• JSTS:Journal of Semiconductor Technology and Science
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• 제5권2호
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• pp.83-88
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• 2005

The interface-states between the top silicon layer and buried oxide layer of nano-SOI substrate were developed. Also, the effects of thermal treatment processes on the interface-state distributions were investigated for the first time by using pseudo-MOSFETs. We found that the interface-state distributions were strongly influenced by the thermal treatment processes. The interface-states were generated by the rapid thermal annealing (RTA) process. Increasing the RTA temperature over $800^{\circ}C$, the interface-state density considerably increased. Especially, a peak of interface-states distribution that contributes a hump phenomenon of subthreshold curve in the inversion mode operation of pseudo-MOSFETs was observed at the conduction band side of the energy gap, hut it was not observed in the accumulation mode operation. On the other hand, the increased interface-state density by the RTA process was effectively reduced by the relatively low temperature annealing process in a conventional thermal annealing (CTA) process.

• 한국전기전자재료학회논문지
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• 제24권5호
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• pp.370-373
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• 2011

We investigated the effects of low temperature ($500^{\circ}C$) $O_2$ annealing on the characteristics of hafnium silicate ($HfSi_xO_y$) films deposited on a Si substrate by atomic layer deposition (ALD). We found that the post deposition annealing under oxidizing ambient causes the oxidation of residual Hf metal components, resulting in the improvement of electrical characteristics such as flat band voltage shift (${\Delta}V_{fb}$) by hysteresis without oxide capacitance reduction. We suggest that post deposition annealing under oxidizing ambient is necessary to improve the electrical characteristics of $HfSi_xO_y$ films deposited by ALD.

• 한국기계가공학회지
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• 제17권4호
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• pp.130-136
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• 2018

In this paper, the effects of different 3D printing parameters including laminated angle and annealing temperature, were observed for their effects on tensile testing. In 3D printing, a filament is heated quickly, extruded, and then cooled rapidly. Because plastic is a poor heat conductor, it heats and cools unevenly causing the rapid heating and cooling to create internal stress within the printed part. Therefore, internal stress can be removed using annealing and to increase tensile strength and strain. During air cooling at annealing temperature $140^{\circ}C$, the strain of laminated angle $45^{\circ}$ specimens tended to increase by 46% while the tensile stress tended to increase by 7.4%. During oven cooling at annealing temperature $140^{\circ}C$, the strain of laminated angle $45^{\circ}$ specimens tended to increase by 34% while the tensile stress tended to increase by 22.2%. In this study, we found "3D printing with annealing" eliminates internal stress and increases the strength and stiffness of a printed piece. On the microstructural level, annealing reforms the crystalline structures to even out the areas of high and low stress, which created fewer weak areas. These results are very useful for making 3D printed products with a mechanical strength that is suitable for applications.

• 한국자기학회지
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• 제2권2호
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• pp.91-98
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• 1992

$Co_{67}Fe_{4.5}Nb_{2}Si_{10}B_{15}$ 비정질합금리본에서 2단 어닐링이 자기특성에 미치는 영향을 조사 하였다. 고온인 $480^{\circ}C$ 이상에서 20분간 1단 어닐링한 리본을 저온인 $310^{\circ}C$에서 2시간 동안 2단으로 진공어닐링한 결과 보자력과 각형비는 1단 어닐링한 경우와 거의 비슷한 값들을 나타내었으나, 직류 및 교류투자율은 1단 어닐링에 비해 현저히 높아졌다. 2단 어닐링시 직류 및 1 kHz에서의 교류투자율의 최대치는 각각 약 290,000과 41,000으로서 1단 어닐링에 비해 30% 이상 증가하였다. 어닐링온도에 따른 자성의 변화는 3단계로 나누어 내부응력, 자구크기, cluster 및 결정상의 변화를 주요 요인으로 하여 고찰하였다.

• 한국진공학회지
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• 제7권2호
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• pp.150-154
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• 1998

실리콘산화막에 실리콘이온주입을 $5\times1016/\textrm{cm}^2, 1\times10^{17}/\textrm{cm}^2, 3\times10^{17}/\textrm{cm}^2$으로 하여 열처리온도와 열처리시간을 변화시키면서 광루미니센스, XRD, TEM을 관찰하였다. 이온주 입량이 적고 열처리온도가 낮을경우에 가시광 광루미니센스를 관찰할 수 있었다. 광루미니 센스의 peak는 7420$\AA$과 8360$\AA$위치에 있었으며, 열처리시간이 길어짐에 따라 intensity는 각각 증가하였다. 이온주입량이 많고 열처리온도가 높을경우에는 광루미니센스가 관찰되지 않았다. 이온주입량이 적고 열처리 온도가 높을경우에는 열처리시간이 짧으면 가시광 광루 미니센스가 있으나 열처리시간이 1시간 이상으로 길어지면 광루미니센스가 사라졌다. XRD 와 TEM결과로부터 실리콘 cluster는 nonradiative defect와 관련있으며, 실리콘이온주입된 실리콘산화막에서 관찰되는 광루미니센스의 origin은 nanocrystal이 아니라 defect임을 알 수 있었다. 이온주입되는 실리콘이온의 량, 열처리온도와 시간의 변화는 광루미니센스를 변 화시키는데 이 현상들을 Si-O-O결합인 O위주의 결함과 Si-Si-O결합인 Si위주의 결함과 연 관지어 설명할 수 있었다.

• 전기학회논문지P
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• 제65권1호
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• pp.53-56
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• 2016

Because of the low pollution resistance of the porcelain electrical insulator itself, in this work the anti-pollution performance of insulator was improved by using the functional coating. The ceramic substrates that components were same as the porcelain electrical insulator were used in this experiment. The functional films were coated on the ceramic substrate by using a spray coating method, and then the coated substrate were annealed under different coating condition such as natural curing and annealing temperature of $200^{\circ}C$, $300^{\circ}C$ and $400^{\circ}C$. Then, the contact angles of the coated surfaces were measured and the minimum angle ($8.3^{\circ}$) was obtained at $400^{\circ}C$. The anti-contamination properties were measured, revealing that as the contact angle decreased, the anti-contamination properties improved. The hardness and adhesion were small at the natural curing condition however the excellent mechanical properties were obtained under higher temperature annealing.

• Journal of Magnetics
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• 제16권2호
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• pp.177-180
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• 2011

0.30 mm thick and 90 mm wide thin foils made of Fe-6.5wt.%Si alloy were successfully fabricated by traditional rolling. The as-rolled sheets had good shapes and shining metal luster. The effects of annealing temperature on the magnetic properties of the sheets were investigated. Excellent Dc properties ($H_c$: 11.55 A/m, ${\mu}_m$: 23710, and $B_s$: 1.439 T) were obtained at an annealing temperature of 1453 K for 1.5 h. At low frequencies ($\leq$ 1 kHz), heat treatment temperature has little effect on iron loss which remained at the level of 9.8 W/kg. Annealing at 1273 K for 1.5 h is optimum for frequencies above 5 kHz.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.5-6
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• 2009

In this paper, plasma ion implant is performed with $PH_3$ gas diluted by helium gas on P-type Si wafer (100). Spike Rapid Thermal Processing(RTP) annealing performed for 30~60 sec from $800\;^{\circ}C$ to $1000\;^{\circ}C$ in $N_2+O_2$ ambient. Crystalline defect is analyzed by Transmission Electron Microscope(TEM) and Double crystal X-ray Diffraction(DXRD). Contact resistivity($\rho c$), contact resistance(Rc) and sheet resistance(Rs) are analyzed by measuring Transfer Length Method(TLM) using 4155C analysis. As annealing temperature increase, Rs decrease and ${\rho}c$ and Rc increase at temperature higher than $850\;^{\circ}C$. We achieve low Rs, ${\rho}c$ and Rc with Plasma ion implant and spike RTP.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.1131-1134
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• 2003

A low temperature doping technique has been studied for application in poly-Si TFT's on plastic substrates. Heavily-doped amorphous silicon layers were deposited on poly-Si and the dopant atoms were driven in by subsequent excimer laser annealing. The entire process was carried out under a substrate temperature of $120^{\circ}C$, and a sheet resistance as low as $300 {\Omega}/sq$. was obtained.

• Journal of Welding and Joining
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• 제17권1호
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• pp.133-144
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• 1999

To fine seam annealer capacity of through thickness seam annealing in terms of through thickness microstructure change with increased toughness and elongation leaving heat trace on it, high strength steel pipes of ERW with different thickness were tested in different seam annealing temperature measured on the outer surface of pipes. Annealing temperature and microstructure of the weld seam were changed through applied seam annealing condition. Toughness and tensile test with hardness and microstructure analysis were done on the annealed weld seam to fine its characteristics as a primary step and annealing characteristics according to different seam annealing condition. Through a study of annealed ERW weld seam characteristics and seam annealing technology, amount of electric power should apply in decreased manner to arranged inductors of annealer in the order of 1st, 2nd, 3rd, so on for proper seam annealing. For example of 15.4mm thick and 610mm outside diameter pipe, applied power for proper seam annealing is 600 -650kw at 1st inductor, 450 - 500kw at 2nd inductor, 200-250 kw at 3rd inductor of annealer during 10 - 12M/minute moving speed of pipe. Also, the penetration depth of heat trace along the thickness direction of weld during seam annealing can be estimated through the equation 17mm/kv$\times$voltage(kv) with the microstructure and hardness analysis of thick weld seam as well as study of seam annealing and comparison of cooling condition to CCT diagram of low carbon high strength steel. From this result, the difference between the technological applicability of full annealing condition based on phase diagram and full penetration of heat trace based on CCT diagram along the thickness of weld seam is discussed.