• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.10 no.5
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• pp.359-363
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• 2017

The LED (Liquid Emitting Diode) frame device is a big part of the representative display industry in Korea. LED is an essential part for TV, monitor, notebook, and mobile phone. In Japan, Taiwan, China and other countries, investment in LEDs has been strengthened, and productivity has become an important issue. However, as the size of the parts becomes smaller, the inconsistent inspection by the human eye becomes a problem of reliability, so that the automatic inspection process becomes an essential issue in the field of LED module inspection. In this paper, we investigate defects in visual inspection process using computer vision technology. The inspection of the LED frame is made quickly and accurately, thereby improving the efficiency of the process and shortening the inspection time. As a result of applying the inspection system to the field, we confirmed that it is possible to inspect quickly and accurately.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.17-22
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• 2011

LEDs(Light Emitting Diodes) are becoming widely used and increasingly in demand. Quality inspection of the LEDs has become more important. Two-dimensional inspection systems are limited in inspection capability, so threedimensional(3-D) inspection systems are needed. In this paper, a cost-effective and simple 3-D measurement system of LED packages using phase measuring profilometry(PMP) is proposed. The proposed system uses a pico projector to project sinusoidal fringe patterns and to shift phases instead of piezocrystal. It was evaluated using extremely accurate gauge blocks, yielding excellent repeatability of about 12 um(3-sigma). 3-D measurements of various LED packages were performed to demonstrate the applicability and efficiency of the proposed system.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.46 no.5
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• pp.15-21
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• 2009

Deformity detection in a Light Emitting Diode (LED) is an important aspect for improving its quality. These LED deformities can be checked through several methods. This paper details the automatic deformity detection inspection system of a LED using the LabVIEW Builder 3.6 software. This software has a graphical user interface which makes it easy to observe and modify the behavior of its element. The LabVIEWs essential elements are also presented and explained aside from its image acquisition system. Details on how to build an inspection system and how to implement vision inspection algorithm which mainly consists of edge detection, geometry point location, and distance measurement are included in this paper.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.5
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• pp.2113-2120
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• 2013

In this study, an efficient machine vision based inspection system is developed for the in-line measurement of phosphor resin dispensing shapes on LED chip package. Since the phosphor resin (target material) has semitransparent characteristics, illuminated light beam is reflected from the bottom of the chip as well as from the surface. Since such phenomenon can deteriorate inspection reliability, a white LED and a 635nm laser slit beams are experimentally tested to decide suitable illumination optics. Also, specular and diffuse reflection methods are tested to decide suitable optical triangulation. As a result, it can be known that the combination of a white slit beam source and specular reflection method show the best inspection results. The Catmull-Rom spline interpolation is applied to the obtained data to form smoother surface. From the results, it can be conclude that the developed system can be sucessfully applied to the in-line inspection of LED chip packaging process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.6
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• pp.2624-2630
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• 2013

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead flame to provide enough strength for the next process. During the process, inspection processes are very important to detect exact locations of dispensed epoxy dots and to determine bonding status of dies whether they are lies at exact positions with sufficient bonding strength. In this study, a useful machine vision based inspection system is proposed for the LED die bonder. In the proposed system, 2 cameras are used for epoxy dot position detection and 2 cameras are sued for die attaching status determination. New vision processing algorithm is proposed, and its efficiency is verified through required field experiments. Measured position error is less than $X:-29{\mu}m$, $Y:-32{\mu}m$ and rotation error:$3^{\circ}$ using proposed vision algorithm. It is concluded that the proposed machine vision based inspection system can be successfully implemented on the developed die bonding system.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.6
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• pp.647-652
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• 2015

A probe pin is a key component of LED inspection equipment. The probe pin makes contact with the LED electrodes and supplies an electric current. Because the mechanical and electrical homogeneity of the probe surface affects the service life and reliability, its characterization is essential. For this study, the hardness was measured using a micro-Vickers hardness test. Moreover, the thicknesses of the plating at different locations and the elemental compositions were examined using an FE-SEM. The uniformity of the plating was found to be acceptable because palladium was detected consistently throughout the tested domain. In addition, the hardness of the surface was determined to be higher than that of the typical palladium range, which is attributed to the use of undercoated nickel.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.36-39
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• 1997

In this paper, we described an approach to design of precision optical system for visual inspection of solder joint defects of SMC(surface mount components) on PCBs(Printed Circuit Board). The illumination system, consisting of three tiered LED lamps and one main camera and four side view camera, is implemented to generated iso-contour on the solder joint according to gradient of the soldered surface. We analyze LED design parameter such as incident angle, diameter of LED ring, and so on to acquire uniform illumination.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2007.11a
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• pp.418-421
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• 2007

For Shock obsorber piston led is launched to the market through luring, milling, grooving, rolling, inspection and finally packing processes, To this time around 11 items, that is, out diameter and length etc..for the piston lod are inspected strictly as a total inspection. Piston Lod is being produced 30,000 a day and its excessively repeating inspection is getting induce repetition strain injury and reduce production rate as fatigue accumulation of worker increase inspection errors. Therefore, for the inspection process is severely needed a progressive improvement through the automation. In this study, we consider automation method of piston led inspection process and suggest an efficient automation strategy as improving the various problems in present manual inspection way.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.55-59
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• 2017

An optical method to inspect the 3-D shape of surface of Micro BGA is proposed, where spatially arranged LED light sources and specular reflection are considered. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED's in the image. Also, the statistics for all BGA's contained in a captured image are used together to find out the criteria for the detection of existing defects, and the usefulness of the proposed method is shown via experiments.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.4 no.2
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• pp.57-61
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• 2008

During the period of retubing work for the licensing renewal, the fuel channels, calandria tubes and feeders of CANDU Reactors will be replaced, and calandria visual examination will be performed. This period is a unique opportunity to inspect the inside of the calandria. The visual inspection for the calandria vessel and its internals of Wolsong NPP is scheduled for confirming the calandria integrity. The first visual inspection for the calandria is planned in Pt. Lepreau led by AECL. The visual inspection for Wolsong NPP, led by NETEC(Nuclear Engineering & Technology Institute) of KHNP, will employ 3D laser scanner and 3D CAD Mock-up for the first time in the world, in addition to a conventional video camera. The inspection system is composed of a robot with the 3D laser scanner, a video camera and a hardness meter.