope for a magnet-gyro system. The magnet-gyro system, which is a guidance system for a AGV (automatic or automated guided vehicle), uses a magnet positioning system and a yaw gyroscope. The magnet positioning system measures magnetism of a cylindrical magnet embedded on the floor, and AGV is guided by the motion direction angle calculated with the measured magnetism. If the magnet positioning system does not measure the magnetism, the AGV is guided by using angular velocity measured with the gyroscope. The gyroscope used for the magnet-gyro system is usually MEMS type. Because the MEMS gyroscope is made from the process technology in semiconductor device fabrication, it has small size, low-power and low price. However, the MEMS gyroscope has drift phenomenon caused by noise and calculation error. Precision ADC (analog to digital converter) and accurate sensitivity are needed to minimize the drift phenomenon. Therefore, this paper proposes the method of the sensitivity optimization of the MEMS gyroscope using DEAS (dynamic encoding algorithm for searches). For experiment, we used the AGV mounted with a laser navigation system which is able to measure accurate position of the AGV and compared result by the sensitivity value calculated by the proposed method with result by the sensitivity in specification of the MEMS gyroscope. In experimental results, we verified that the sensitivity value through the proposed method can calculate more accurate motion direction angle of the AGV.

• Journal of Sensor Science and Technology
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• v.27 no.3
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• pp.170-174
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• 2018

In this paper, the $TiO_2$/glucose oxidase (GOD) mixture has synthesized through simple and low-cost fabrication methods. The physical properties of the mixture were proved using an FT-IR/NIR spectrometer, an X-Ray diffractometer, and a Raman spectrometer. GOD maintained its bioactivity during all fabrication process. The current characteristics of the glucose biosensor were proportional to the glucose concentration and effective surface area of square pyramid on a silicon substrate. The maximum current change was measured in a pH 7.0 buffer solution. The simple and low-cost fabrication process and surface treatment can be used widely in previous research for improvements in effective surface area.

• Tribology and Lubricants
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• v.33 no.6
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• pp.282-287
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• 2017

SU-8 is an epoxy-type photoresist widely used for the fabrication of high-aspect-ratio (HAR) micro-structures in micro-electro-mechanical systems (MEMS). To fabricate highly integrated structures, chemical mechanical polishing (CMP) has emerged as the preferred manufacturing process for planarizing the MEMS structure. In SU-8 CMP, an oxidizer decomposes organic impurities and particles in the CMP slurry remove the chemically reacted surface of SU-8. To fabricate HAR microstructures using the CMP process, the adhesion between SU-8 and substrate material is important to avoid the delamination of the SU-8 film caused by the mechanical-dominant material removal characteristic. In this study, the friction force during the CMP process is measured with a CMP monitoring system to detect the delamination phenomenon and investigate the delamination of the SU-8 film from the silicon substrate under various pressure conditions. The increase in applied pressure causes an increase in the frictional force and wafer-edge stress concentration. The frictional force measurement shows that the friction force changes according to the delamination phenomenon of the SU-8 film, and that it is possible to monitor the delamination phenomenon during the SU-8 CMP process. The delamination at a high applied pressure is explained by the effect of stress distribution and pad deformation. Consequently, it is necessary to control the pressure of polishing, which can avoid the delamination in SU-8 CMP.

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.2
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• pp.121-127
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• 2008

This paper presents design and fabrication of optimized geometry structure of electrostatic inkjet head. In order to verify effect of geometry shape, we simulate electric field intensity according to the head structure. The electric field strength increases linearly with increasing height of the micro nozzle. As the nozzle diameter decreases, the electric field along the periphery of the meniscus can be more concentrated. We design and fabricate the electrostatic inkjet heads, hole type and pole type, with optimized structure. It was fabricated using thick-thermal oxidation and silicon micromachining technique such as the deep reactive ion etching (DRIE) and chemical wet etching process. It is verified experimentally that the use of the MEMS inkjet head allows a stable and sustainable micro-dripping mode of droplet ejection. A stable micro dripping mode of ejection is observed under the voltages 2.5 kV and droplet diameter is $10\;{\mu}m$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1522-1526
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• 2005

In this study, the fabrication of large area silicon mirror is accomplished by anisotropic etching using MEMS for implementation of integrated optical pickup and the process condition is also established for improving the mirror surface roughness. Until now, few results have been reported about the production of highly stepped $9.74^{\circ}$ off-axis-cut silicon wafer using wet etching. In addition rough surface of the mirror is achieved in case of long etching time. Hence a novel method called magnetorheolocal finishing is introduced to enhancing the surface quality of the mirror plane. Finally, areal peak to valley surface roughness of mirror plane is reduced about 100nm in large area of $mm^2$ and it is applicable to optical pickup using infrared wavelength.

• Korean Chemical Engineering Research
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• v.44 no.5
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• pp.513-519
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• 2006

We developed two kinds of the microchip for application to electrophoresis based on both glass and quartz employing the MEMS fabrications. The poly-Si layer deposited onto the bonding interface apart from channel regions can play a role as the optical slit cutting off the stray light in order to concentrate the UV ray, from which it is possible to improve the signal-to-noise (S/N) ratio of the detection on a chip. In the glass chip, the deposited poly-Si layer had an important function of the etch mask and provided the bonding surface properly enabling the anodic bonding. The glass wafer including more impurities than quartz one results in the higher surface roughness of the channel wall, which affects subsequently on the microflow behavior of the sample solutions. In order to solve this problem, we prepared here the mixed etchant consisting HF and $NH_4F$ solutions, by which the surface roughness was reduced. Both the shape and the dimension of each channel were observed, and the electroosmotic flow velocities were measured as 0.5 mm/s for quartz and 0.36 mm/s for glass channel by implementing the microchip electrophoresis. Applying the optical slit with poly-Si layer provides that the S/N ratio of the peak is increased as ca. 2 times for quartz chip and ca. 3 times for glass chip. The maximum UV absorbance is also enhanced with ca. 1.6 and 1.7 times, respectively.

• Proceedings of the SAREK Conference
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• 2008.11a
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• pp.170-174
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• 2008

Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of slimness of the devices, so it is not easy to find the optimal thermal management technology for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint. In the present study, the silicon and metal flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. Through the experimental study, the normal isothermal characteristic by vapor-liquid phase change was confirmed and the cooling device with 70mm of total length showed 6.8W of the heat transfer rate within the range of $4{\sim}5^{\circ}C$/W of thermal resistance. In the meantime, the metal cooling device was developed for commercialization. The device was designed to have all structures of evaporator, vapor flow path, liquid flow path and condenser in one plate. And an envelope of that could be completed by combining the two plates of same structure and size. And the simplicity of fabrication process and reduction of manufacturing cost could be accomplished by using the stamping technology for fabricating large flow paths relatively. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of that.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.33 no.10
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• pp.803-810
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• 2009

Micromirrors have a wide range of applications such as optical switches, laser scanners, and digital projection displays. Due to their low performances and high costs, however, practical applications of micromirrors are quite limited. At present micromirrors demand not only a better design but also a simple fabrication process. In this study a twisting-type micromirror that can be driven by two thermal bimorph actuators bending in opposite directions is designed from electro-thermo-mechanical theories and fabricated through a simple MEMS process. Each actuator consists of $SiO_2$ and gold thin-film layers. Simplified analytical model has been built to optimize the performance of micromirror. Due to unexpected resistance increase of metal film and alignment mismatch during fabrication process, experimental rotation angles of micromirrors are about $11^{\circ}$ at applied voltages less than 0.6V. From numerical simulation and analytical studies, however, the next design can provide rotation angles over $20^{\circ}$ at the same applied voltage.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.11
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• pp.958-962
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• 2002

This paper reports on the fabrication of free-standing microstructures by DRIE (deep reactive ion etching). SOI (Si-on-insulator) structures with buried cavities are fabricated by SDB (Si-wafer direct bonding) technology and electrochemical etch-stop. The cavity was formed the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the formed cavity under vacuum condition at -760 mmHg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annealing (100$0^{\circ}C$, 60 min.), the SDB SOI structure with a accurate thickness and a good roughness was thinned by electrochemical etch-stop in TMAH solution. Finally, it was fabricated free-standing microstructures by DRIE. This result indicates that the fabrication technology of free-standing microstructures by combination SDB, electrochemical etch-stop and DRIE provides a powerful and versatile alternative process for high-performance bulk micromachining in MEMS fields.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.11
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• pp.211-220
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• 2002

Optical disk drives read information by replacing a laser beam on the disk track. As information has become larger, the more accurate position control of a laser beam is necessary. In this paper, we report the analysis and fabrication of the micro mirror for optical disk drivers. A coupled simulation of gas flow and structural displacement of the micro mirror using the Finite-Element-Method is applied to this. The mirror was fabricated by using MEMS technology. Especially, the process using the lapping and polishing step after the bonding of the mirror and electrode plates was employed for the Process reliability. The mirror size was 2.5mm${\times}$3mm and it needed about 35V for displacement of 3.2 ${\mu}$.