• Journal of Welding and Joining
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• 제23권5호
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• pp.14-19
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• 2005

In high speed $CO_2$ welding, it has been blown to produce no sound bead with undercut or humping bead. In this study welding phenomena through synchronized high speed camera and output welding voltage and current waveform has been analyzed. For the purpose to improve a welding bead, effect of short circuit current rise slope has been examined. With commercial power source it was produced no sound bead by instantaneous short circuit, long arc period and stubbing at welding speed 2.5mm/min Humping bead or undercut were showed by instantaneous short circuit and long arc period. Also, the weld bead was not formed during the long short circuit period after stubbing start and long arc extinguishment period after wire sticking by failure of arc regeneration, because the droplet was not transferred to weld pool. With increasing short circuit current rise slope the frequency of stubbing was decreased and the normal short circuit rate was increased. A control of short circuit current rise slope was effective factor in high speed welding.

• 한국생산제조학회지
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• 제19권1호
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• pp.108-113
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• 2010

Decreasing products lifecycles and increasing consumers desires for quality and design make the automotive industries try to reduce time for developing new designs. In order to reduce developing time, I have designed head lamps, which are really important to have an effect on brand identities and images, using layers concept that is one of the international automotive design trends by alias and photoshop, and produced prototype by RP. To assemble the produced prototype to the body and manufacture the frame to exterior modelling efficiently, I have studied on joining dissimilar materials of aluminum alloy that can make the prototype lighter and stainless steel, which is good for corrosion resistance by using laser beam. These materials were welded for finding the optimum joining condition and evaluating the soundness of joining zone. The joining was performed under the condition of laser power 500, 550, 575, 600W and 11~14Hz. In this study, the suitable joining condition between aluminum alloy (Al 2024) and stainless steel (STS 304) can be obtained at the laser power 575W and frequency 12Hz.

• Journal of Welding and Joining
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• 제33권3호
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• pp.12-18
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• 2015

The ultimate goal of developing body is revealed the "lightweight" at latest EuroCarBody conference 2012 and the most core technology is joining process to make lightweight car body design. Accordingly, in this study, the car body assembly line for the assembly process applies to any introduction, particularly in the assembly of aluminum alloy and composite materials applied by the process for the introductory approached. Process were largely classified by welding (laser, arc, resistance, and friction stir welding), bonding (epoxy bonding) and mechanical fastening (FDS, SPR, Bolting and clinching). Applications for each process issues in the case and the applicable award was presented, based on the absolute strength of the test specimens and joining characteristics for comparative analysis were summarized. Finally, through this paper, we would tried to establish the characteristics of the joint for lightweight structure.

• 한국안전학회지
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• 제26권4호
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• pp.1-6
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• 2011

New methods for joining sheet of metal are being sought. One of the most promising methods is MPJ (mechanical press joining). It has been used in thin metal work because of its simple process and relative advantages over other methods, as it requires no fasteners such as bolts or rivets, consumes less energy than welding, and produces less ecological problems than adhesive methods. In this study, the joining process and static behavior of single overlap joints has been investigated. During fixed die type joining process for SPCC plates, the optimal applied punching force was found. The maximum tensile-shear strength of the specimen produced at the optimal punching force was 1.75 kN. The FEM analysis result on the tensile-shear specimen showed the maximum von-Mises stress of 373 MPa under the applied load of 1.7 kN, which is very close to the maximum tensile strength of the SPCC sheet(= 382 MPa). This suggests that the FEM analysis is capable of predicting the maximum tensile load of the joint.

• Journal of Welding and Joining
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• 제24권6호
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• pp.28-32
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• 2006

Laser Transmission Joining (LTJ), which is a joining process of polymers by using different transmission rates of materials, was studied numerically. Unlike previous studies, energy loss by reflection at the surface was included. Besides, energy absorbed in the transparent substrate is also considered to increase the accuracy of the analytical results. Furthermore, thermal deformations of the substrates were also calculated. Temperature distribution of the substrates on the joining process could be effectively predicted by using the thermal analysis model developed, which could also analyze the rising phenomenon of the absorbing substrate by bulge effect. Calculated results show that temperature of the absorbing substrate is higher than that of transparent substrate when the laser is being radiated, and this temperature difference causes more thermal deformation in absorbing substrate, which results in the surface rise of the absorbing substrate. Comparison of calculated results with corresponding experimental results could confirm the validity of the numerical analysis model proposed.

• 소성∙가공
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• 제13권4호
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• pp.342-349
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• 2004

The form-joining process (or clinching) uses a set of die and punch to impose the plastic deformation-induced geometric constraint on a sheet metal pair. The joining strength from the process ranges 50-70 percent of that of the resistance spot welding. In this paper, a new form-joining process with the aid of an adhesive is proposed in which an epoxy adhesive is applied to a sheet metal pair, and before it cures the pair is clinched to cause the geometric constraint in the form of a protrusion. In order to reduce the forming load and the height of protrusions, a new die and punch set with a very small clearance is devised to reduce the depth of drawing and the forming load. Taguchi method is employed to find the optimal values of design parameters. To implement each case of the orthogonal array, the finite element method is used. The experiments show that in the tensile-shear test, the bonding strength of the new form-joining process with an epoxy adhesive is approximately the same as that of the resistance spot welding; and in comparison with the other two form-joining processes with an epoxy adhesive, the height of protrusions is reduced by more than 65 percent and the forming load by 50 percent.

• 소성∙가공
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• 제18권5호
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• pp.392-400
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• 2009

Clinching is a method of joining sheet metals together. This process can be substituted for the resistance spot welding on the joining of aluminum alloys. However, the joining strength of the clinching is lower than that of welding and riveting. The objective of this paper is to evaluate the effect of shape parameters of tools on the joining strength of the clinching and to optimize clinching tools. Twelve parameters have been selected as shape parameters on the clinching tools such as punch and die. The design of experiments (DOE) method is employed to investigate the effect of the shape parameters of tools on the joining strength of the clinching. The neck thickness and undercut of the clinched sheet metal after the clinching, and the separation load at detaching are estimated from the result of FEA using DEFORM. Optimal combination of shape parameters to maximize the joining strength of clinching is determined on the basis of the result of DOE and FEA. In order to validate the result of DOE and FEA, the experiment of clinching is performed for the optimal combination of shape parameters. It is shown from the result of the experiment that optimization of shape parameters improves the joining strength of clinching.

• Journal of Welding and Joining
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• 제29권6호
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• pp.65-70
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• 2011

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

• Advances in materials Research
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• 제8권1호
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• pp.47-73
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• 2019

Joining of Mg/Ti hybrid structures by welding for automotive and aerospace applications has attracted great attention in recent years due mainly to its potential benefit of energy saving and emission reduction. However, joining them has been hampered with many difficulties due to their physical and metallurgical incompatibilities. Different joining processes have been employed to join Mg/Ti, and in most cases in order to get a metallurgical bonding between them was the use of an intermediate element at the interface or mutual diffusion of alloying elements from the base materials. The formation of a reaction product (in the form of solid solution or intermetallic compound) along the interface between the Mg and Ti is responsible for formation of a metallurgical bond. However, the interfacial bonding achieved and the joints performance depend significantly on the newly formed reaction product(s). Thus, a thorough understanding of the interaction between the selected intermediate elements with the base metals along with the influence of the associated welding parameters are essential. This review is timely as it presents on the current paradigm and progress in welding and joining of Mg/Ti alloys. The factors governing the welding of several important techniques are deliberated along with their joining mechanisms. Some opportunities to improve the welding of Mg/Ti for different welding techniques are also identified.

• 한국정밀공학회지
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• 제31권10호
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.