• 제목/요약/키워드: LTPS TFT

검색결과 105건 처리시간 0.034초

Design of line memory with low-temperature poly-silicon(LTPS) thin-film transistor (TFT) for system-on-glass (SoG)

  • Choi, Jin-Yong;Min, Kyung-Youl;Yoo, Chang-Sik
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.417-420
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    • 2007
  • A 12k-bit SRAM has been developed for line memory of system-on-glass (SoG) with lowtemperature poly-silicon (LTPS) thin film transistor (TFT). For accurate sensing even with the large variation and mismatches in the characteristics of LTPS TFT, mismatch immune sense amplifier is developed. The SRAM shows 30ns read access time with 7V supply voltage while dissipating 4.05mW and 1.75mW for write and read operation, respectively

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New High Stability Excimer Laser for LTPS Manufacturing

  • Herbst, Ludolf;Paetzel, Rainer;Simon, Frank;Fechner, Burkhard
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.540-543
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    • 2006
  • LTPS TFT backplanes for AM OLED displays have advantages in regard to reliability and performance compared to TFT backplanes based on amorphous silicon. However, the requirements for homogeneous laser crystallization during LTPS process are much higher than for LCD backplanes. Most important is the energy stability of the laser source. In this paper we describe a new excimer laser which meets the requirements of LTPS manufacturing process with high homogeneity.

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열처리 온도 및 시간에 따른 ZTO TFT의 특성 변화

  • 한창훈;김동수;최병덕
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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    • pp.341-341
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    • 2011
  • 최근 AMOLED 구동이 가능한 소자에 대한 연구가 활발히 진행중이다. AMOLED구동 가능소자는 LTPS TFT, a-Si TFT, OTFT, Oxide TFT가 있으며 그 중에서 현재 대부분 LTPS TFT를 사용하고 있다. LTPS TFT는 높은 전자 이동도와 안정성을 가지고 있기 때문에 현재 각광 받는 AMOLED에 잘 맞는다. 하지만 LTPS TFT는 고비용, 250$^{\circ}C$ 이상의 공정온도, Substrate가 Glass, Metal로 제한 된다는 문제점이 있으며, 균일성이 낮고 현재 대면적 기술이 부족한 상태이다. 해결방안으로 AMOLED를 타겟으로 하는 Oxide TFT 기술이 떠오르고 있다. Oxide TFT는 이동도가 높고 저온공정이 가능하며 Substrate로 Plastic 기판을 사용할 수가 있어 차후에 Flexible 소자로서의 적용이 가능하다. 또한 기존의 진공장비 사용대신 용액공정이 가능하여 장비사용시간 및 절차를 단축시킬 수 있어 비용적인 유리함을 가지고 있다. Oxide TFT는 단결정 산화물과 다결정 복합 산화물 두 가지 범주를 가지고 있다. Oxide TFT의 재료물질은 ZnO, ZTO, IZO, SnO2, Ga2O3, IGO, In2O3, ITO, InGaO3(ZnO)5, a-IGZO이 있다. 본 연구에서는 산화물질 중 하나인 ZTO를 이용하여 TFT 소자를 제작하였다. 산화물 특성상 열처리 온도에 따라 형성되는 결정의 정도가 다르기 때문에 온도 및 시간 변수에 따른 ZTO의 특성변화에 초점을 맞추어 연구함으로서 최적화된 조건을 찾고자 실험을 진행하였다. 실험을 위한 기판으로 n-type wafer을 사용하였다. PE-CVD 장비를 이용하여 SiNx를 120 nm 증착하고, ZTO 용액을 spin-coating을 이용하여 channel layer을 형성하였다. 균일하게 형성된 ZTO의 결정을 위하여 200$^{\circ}C$, 300$^{\circ}C$, 400$^{\circ}C$, 500$^{\circ}C$에서 1시간, 3시간, 6시간, 10시간의 온도 및 시간 변수를 두어 공기 중에서 열처리 하였다. ZTO는 약 30 nm 두께로 형성되었다. Thermal evaporator를 이용하여 Source, Drain의 알루미늄 전극을 형성하고, wafer 뒷면에는 Silver paste를 이용하여 Gate전극을 만들었다. 제작된 소자를 dark room temperature에서 측정하였다.

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Development of New LTPS Process

  • Yi, Chung;Park, Kyung-Min;Choi, Pil-Mo;Kim, Ung-Sik;Kim, Dong-Byum;Kim, Chi-Woo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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    • pp.1024-1026
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    • 2004
  • We have developed the five mask $PMOS^1$ and the six mask CMOS process architecture for poly-Si TFT. In order to have a competitive process with that for a-Si TFT, the simple co-planar electrode structure whose data line electrode and pixel electrode are on the same plane was adopted. In addition, RGB + White four color $technology^2$ were applied to achieve high aperture ratio and transmittance. Using the aforementioned process architecture and four color technology, 2.0 inch qCIF transmissive micro-reflectance (TMR) device was successfully fabricated.

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Development of 2.32-inch $320{\times}350$ LTPS TFT-LCD for Advanced Mobile Phones Using SLS Technology

  • Zhang, Lintao;Kang, Myung-Koo;Lee, Joong-Sun;Park, Jong-Hwa;Joo, Seung-Yong;Moon, Kuk-Chul;Kim, Il-Kon;Kim, Sung-Ho;Park, Kyung-Soon;Yoo, Chun-Ki;Kim, Chi-Woo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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    • pp.1035-1037
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    • 2005
  • 2.32-inch $320{\times}350$ TFT-LCD with high resolution (206PPI) for advanced mobile phones could be successfully developed. The compact pixel design based on PMOS SLS technique is used to achieve this high resolution. Gate driver and part of data driver are integrated onto the glass substrate. High brightness (170cd) and contrast ratio (400:1) were obtained with very low flickering and crosstalk levels.

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LTPS (Low Temperature Poly Si) Technology Based on SLS (Sequential Lateral Solidification) Crystallization for Advanced Mobile Display

  • Kang, Myung-Koo;Kim, Hyun-Jae;Kim, Chi-Woo;Kim, Hyung-Guel
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.1756-1760
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    • 2006
  • LTPS technology based on SLS Crystallization was intensively reviewed. LTPS structure produced by SLS crystallization is composed of much larger grains compared with conventional ELA crystallization structure, which can give higher TFT performances. However, TFT performance uniformity and anisotropy problem should be solved for it to be used in mass production. TFT performance uniformity was from main grain boundary position and could be solved by equal defect area structure $(EDAS^{TM})$. TFT performance anisotropy could be also solved by multi-channel (MC) structure that can make parallel component in perpendicular channel direction. The higher TFT performances from SLS technology can make superior optical and/or electrical properties and has been adopted in mass production successfully.

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Low Temperature Poly-Si TFT Technology for Small Sized TFT-LCDs

  • Ha, Yong-Min
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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    • pp.42-45
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    • 2002
  • Small sized LTPS TFT-LCDs are developed and evaluated. Sine the fabrication process is optimized for the productivity of huge glass substrate, the pattern size is above 5${\mu}m$. The panels with integrated digital data drivers are not satisfactory to compete with a-Si technology. Therefore, LTPS panels are implemented by PMOS technology and it is proved that they can be competitive with a-Si TFT-LCDs in terms of performance and cost.

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SELAX Technology for Poly-Si TFTs Integrated with Amorphous-Si TFTs

  • Kaitoh, Takuo;Miyazawa, Toshio;Miyake, Hidekazu;Noda, Takeshi;Sakai, Takeshi;Owaku, Yoshiharu;Saitoh, Terunori
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.903-906
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    • 2008
  • We developed the advanced LTPS (A-LTPS) manufacturing process. The a-Si TFT process was combined with selectively enlarging laser crystallization (SELAX) technology to improve the carrier mobility in the region where the peripheral circuits are to be fabricated. A 2.4-inch IPS-pro LCD panel for personal digital assistant use was successfully fabricated using the developed technology.

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LTPS 공정 Diode Laser Annealing 방식을 이용한 Poly-Si 결정화

  • 이준기;김상섭
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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    • pp.336-336
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    • 2011
  • AMOLED에 대한 관심이 높아짐에 따라 LTPS (Low Temperature Poly Silicon) TFT에 대한 연구가 활발히 이루어지고 있다. 다결정 실리콘은 단결정 실리콘에 비해 100 cm2/V 이상의 이동도를 보이는 우수한 특성으로 인해 AMOLED 디스플레이에 적합하며 여러 기업에서 LTPS 공정을 이용한 TFT제작을 연구 중이다. LTPS 공정은 현재 ELA (Excimer Laser Annealing) 방식으로 대면적 유리기판에 ELA 방법을 적용함에 있어 설비투자 비용이 지나치게 높아진다는 단점을 가지고 있다. 설비투자 비용의 문제점을 해결하기 위해 Diode Laser을 이용하여 Annealing하는 방법에 대해 연구하였다. 본 연구는 Diode Laser Annealing 방식을 이용하여 poly-Si을 구현하였다. 단결정 실리콘을 제작하기 위해 ICP-CVD장비를 이용하여 150$^{\circ}C$에서 SiH4, He2 혼합, He/SiH4의 flow rate는 20/2[sccm], RF power는 400 W에서 700 W으로 가변, 증착 압력은 25mTorr으로 하였다. 940 nm 파장의 30 W Diode Laser를 8 mm Spot Size로 a-Si에 순간 조사하여 결정화, 그 결과 grain을 형성한 polycrystalline 구조를 확인하였다.

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Development of a New Hybrid Silicon Thin-Film Transistor Fabrication Process

  • Cho, Sung-Haeng;Choi, Yong-Mo;Kim, Hyung-Jun;Jeong, Yu-Gwang;Jeong, Chang-Oh;Kim, Shi-Yul
    • Journal of Information Display
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    • 제10권1호
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    • pp.33-36
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    • 2009
  • A new hybrid silicon thin-film transistor (TFT) fabrication process using the DPSS laser crystallization technique was developed in this study to realize low-temperature poly-Si (LTPS) and a-Si:H TFTs on the same substrate as a backplane of the active-matrix liquid crystal flat-panel display (AMLCD). LTPS TFTs were integrated into the peripheral area of the activematrix LCD panel for the gate driver circuit, and a-Si:H TFTs were used as a switching device of the pixel electrode in the active area. The technology was developed based on the current a-Si:H TFT fabrication process in the bottom-gate, back-channel etch-type configuration. The ion-doping and activation processes, which are required in the conventional LTPS technology, were thus not introduced, and the field effect mobility values of $4\sim5cm^2/V{\cdot}s$ and $0.5cm^2/V{\cdot}s$ for the LTPS and a-Si:H TFTs, respectively, were obtained. The application of this technology was demonstrated on the 14.1" WXGA+(1440$\times$900) AMLCD panel, and a smaller area, lower power consumption, higher reliability, and lower photosensitivity were realized in the gate driver circuit that was fabricated in this process compared with the a-Si:H TFT gate driver integration circuit