• Proceedings of the Korean Institute of Building Construction Conference
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• 2007.11a
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• pp.5-9
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• 2007

The construction method for Foamed-Concrete has not been important due to following process of construction work. However, according to the code about enhance of energy saving design policy and impact noise, noised isolation has been used in construction site so that the resistance for cracking and capability for insulating of Foamed-Concrete has been required. Therefore, new alternatives are demanded. Optimum mixing design, which can get the improvement of insulation and resistance of crack for Foamed-Concrete adding EVA chip, was derived and also the device, applying to construction site, was invented to equalize quality. This device can measure quantity of all input and placement, and show up the sum of placement and mixing design on a touch screen. This valuable construction method is friendly environment and recycling method because of using EVA chip, by-product of an EVA insole scrap burned or embedded, as a light-weight aggregate.

• Journal of the Korean Institute of Telematics and Electronics
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• v.12 no.5
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• pp.1-5
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• 1975

접합형 트린지스터와 발광다이오드(LED) 및 광도전소자(CdS)로서 구성된 광결합 전류안정부저항회로를 진안하였다. 이는 일반적으로 광트랜지스터보다도 더 예민한 것을 이용하여, CdS와 LED를 밀착 시켜서 LED에 흐르는 전류와 CdS의 실효저항변화로써 결합된 광결합방식을 택하였다. 트랜지스터의 콜랙터-에미터간에 인위적인 누변저항을 삽입하는 방법을 도입함으로써 부저항치 및 최대입력단자전압치를 임의로 변화할 수 있게 하였으며, 제안한 회로를 분석하고 또 이를 실험적으로 확인하였다. 누변저항을 1KΩ에서 30KΩ까지 변화시켰을 때 최대입력단자전압은 1.65V에서 4.22V로 변하였고, 부저항치는 -1.0KΩ에서 -10.0KΩ까지 변하였다. 또 실험치에 대한 계산치에의 상대백분최대오차가 11%이었다. A current stable negative resistance circuit has been constucted with combination of coulplementary symmetrical transistors, a light emitting diode and a photoconductive cell. The negative resistance(Rn) and break-over voltage(VBo) can be set at a designed value according to adjustment of the artificial leakage resistance of p-n-p transistor. The RN and VBo calculated in this designed circuit are checked though the experiments, the errors are found less than 11%.

• Transactions of the Korean Society of Automotive Engineers
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• v.23 no.3
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• pp.307-314
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• 2015

The purpose of this study is know the fuel economy of difference tractive resistance calculation methods on light duty low-floor bus. Two tractive resistance calculation methods(coastdown test and JFCM conversion formula) are tested to understand the difference of fuel economy. JFCM was developed for fuel economy regulations of heavy duty vehicle. That show a big difference as a result of the calculation using coastdown test and JFCM conversion formula. The difference of the tractive resistance affects the fuel economy.

• Transactions of the Korean Society of Automotive Engineers
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• v.13 no.4
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• pp.129-134
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• 2005

There is a strong industrial demand for the development of light-weight vehicle to improve fuel efficiency and dynamic performance. The effective method of achieving the weight reduction is to use low-density materials such as aluminum and magnesium. In applying these materials to the vehicle, it is often required to join dissimilar materials such as aluminum and steel. However, conventional joining method, namely resistance spot welding cannot be used in joining dissimilar materials. Self·piercing rivet(SPR) and adhesive bonding is a good alternative to resistance spot welding. In this study, the impact test of double hat-shaped member made by resistance spot welding, SPR and adhesive bonding was performed. As a result, various parameters of crashworthiness were analyzed and evaluated. Also, the applicability of SPR and adhesive bonding as an alternative to resistance spot welding was suggested.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.3
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• pp.234-239
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• 2011

In this study, the heat transfer capability have been improved by using via-holes in FR4 PCB, when the LED lighting is designed to solve the thermal problem. The thermal resistance and junction temperature were measured by changing the dimension of FR4 PCB and size of via hole. As a result, when the dimension was increased initially, the thermal resistance and junction temperature was decreased rapidly, the ones was stabilized after the dimension of 200 $[mm^2]$. Also, the light output was improved up to maximum 17% by formation of via-hole and expansion of dimension in FR4 PCB. Therefore, the thermal resistance and junction temperature could be improved by expansion of PCB dimension and configuration of via-hole ability.

• Steel and Composite Structures
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• v.43 no.4
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• pp.483-500
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• 2022

Cold-formed steel wall panels sheathed with gypsum plasterboard have shown superior thermal and structural performance in fire. Recent damage caused by fire events in Australia has increased the need for accurate fire resistance ratings of wall systems used in low- and mid-rise construction. Past fire research has mostly focused on light gauge steel framed (LSF) walls under uniform axial compression and LSF floors under pure bending. However, in reality, LSF wall studs may be subject to both compression and bending actions due to eccentric loading at the wall to-roof or wall-to-floor connections. In order to investigate the fire resistance of LSF walls under the effects of these loading eccentricities, four full-scale standard fire tests were conducted on 3 m × 3 m LSF wall specimens lined with two 16 mm gypsum plasterboards under different combinations of axial compression and lateral load ratios. The findings show that the loading eccentricity can adversely affect the fire resistance level of the LSF wall depending on the magnitude of the eccentricity, the resultant compressive stresses in the hot and cold flanges of the wall studs caused by combined loading and the temperatures of the hot and cold flanges of the studs. Structural fire designers should consider the effects of loading eccentricity in the design of LSF walls to eliminate their potential failures in fire.

• Current Photovoltaic Research
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• v.10 no.1
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• pp.28-32
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• 2022

We investigated the optical and electrical characteristics of ITO/Ag/ITO (IAI) 3-layer thin films prepared by using RF/DC sputtering. To measure the thickness of all thin film samples, we used scanning electron microscopy. As a function of Ag thickness we characterized the optical transmittance and sheet resistance of the IAI samples by using UV-Visible spectroscopy and Hall measurement system, respectively. While the thickness of both ITO thin films in the 3-layered IAI samples were fixed at 50 nm, we varied Ag layer thickness in the range of 0 nm to 11 nm. The optical transmittance and sheet resistance of the 3-layered IAI thin films were found to vary strongly with the thickness of Ag film in the ITO (50 nm)/Ag(t₀)/ITO (50 nm) thin film. For the best transparent conducting oxide (TCO) electrode, we obtained a 3-layered ITO (50 nm)/Ag (t₀ = 8.5 nm)/ITO (50 nm) that showed an avrage optical transmittance, AVT = 90.12% in the visible light region of 380 nm to 780 nm and the sheet resistance, R_□ = 7.24 Ω/□.

• Advances in nano research
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• v.17 no.2
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• pp.167-179
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• 2024

This study investigates the stability and performance of high-resistance badminton nets through the integration of reinforced lightweight materials. By focusing on the structural and economic impacts, the research aims to enhance both the durability and practicality of badminton nets in professional and recreational settings. Using a combination of advanced material engineering techniques and economic analysis, we explore the development of nets constructed from innovative composites. These composites offer improved resistance to environmental factors, such as weather conditions, while maintaining lightweight properties for ease of installation and use. The study employs high-order shear deformation theory and high-order nonlocal theory to assess the mechanical behavior and stability of the nets. Partial differential equations derived from energy-based methodologies are solved using the Generalized Differential Quadrature Method (GDQM), providing detailed insights into the thermal buckling characteristics and overall performance. The findings demonstrate significant improvements in net stability and longevity, highlighting the potential for broader applications in both the sports equipment industry and related economic sectors. By bridging the gap between material science and practical implementation, this research contributes to the advancement of high-performance sports equipment and supports the growth of the sport economy.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.88.1-88.1
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• 2015

In recent printed electronics technology, Photo-Sintering, a technique for sintering materials using a light source, has attracted attention as an alternative to time-consuming high-temperature thermal processes. The key principle of this technique is the selective heating of a strongly absorbent thin film, while preventing the heating of the transparent substrate by the light source. Many recent studies have used a flash lamp as the light source, and investigated the material-dependent effect of the width or intensity of the pulsed light. However, the flash lamp for sintering is not suitable for industry yet, because of needing too high power to sinter for a large scale. In energy-saving and large-scale sintering, LED technologies would be very useful in the near future. In this work, we investigated a sintering process for silver nanoparticles using UV-LED array. Silver nanoparticles in ink were inkjet-printed on a $1{\times}1cm$ area of a PET film and photo-sintered by 365 nm UV-LED module. A sheet resistance value as low as $72.6m{\Omega}/sq$ (2.3 - 4.5 times that of bulk silver) was obtained from the UV-LED sintering at 300 mW/cm2 for 50 min.

• Korean Journal of Materials Research
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• v.29 no.7
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• pp.443-450
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• 2019

Thermal management is a critical issue for the development of high-performance electronic devices. In this paper, thermal conductivity values of mild steel and stainless steel(STS) are measured by light flash analysis(LFA) and dynamic thermal interface material(DynTIM) Tester. The shapes of samples for thermal property measurement are disc type with a diameter of 12.6 mm. For samples with different thickness, the thermal diffusivity and thermal conductivity are measured by LFA. For identical samples, the thermal resistance($R_{th}$) and thermal conductivity are measured using a DynTIM Tester. The thermal conductivity of samples with different thicknesses, measured by LFA, show similar values in a range of 5 %. However, the thermal conductivity of samples measured by DynTIM Tester show widely scattered values according to the application of thermal grease. When we use the thermal grease to remove air gaps, the thermal conductivity of samples measured by DynTIM Tester is larger than that measured by LFA. But, when we did not use thermal grease, the thermal conductivity of samples measured by DynTIM Tester is smaller than that measured by LFA. For the DynTIM Tester results, we also find that the slope of the graph of thermal resistance vs. thickness is affected by the usage of thermal grease. From this, we are able to conclude that the wide scattering of thermal conductivity for samples measured with the DynTIM Tester is caused by the change of slope in the graph of thermal resistance-thickness.