• 한국재료학회지
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• 제17권12호
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• pp.634-636
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• 2007

The texture and microstructure in Cu/Nb added ultra low carbon steels through the different thickness layer were studied after hot rolling. It was found that the two ultra low carbon steels all show the inhomogeneity of hot rolling texture and the Cu-added ultra low carbon steel was far more inhomogeneous than Nb-added one. In the center layer, the strong ${\alpha}\;fibre,\;{\gamma}\;fibre$ textures and the shear textures including 001<110>, 111<112> were founded. Near the surface, the ${\alpha}\;fibre$ texture and the orientation texture caused by a typical plane-strain deformation condition of bcc metals were observed.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.461-464
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• 2008

We have developed low voltage driving red phosphorescent organic light-emitting devices using a new electron transport layer. $Ir(piq)_3$ and CBP were used as a phosphorescent dopant and an emission host, respectively. The device exhibits a luminance of $1000\;cd/m^2$ at a voltage of 2.8 V. This high luminance at low voltage results from a high electron conduction behavior of the new electron transport layer.

• 세라미스트
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• 제23권1호
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• pp.38-53
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• 2020

Magnetoelectric (ME) composites composed of magnetostrictive and piezoelectric materials derive interfacial coupling of magnetoelectric conversion between magnetic and electric properties, thus enabling to detect ultra-low magnetic field. To improve the performance of ME composite sensors, various research teams have explored adopting highly efficient magnetostrictive and piezoelectric phases, tailoring of device geometry/structure, and developing signal process technique. As a result, latest ME composites have achieved not only outstanding ME conversion coefficient but also sensing of ultra-low magnetic field below 1pT. This article reviews the recent research trend of ME composites for sensing of ultra-low magnetic field.

• Tribology and Lubricants
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• 제14권1호
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• pp.70-78
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• 1998

Two different friction materials (organic and low-metallic pads) for automotive brakes were studied to investigate the anti-fading phenomena during stop. The anti-fading phenomena were pronounced more in the case of using low metallic friction materials than organic friction materials. The main cause of the anti-fading phenomena was the high dependence of friction coefficient on a sliding speed. The anti-fading was prominent when the initial brake temperature was high in the case of low-metallic friction materials due to the strong stick-slip event at high temperature. On the other hand, the anti-fading was not severe in organic friction materials and the effect was reduced at high braking temperature due to the thermal decomposition of organic friction materials. The strong stickslip phenomena of low metallic friction materials at high temperature induced high torque oscillations during drag test. During this experiment two different braking control modes (pressure controlled and torque controlled modes) were compared. The type of the control mode used for brake test significantly affected the friction characteristics.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.275-278
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• 2002

Conductive adhesives are commonly used for the interconnections of fine pitch, small packages like mobile applications. Since conductive particles connect mechanically with contact pads to give somewhat higher contact resistance, a metallurgical interconnection, which provides both fine pitch and low resistance, was studied using silver ball and indium which can be made at low temperatures. The connection resistance of the In-Ag metallurgical interconnection was lower than that of the Ni/Au-Ag mechanical interconnection and the former showed little dependency on the bonding load in contrast to the latter.

• ETRI Journal
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• 제38권2호
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• pp.244-251
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• 2016

In this paper, we investigate the electrical characteristics of two trench-gate-type super-barrier rectifiers (TSBRs) under different p-body implantation conditions (low and high). Also, design considerations for the TSBRs are discussed in this paper. The TSBRs' electrical properties depend strongly on their respective p-body implantation conditions. In the case of the TSBR with a low p-body implantation condition, it exhibits MOSFET-like properties, such as a low forward voltage ($V_F$) drop, high reverse leakage current, and a low peak reverse recovery current owing to a majority carrier operation. However, in the case of the TSBR with a high p-body implantation condition, it exhibits pn junction diode.like properties, such as a high $V_F$, low reverse leakage current, and high peak reverse recovery current owing to a minority carrier operation. As a result, the TSBR with a low p-body implantation condition is capable of operating as a MOSFET, and the TSBR with a high p-body implantation condition is capable of operating as either a pn junction diode or a MOSFET, but not both at the same time.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1997년도 추계학술대회 논문집 학회본부
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• pp.302-304
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• 1997

Chemical structure and electrical properties such as water treeing and space charge accumulation of various raw materials(XLPE) used for power cable insulation were investigated. It was found that chemical structure was changed after crosslinking reaction and every materials have different amounts of DCP and antioxidant. Electrical properties were also changed after extraction using $CHCl_3$ and xylene. Water tree length was smaller with additives such as DCP and antioxidant and bigger with low molecular weight components of polyethylene than that of extracted samples. Heterocharge was changed into homocharge after extraction. This shows that additives and low molecular weight components of polyethylene cause the heterocharge.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 초전도 자성체
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• pp.17-20
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• 2002

The effects of relatively low lead content (0.2~0.3) on the 2223 phase formation and transport property of Bi-2223/Ag tapes have been investigated. The results show that lead contents have great impact on the phase assemblage of precursors, subsequently, on the phase formation and transport property of silver sheathed BSCCO-2223 tapes. Powders containing Pb=0.25 and Pb=0.3 resulted in the nearly identical $J_c$ values in fully processed tapes, but leaded to significant difference on the phase formation process. For the case of Pb=0.2, both low conversion fraction of 2212 to 2223 and low $J_c$ value were obtained in final reacted tape, which was probably due to lack of enough liquid phase to facilitate the phase transformation.

• ETRI Journal
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• 제38권6호
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• pp.1163-1171
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• 2016

Integration technologies involving flexible substrates are receiving significant attention owing the appearance of new products regarding wearable and Internet of Things technologies. There has been a continuous demand from the industry for a reliable bonding method applicable to a low-temperature process and flexible substrates. Up to now, however, an anisotropic conductive film (ACF) has been predominantly used in applications involving flexible substrates; we therefore suggest low-temperature lead-free soldering and bonding processes as a possible alternative for flex-on-flex applications. Test vehicles were designed on polyimide flexible substrates (FPCBs) to measure the contact resistances. Solder bumping was carried out using a solder-on-pad process with Solder Bump Maker based on Sn58Bi for low-temperature applications. In addition, thermocompression bonding of FPCBs was successfully demonstrated within the temperature of $150^{\circ}C$ using a newly developed fluxing underfill material with fluxing and curing capabilities at low temperature. The same FPCBs were bonded using commercially available ACFs in order to compare the joint properties with those of a joint formed using solder and an underfill. Both of the interconnections formed with Sn58Bi and ACF were examined through a contact resistance measurement, an $85^{\circ}C$ and 85% reliability test, and an SEM cross-sectional analysis.

• 대한기계학회논문집A
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• 제34권10호
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• pp.1419-1425
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• 2010

열간성형된 보론강판은 고강도특성이 필요한 자동차 부품에 널리 적용되고 있으며, 최근에는 샤시 부품에도 점차로 적용되고 있다. 샤시 부품으로 적용되기 위해서 고강도 특성뿐만 아니라 내피로특성이 동시에 요구되고 있어, 본 연구에서 열간성형된 보론강판의 저주기 피로특성을 연구하였다. 저주기 피로시험결과, 총변형률 진폭이 낮은 영역에서는 열간성형된 보론강의 피로수명이 현저히 높았지만, 높은 총변형률 진폭에서는 열간성형된 보론강의 마르텐사이트 조직특성인 낮은 연성과 파괴인성으로 인해서 보론강 원소재의 피로수명이 더 높음을 확인할 수 있었다.