• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.545-545
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• 2007

Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.866-869
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• 2004

A carbon nanotube field emission display(CNT FED) panel with a 2 inch diagonal size was fabricated by using a screen printing of a prepared photo-sensitive CNT paste and vacuum in-line sealing technology. After a surface treatment of the patterned CNT, only the carbon nanotube tips are uniformly exposed on the surface. The diameter of the exposed CNTs are usually about 20nm. The sealing temperature of the panel was around 390 $^{\circ}C$ and the vacuum level was obtained with $1.4{\times}10^{-5}$torr at the sealing. The field emission properties of the diode type CNT FED panel were characterized Now, we are developing a triode type CNT FED with a self-aligned gate-emitter structure.

• Journal of the Korean institute of surface engineering
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• v.47 no.6
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• pp.347-353
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• 2014

We present a synthesis of single-walled carbon nanotubes(SWNTs) for enhancement of parallel-alignment and density using chemical vapor deposition with methane feed gas. As-purchased ST-cut quartz substrates were heat-treated and line-patterned by electron-beam lithography in order to grow SWNTs with parallel alignment. We investigated the effects of various synthesis parameters such as catalyst oxidation, reduction, and synthesis conditions in order to enhance both tube density and degree of parallel alignment. The condition of $1{\AA}$ of Fe catalyst film, atmospheric oxidation at $750^{\circ}C$ for 10 min, reduction under 400 Torr for 5 min, and growth at $865^{\circ}C$ under 300 Torr yields $33tubes/10{\mu}m$, which is the highest tube density with parallel alignment. Based on the results of atomic force microscope and Raman spectroscopy, it was found that SWNTs have diameter range of 0.8-2.0 nm. We believe that the present work would contribute to the development of SWNTs-based flexible functional devices.

• Journal of the Korean Vacuum Society
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• v.6 no.1
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• pp.9-19
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• 1997

The reaction mechanisms of dry cleaning with UV-excited chlorine radical for Zn, Fe and Ti trace contaminants on the Si wafer have been studied by SEM, AFM and XPS analyses in this work. The patterned Zn, Fe and Ti films were deposited on the Si wafer surface by thermal evaporation and changes in the surface morphology after dry cleaning with $Cl_2$and UV/$Cl_2$at $200^{\circ}C$ were studied by optical microscopy and SEM. In addition, changes in the surface roughness of Si wafer with the cleaning was observed by AFM. The chemical bonding states of the Zn, Fe and Ti deposited silicon surface were observed with in-line XPS analysis. Zn and Fe were easily cleaned in the form of volatile zinc-chloride and iron-chloride as verified by the surface morphology changes. Ti which forms involatile oxides was not easily removed at room temperature but was slightly removed by UV/$Cl_2$at elevated temperature of $200^{\circ}C$. It was also found that the surface roughness of the Si wafer increased after $Cl_2$and UV/$Cl_2$cleaning. Therefore, the metallic contaminants on the Si wafer can be easily removed at lower temperature without surface damage by a continuous process using wet cleaning followed by UV/$Cl_2$dry cleaning.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.2
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• pp.30-37
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• 2020

We propose a practical method for increasing formability of a sheet metal plate using laser heat treatment (LHT) and cladding process. In this work, two kinds of process such as laser-induced heat treatment and cladding were utilized to evaluate the effect on formability of SUS316 sheets with different thickness of 1 and 3 mm. By using a vertically line-patterned tensile specimen that was LHTed or cladded on its surface, the process parameters of each surface treating method were studied and optimized. Through the basic test, we knew that the laser power of 900 W and scanning speed of 500 mm/min was the best condition for increase of formability. As the treatment results, ultimate tensile strength and elongation were increased as approximately 2.1 and 7.0%, respectively. To verify the usefulness of this work in industrial cases, we conducted a bulging test using with and without LHTed SUS316 sheet metal blanks. The results show that the bulging height of LHTed sheet was increased by 73% compared to that of the original one.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.11
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• pp.841-845
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• 2013

We give a textured front on silicon wafer for high-efficiency solar cells by using micro contact printing method which uses PDMS (polydimethylsiloxane) silicon rubber as a stamp and SAM (self assembled monolayer)s as an ink. A random pyramidal texturing have been widely used for a front-surface texturing in low cost manufacturing line although the cell with random pyramids on front surface shows relatively low efficiency than the cell with inverted pyramids patterned by normal optical lithography. In the past two decades, the micro contact printing has been intensively studied in nano technology field for high resolution patterns on silicon wafer. However, this promising printing technique has surprisingly never applied so far to silicon based solar cell industry despite their simplicity of process and attractive aspects in terms of cost competitiveness. We employ a MHA (16-mercaptohexadecanoic acid) as an ink for Au deposited $SiO_2/Si$ substrate. The $SiO_2$ pattern which is same as the pattern printed by SAM ink on Au surface and later acts as a hard resist for anisotropic silicon etching was made by HF solution, and then inverted pyramidal pattern is formed after anisotropic wet etching. We compare three textured surface with different morphology (random texture, random pyramids and inverted pyramids) and then different geometry of inverted pyramid arrays in terms of reflectivity.

• Korean Journal of Optics and Photonics
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• v.21 no.1
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• pp.6-11
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• 2010

Fluorescent photopolymer film was prepared with composition containing acrylate monomer, binder, a visible light sensitive photo initiator, and fluorescent anthracene polymer. A fluorescent grating pattern was inscribed on the photopolymer film using a 2-beam coupling method. A 514 nm laser was coupled to generate a beam-interference pattern. A highly fluorescent diffractive line pattern was formed on the fluorescent photopolymer within 30 sec. of exposure. The fluorescence intensity was highly enhanced in the patterned area, possibly due to the change in the environment of the fluorescent polymers by the photo-polymerization of monomers. Under a photo-mask, a gap electrode pattern was formed of fluorescent gratings with a sub-micron scale, which was matched well to the calculated value ($2.5\;{\mu}m$ and $0.6\;{\mu}m$) based on the refractive index of the photopolymer and beam incident angle ($3.4^{\circ}$, $15^{\circ}$) to the photopolymer surface.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.3
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• pp.206-211
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• 2005

The device makers want to make higher density chips on the wafer through scale-down. The change of WSix/poly-Si gate film thickness is one of the key issues under 100 nm device structure. As a new device etching process is applied, end point detection(EPD) time delay was occurred in DPS+ poly chamber of Applied Materials. This is a barrier of device shrink because EPD time delay made physical damage on the surface of gate oxide. To investigate the EPD time delay, the experimental test combined with OES(Optical Emission Spectroscopy) and SEM(Scanning Electron Microscopy) was performed using patterned wafers. As a result, a EPD delay time is reduced by a new chamber seasoning and a new wavelength line through plasma scan. Applying a new wavelength of 252 nm makes it successful to call corrected EPD in WSix/poly-Si stack-down gate etching in the DPS+ poly chamber for the current and next generation devices.

• Particle and aerosol research
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• v.18 no.4
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• pp.129-136
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• 2022

The line width of circuits in semiconductor devices continues to decrease down to a few nanometers. Since nanoparticles attached to the patterned wafer surface may cause malfunction of the devices, it is crucial to remove the contaminant nanoparticles. Physical cleaning that utilizes momentum of liquid for detaching solid nanoparticles has recently been tested in place of the conventional chemical method. Dropwise impaction has been employed to increase the removal efficiency with expectation of more efficient momentum exchange. To date, most of relevant studies have been focused on drop spreading behavior on a horizontal surface in terms of maximum spreading diameters and average spreading velocity of drop. More important is the local liquid velocity at the position of nanoparticle, very near the surface, rather than the vertical average value. In addition, there are very scarce existing studies dealing with microdroplet impaction that may be desirable for minimizing pattern demage of the wafer. In this study, we investigated the local velocity distribution in spreading liquid film under various impaction conditions through the CFD simulation. Combining the numerical results with the particle removal model, we estimated an effective cleaning diameter (ECD), which is a measure of the particle removal capacity of a single drop, and presented the predicted ECD data as a function of droplet's velocity and diameter particularly when the droplets are microns in diameter.

• The Research Journal of the Costume Culture
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• v.20 no.1
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• pp.36-48
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• 2012

This study intends to provide fundamental data to develop creative high-value designs, proving that the cut-out technique, a decorative element of fashion design, can be used to express various visual effects. The author performed a literature review of such publications as Gap Press, Fashion News, and Mode & Mode from 2001S/S to 2010S/S, referring to Internet data to empirically analyze the cut-out technique in contemporary fashion. The study found that the cut-out design is effective overall, but is best suited for one-piece designs and for partial rather than whole items of clothing. The basic motif of the cut-out is a geometrical pattern based on a line, a tear, or is shapeless. The cut-out design is mostly shown as an overall pattern or as a symmetrical shape. Analysis shows that the characteristics of the contemporary fashion utilizing the cut-out technique are as follow: First, the cut-out technique exposes the curves of a woman's body in a direct or indirect way, thereby emphasizing her sexuality and maximizing the value of female beauty. Second, through the cut-out technique, we can highlight the various types of space formed by the technique and repeated patterns; we may also elaborate on single-patterned laser-cut designs, which will show that the particular surface effect of the material can strongly impact the attractiveness of the design through emphasis and decoration. Third, damaging or destroying clothes on purpose, showing surprising concepts through optical illusions, and expressing humor by ignoring existing clothing styles show our willingness to escape from traditional or obvious design ideas, as well as demonstrating individuality and playfulness.