• Title/Summary/Keyword: MECHANICAL INTERFACIAL

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Influence of SiC on Thermal Stabilities and Mechanical Interfacial Properties of Carbon Fibers-reinforced Composites (탄화규소의 첨가가 탄소섬유 강화 복합재료의 열안정성 및 기계적 계면특성에 미치는 영향)

  • Oh Jin-Seok;Park Soo-Jin;Lee Jae-Rock;Kim Yeung-Keun
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2004.04a
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    • pp.182-185
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    • 2004
  • In this work, the effect of chemical treatments on surface properties of SiC was investigated in mechanical interfacial properties of carbon fibers-reinforced composites. The surface properties of the SiC were determined by acid/base values and contact angles. The thermal stabilities of carbon fibers-reinforced composites were investigated by thermogravimetric analysis (TGA). Also, the mechanical interfacial properties of the composites were studied in interlaminar shear strength (ILSS) and critical strain energy release rate mode II $(G_{IIC})$ measurements. As a result, tile acidically treated SiC (A-SiC) had higher acid value than that of untreated SiC (V-SiC) or basically treated SiC (B-SiC). According to the contact angle measurements, it was observed that chemical treatments led to an increase of surface free energy of the SiC surfaces, mainly due to the increase of the specific (polar) component. The mechanical interfacial properties of the composites, including ILSS and $(G_{IIC})$, had been improved in the specimens treated by chemical solutions. These results were explained that good wetting played an important role in improving the degree of adhesion at interfaces between SiC and epoxy resin matrix.

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Key Parameter of Peel-off Test for Reliability Assessment of Toner Film (토너 박막의 신뢰성 평가를 위한 Peel-off Test의 주요인자)

  • Kim, Kwang-Il;Kim, Dae-Eun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.11
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    • pp.1567-1573
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    • 2010
  • In printing systems, the reliability of printed material depends on the ability of the toner film to remain adhered to the paper surface. In order to measure the strength between the toner film and the paper surface, a peel-off test is often performed. After conducting the test, the amount of toner film remaining on the paper is measured in order to determine the interfacial strength. The results of this test can be affected by many factors such as the peeling rate, weight of the roller used, and dwell time of tape. Sensitivity analysis was performed with respect to peeling rate, weight of roller and dwell time of tape at different levels. It was found that the interfacial strength increased with an increase in these main parameters. On the other hand, the trend with respect to the percentage of toner loss was different. Further, the interfacial strength and percentage of toner loss were significantly affected by the peeling rate.

Filler-Elastomer Interactions. 9. Effect of Thermal Treatment on Mechanical Interfacial Characteristics of Silica/Polyurethane Composites (충전제-탄성체 상호작용. 9. 실리카/ 폴리우레탄 복합재료의 기계적 계면특성에 미치는 열처리의 영향)

  • Park, Soo-Jin;Cho, Ki-Sook;Zaborski, M.;Slusarski, L.
    • Elastomers and Composites
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    • v.37 no.4
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    • pp.258-264
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    • 2002
  • In this work, the influence of thermal treatment on surface properties of silicas and mechanical interfacial properties of silicas/polyurethane composites was investigated. The surface properties of thermally treated silicas were studied in the context of Fourier Transform-IR (FT-IR), solid-state 29Si NMR spectroscopy, and contact angle. And the mechanical interfacial properties of the silica/polyurethane composites were evaluated by composite tearing energy (GIIIC). As a result, it was found that the thermally treated silica surfaces became hydrophobic in nature, due to the condensation of surface hydroxyls and the formation of siloxane bonds, resulting in increasing the London dispersive component of surface free energy. From which, the increase of the London dispersive component of the silicas led to an improvement of the dispersion of silicas in a polyurethane matrix, finally resulting in improving the tearing energy (GIIIC) of the silicas/polyurethane composites.

Measurement of Glass-Silicon Interfacial fracture Toughness and Experimental Evaluation of Anodic Bonding Process based on the Taguchi Method (다구찌 방법에 의한 유리-실리콘 양극접합 계면의 파괴인성치 측정 및 양극접합공정 조건에 따른 접합강도 분석)

  • Kang, Tae-Goo;Cho, Young-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.6
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    • pp.1187-1193
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    • 2002
  • Anodic bonding process has been quantitatively evaluated based on the Taguchi analysis of the interfacial fracture toughness, measured at the interface of anodically bonded silicon-glass bimorphs. A new test specimen with a pre-inserted blade has been devised for interfacial fracture toughness measurement. A set of 81 different anodic bonding conditions has been generated based on the three different conditions for four different process parameters of bonding load, bonding temperature, anodic voltage and voltage supply time. Taguchi method has been used to reduce the number of experiments required for the bonding strength evaluation, thus obtaining nine independent cases out of the 81 possible combinations. The interfacial fracture toughness has been measured for the nine cases in the range of 0.03∼6.12 J/㎡. Among the four process parameters, the bonding temperature causes the most dominant influence to the bonding strength with the influence factor of 67.7%. The influence factors of other process parameters, such as anodic voltage and voltage supply time, bonding load, are evaluated as 18%, 12% and 2.3%, respectively. The maximum bonding strength of 7.23 J/㎡ has been achieved at the bonding temperature of 460$\^{C}$ with the bonding load of 45gf/㎠, the applied voltage of 600v and the voltage supply time of 25minites.

Stress Fields Along Semi-Elliptical Interfacial Crack Front with Yield-Strength-Mismatch (항복강도 불일치 반타원 계면균열 선단에서의 응력장)

  • Choi, Ho-Seung;Lee, Hyung-Yil
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.1
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    • pp.126-137
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    • 2003
  • Many research works have been performed on the J-T approach for elastic-plastic crack-tip stress fields in a variety of plane strain specimens. To generalize the validity of J-T method, further investigations are however needed fur more practical 3D structures than the idealized plane strain specimens. The present study deals mainly with 3D finite element (FE) modeling of welded plate and straight pipe, and accompanying elastic, elastic-plastic FE analyses. Manual 3D modeling is almost prohibitive, since the models contain semi-elliptical interfacial cracks which require singular elements. To overcome this kind of barrier, we develop a program generating the meshes fur semi-elliptical interfacial cracks. We then compare the detailed 3D FE stress fields to those predicted with J-T two parameters. The validity of J-T approach is thereby extended to 3D yield-strength-mismatched weld joints, and useful information is inferred fur the design or assessment of pipe welds.

J-T Characterization of Stress Fields Along 3D Semi-Elliptical Interfacial Crack Front (J-T에 의한 3차원 반타원 계면균열선단 응력장의 기술)

  • Choi, Ho-Seung;Lee, Hyung-Yil
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.7
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    • pp.1250-1261
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    • 2002
  • Many research works have validated the J-T approach to elastic-plastic crack-tip stress fields in a variety of plane strain specimens. To generalize the validity of J-T method, further investigations are however needed for more practical 3D structures than the idealized plane strain specimens. In this work, we perform 3D finite element (FE) modeling of welded plate and straight pipe, and accompanying elastic, elastic-plastic FE analyses. Manual 3D modeling is almost prohibitive, since the models contain semi-elliptical interfacial cracks which require singular elements. To overcome this kind of barrier, we develop a program generating the meshes for semi-elliptical interfacial cracks. We then compare the detailed 3D FE stress fields to those predicted with J-T two parameters. Thereby we extend the validity of J-T application to 3D structures and infer some useful informations for the design or assessment of pipe welds.

Deformation of the Rubber Mold by Using the Cohesive Zone Model Under Cold Isostatic Pressing (응집영역모델을 이용한 정수압 성형 해석시 고무몰드의 변형거동)

  • Lee, Sung-Chul;Kim, Ki-Tae
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.32 no.5
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    • pp.387-395
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    • 2008
  • Stress distribution and interfacial debonding process at the interface between a rubber mold and a powder compact were analyzed during unloading under cold isostatic pressing. The Cap model proposed by Lee and Kim was used for densification behavior of powder based on the parameters involved in the yield function of general Cap model and volumetric strain evolution. Cohesive elements incorporating a bilinear cohesive zone model were also used to simulate interfacial debonding process. The Cap model and the cohesive zone model were implemented into a finite element program (ABAQUS). Densification behavior of powder was investigated under various interface conditions between a rubber mold and a powder compact during loading. The residual tensile stress at the interface was investigated for rubber molds with various elastic moduli under perfect bonding condition. The variations of the elastic energy density of a rubber mold and the maximum principal stress of a powder compact were calculated for several interfacial strengths at the interface during unloading.

Improved interfacial stress analysis of a plated beam

  • Hao, Sheng-Wang;Liu, Yan;Liu, Xiao-Dan
    • Structural Engineering and Mechanics
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    • v.44 no.6
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    • pp.815-837
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    • 2012
  • A plated beam is strengthened by bonding a thin plate to the tension face; it often fails because of premature debonding of the thin plate from the original beam in a brittle manner. A sound understanding of the mechanism of such debonding failure is very important for the effective use of this strengthening technique. This paper presents an improved analytical solution for interfacial stresses that incorporates multiple loading conditions simultaneously, including prestress, mechanical and thermal loads, and the effects of adherend shear deformations and curvature mismatches between the beam and the plate. Simply supported beams bonded with a thin prestressing plate and subjected to both mechanical and thermal loading were considered in the present work. The effects of the curvature mismatch and adherend shear deformations of the beam and plate were investigated and compared. The main mechanisms affecting the distribution of interfacial stresses were analyzed. Both the normal and shear stresses were found to be significantly influenced by the coupled effects of the elastic moduli with the ratios $E_a/E_b$ and $E_a/E_p$.

Dynamic Interfacial Crack in Bonded Anisotropic Strip Under Out-of-Plane Deformation (면외변형하의 이방성 띠판에 대한 동적계면균열)

  • Park, Jae-Wan;Choe, Seong-Ryeol
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.6
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    • pp.949-958
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    • 2001
  • A semi-infinite interfacial crack propagated with constant velocity in two bonded anisotropic strips under out-of-plane clamped displacements is analyzed. Using Fourier integral transform the problem is formulated and the Wiener-Hopf equation is derived. By solving this equation the asymptotic stress and displacement fields near the crack tip are obtained, where the results get more general expressions applicable not only to isotropic/orthotropic materials but also to the extent of the anisotropic material having one plane of elastic symmetry for the interfacial crack. The dynamic stress intensity factor is obtained as a closed form, which is decreased as the velocity of crack propagation increases. The critical velocity where the stress intensity factor comes to zero is obtained, which agrees with the lower value between the critical values of parallel crack merged in the material 1 and 2 adjacent to the interface. Using the near tip fields of stresses and displacements, the dynamic energy release rate is also obtained as a form of the stress intensiy factor.

Simplified beam model of high burnup spent fuel rod under lateral load considering pellet-clad interfacial bonding influence

  • Lee, Sanghoon;Kim, Seyeon
    • Nuclear Engineering and Technology
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    • v.51 no.5
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    • pp.1333-1344
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    • 2019
  • An integrated approach of model simplification for high burnup spent nuclear fuel is proposed based on material calibration using optimization. The spent fuel rods are simplified into a beam with a homogenous isotropic material. The proposed approach of model simplification is applied to fuel rods with two kinds of interfacial configurations between the fuel pellets and cladding. The differences among the generated models and the effects of interfacial bonding efficiency are discussed. The strategy of model simplification adopted in this work is to force the simplified beam model of spent fuel rods to possess the same compliance and failure characteristics under critical loads as those that result in the failure of detailed fuel rod models. It is envisioned that the simplified model would enable the assessment of fuel rod failure through an assembly-level analysis, without resorting to a refined model for an individual fuel rod. The effective material properties of the simplified beam model were successfully identified using the integrated optimization process. The feasibility of using the developed simplified beam models in dynamic impact simulations for a horizontal drop condition is examined, and discussions are provided.