• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.440-440
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• 2009

Semiconductor nanowires offer exciting possibilities as components of solar cells and have already found applications as active elements in organic, dye-sensitized, quantum-dot sensitized, liquid-junction, and inorganic solid-state devices. Among many semiconductors, silicon is by far the dominant material used for worldwide photovoltaic energy conversion and solar cell manufacture. For silicon wire to be used for solar device, well aligned wire arrays need to be fabricated vertically or horizontally. Macroscopic silicon wire arrays suitable for photovoltaic applications have been commonly grown by the vapor-liquid-solid (VLS) process using metal catalysts such as Au, Ni, Pt, Cu. In the case, the impurity issues inside wire originated from metal catalyst are inevitable, leading to lowering the efficiency of solar cell. To escape from the problem, the wires of purity of wafer are the best for high efficiency of photovoltaic device. The fabrication of wire arrays by the electrochemical etching of silicon wafer with photolithography can solve the contamination of metal catalyst. In this presentation, we introduce silicon wire arrays by electrochemical etching method and then fabrication methods of radial p-n junction wire array solar cell and the various merits compared with conventional silicon solar cells.

• Journal of the Korean Vacuum Society
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• v.12 no.4
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• pp.239-250
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• 2003

The reliability degradation phenomena in the SiGe hetero-junction bipolar transistor (HBT) are investigated in this review. In the case of the SiGe HBT the decrease of the current gain, the degradation of the AC characteristics, and the offset voltage are frequently observed, which are attributed to the emitter-base reverse bias voltage stress, the transient enhanced diffusion, and the deterioration of the base-collector junction due to the fluctuation in fabrication process, respectively. The reverse-bias stress on the emitter-base junction causes the recombination current to rise, increasing the base current and degrading the current gain, because hot carriers formed by the high electric field at the junction periphery generate charged traps at the silicon-oxide interface and within the oxide region. Because of the enhanced diffusion of the dopants in the intrinsic base induced by the extrinsic base implantation, the shorter distance between the emitter-base junction and the extrinsic base than a critical measure leads to the reduction of the cut-off frequency ($f_t$) of the device. If the energy of the extrinsic base implantation is insufficient, the turn-on voltage of the collector-base junction becomes low, in the result, the offset voltage appears on the current-voltage curve.

• Journal of Satellite, Information and Communications
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• v.8 no.1
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• pp.45-53
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• 2013

An electrostatic discharge (ESD) protection device, so called, N-type extended drain silicon controlled rectifier (NEDSCR) device, was analyzed for high voltage I/O applications. A conventional NEDSCR device shows typical SCR-like characteristics with extremely low snapback holding voltage. This may cause latch-up problem during normal operation. However, a modified NEDSCR device with proper junction/channel engineering using counter pocket source (CPS) ion implantation demonstrates itself with both the excellent ESD protection performance and the high latch-up immunity. Since the CPS implant technique does not change avalanche breakdown voltage, this methodology does not reduce available operation voltage and is applicable regardless of the operation voltage.

• Korean Journal of Materials Research
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• v.30 no.8
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• pp.421-425
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• 2020

A transparent quantum dot (QD)-based light-emitting diode (LED) with silver nanowire (Ag NW) and indium-tin oxide (ITO) hybrid electrode is demonstrated. The device consists of an Ag NW-ITO hybrid cathode (-), zinc oxide, poly (9-vinylcarbazole) (PVK), CdSe/CdZnS QD, tungsten trioxide, and ITO anode (+). The device shows pure green-color emission peaking at 548 nm, with a narrow spectral half width of 43 nm. Devices with hybrid cathodes show better performances, including higher luminance with higher current density, and lower threshold voltage of 5 V, compared with the reference device with a pure Ag NW cathode. It is worth noting that our transparent device with hybrid cathode exhibits a lifetime 9,300 seconds longer than that of a device with Ag NW cathode. This is the reason that the ITO overlayer can protect against oxidization of Ag NW, and the Ag NW underlayer can reduce the junction resistance and spread the current efficiently. The hybrid cathode for our transparent QD LED can applicable to other quantum structure-based optical devices.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.83-84
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• 2005

생명체의 근육을 구성하는 근섬유와 마찬가지로 나노선 구동기는 불규칙적으로 엉켜있는 나노선들의 집합으로 이루어져 있으며, 기존의 강유전체에 기반을 둔 구동기에 비해 낮은 구동전압과 높은 일률을 가진다. 대표적인 나노선인 MWCNTs(Multi-walled Carbon Nanotubs)와 $V_2O_5$ 나노선을 이용한 구동기는 이미 각각 시현된 바 있으나, 이 둘의 이종접합을 통한 구동기는 아직까지 보고되지 않았다. 본 연구에서는 탄소나노튜브와 $V_2O_5$의 이종접합을 통해 필름 형태의 구동기를 구현하여 각각의 나노선 만을 이용했을 때보다 월등한 성능을 보여주는 구동기를 구현하였다. 향후 실용화 가능성을 염두에 두어, 보다 강건하고 최적화된 나노선 sheet의 합성과 구동기의 구조적 향상이 이루어진다면 그동안 알려진 그 어떤 물질보다도 우수한 구동특성을 보여줄 것이라 예상된다.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.3
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• pp.82-88
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• 2015

This paper presents a design of the enable switch circuit, which is consist of discrete device at smart junction box(SJB) board. The Enable switch circuit, which receives ignition signal (IG) for input, sends a drive signal to linear regulator and other elements. The circuit design is carried out in a BCDMOS $0.18{\mu}m$ technology, and the performances are verified through simulations according to AEC-Q100 and ISO 7637-2. Die area of the designed Enable switch circuit is $1.67mm{\times}0.54mm$ in layout, and it is shown that the die can be housed in $3mm{\times}3mm$ HVSON8 package. The designed enable switch circuit is expected to be widely adopted in various automotive SJB's since it can significantly reduce the overall printed circuit board form factor.

• Korean Journal of Materials Research
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• v.27 no.2
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• pp.107-112
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• 2017

The BCBJ (Back Contact and Back Junction) or back-lit solar cell design eliminates shading loss by placing the pn junction and metal electrode contacts all on one side that faces away from the sun. However, as the electron-hole generation sites now are located very far from the pn junction, loss by minority-carrier recombination can be a significant issue. Utilizing Medici, a 2-dimensional semiconductor device simulation tool, the interdependency between the substrate thickness and the minority-carrier recombination lifetime was studied in terms of how these factors affect the solar cell power output. Qualitatively speaking, the results indicate that a very high quality substrate with a long recombination lifetime is needed to maintain the maximum power generation. The quantitative value of the recombination lifetime of minority-carriers, i.e., electrons in p-type substrates, required in the BCBJ cell is about one order of magnitude longer than that in the front-lit cell, i.e., $5{\times}10^{-4}sec$ vs. $5{\times}10^{-5}sec$. Regardless of substrate thickness up to $150{\mu}m$, the power output in the BCBJ cell stays at nearly the maximum value of about $1.8{\times}10^{-2}W{\cdot}cm^{-2}$, or $18mW{\cdot}cm^{-2}$, as long as the recombination lifetime is $5{\times}10^{-4}s$ or longer. The output power, however, declines steeply to as low as $10mW{\cdot}cm^{-2}$ when the recombination lifetime becomes significantly shorter than $5{\times}10^{-4}sec$. Substrate thinning is found to be not as effective as in the front-lit case in stemming the decline in the output power. In view of these results, for BCBJ applications, the substrate needs to be only mono-crystalline Si of very high quality. This bars the use of poly-crystalline Si, which is gaining wider acceptance in standard front-lit solar cells.

• 대한공업교육학회지
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• v.33 no.1
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• pp.249-264
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• 2008

In this dissertation, shallow $p^+-n$ junctions were formed by ion implantation and dual-step annealing processes and a new simulator is designed to model boron diffusion in silicon. This simulator predicts the boron distribution after ion implantation and annealing. The dopant implantation was performed into the crystalline substrates using $BF_2$ ions. The annealing was performed with a RTA(Rapid Thermal Annealing) and a FA(Furnace Annealing) process. The model which is used in this simulator takes into account nonequilibrium diffusion, reactions of point defects, and defect-dopant pairs considering their charge states, and the dopant inactivation by introducing a boron clustering reaction. FA+RTA annealing sequence exhibited better junction characteristics than RTA+FA thermal cycle from the viewpoint of sheet resistance and the simulator reproduced experimental data successfully. Therefore, proposed diffusion simulator and FA+RTA annealing method was able to applied to shallow junction formation for thermal budget. process.

• Journal of Satellite, Information and Communications
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• v.9 no.3
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• pp.15-21
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• 2014

An electrostatic discharge (ESD) protection device, so called, N-type embedded silicon controlled rectifier (NESCR), was analyzed for high voltage operating I/O applications. A conventional NESCR standard device shows typical SCR-like characteristics with extremely low snapback holding voltage, which may cause latch-up problem during normal operation. However, our modified NESCR_CPS_PPW device with proper junction/channel engineering such as counter pocket source (CPS) and partial P-well structure demonstrates highly latch-up immune current-voltage characteristics with high snapback holding voltage and on-resistance.

• Journal of Biomedical Engineering Research
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• v.25 no.1
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• pp.65-70
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• 2004

In this paper, we described 23 cases of animal experiment with our pneumatic ventricular assist device and new durability-improvement method. The blood pump consists of blood housing, and back plate made by the injection molding of isoplast, and the diaphragm fabricated by dipping of polyurethane solution onto the aluminum mold. Its volume was 75 $m\ell$ and in-vitro test showed that maximum output was 4.5 $\ell$/min at the 100 mmHg. The adult female sheep with weight of 50 ＋ 10 kg were employed for tile in-vivo experiments and the mean blood flow was sustained at 3.0 1/min. 4 animals survived more than 15 days and the longest survival time was 28 days. In the prior 10 cases, the major causes of death were the tearing of diaphragm at the diaphragm to blood housing junction. By the new mesh and alumina ball milling methods, the durability was enhanced, and its qualitative and quantitative improvement was proved via the in-vivo and in-vitro methods. Animal experiments demonstrated that all the physiologic parameters a ere maintained within the permissible ranges and no thrombus formation was observed through the visual and blood test. The in-vivo experiments demonstrated our pneumatic ventricular assist device to he one month's bridge to transplantation device.