Browse > Article
http://dx.doi.org/10.4313/JKEM.2011.24.3.234

Analysis of Thermal Properties in LED Package by Via-hole and Dimension of FR4 PCB  

Kim, Sung-Hyun (Department of Information&Communication Engineering, Wonkwang University)
Lee, Se-Il (Department of Information&Communication Engineering, Wonkwang University)
Yang, Jong-Kyung (Department of Information&Communication Engineering, Wonkwang University)
Park, Dae-Hee (Department of Information&Communication Engineering, Wonkwang University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.24, no.3, 2011 , pp. 234-239 More about this Journal
Abstract
In this study, the heat transfer capability have been improved by using via-holes in FR4 PCB, when the LED lighting is designed to solve the thermal problem. The thermal resistance and junction temperature were measured by changing the dimension of FR4 PCB and size of via hole. As a result, when the dimension was increased initially, the thermal resistance and junction temperature was decreased rapidly, the ones was stabilized after the dimension of 200 $[mm^2]$. Also, the light output was improved up to maximum 17% by formation of via-hole and expansion of dimension in FR4 PCB. Therefore, the thermal resistance and junction temperature could be improved by expansion of PCB dimension and configuration of via-hole ability.
Keywords
LED; Via hole; FR4 PCB; Thermal resistance; Junction temperature;
Citations & Related Records
연도 인용수 순위
  • Reference
1 S .L .Chuang, IEEE J. Quant. Electron, 33, 970-979 (1997).   DOI
2 X. Luo, W. Xiong, T. Cheng, S. Liu, Electronic Components and Technology Conference, 59th (2009).
3 M. H. Shin, J. P. Kim, LED Introduction to Packaging Technology (Bookshill, 2009) p. 283.
4 EIA/JESD51-1, http://www.jedec.org (1995).
5 J. B. Kim, ELECTRONIC, 24, 6 (2009).
6 Dimitar Georgiev Todorov, Lazar Georgiev Kapisazov, ETTRENDS (2008).
7 J. Park, M. W. Shin, C. C. Lee, OPTICS LETTERS, 29, 2656 (2004).   DOI
8 S .L. Chuang, IEEE J. Quant. Electron, 33, 970 (1997).   DOI