Analysis of Thermal Properties in LED Package by Via-hole and Dimension of FR4 PCB |
Kim, Sung-Hyun
(Department of Information&Communication Engineering, Wonkwang University)
Lee, Se-Il (Department of Information&Communication Engineering, Wonkwang University) Yang, Jong-Kyung (Department of Information&Communication Engineering, Wonkwang University) Park, Dae-Hee (Department of Information&Communication Engineering, Wonkwang University) |
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