• Journal of the Microelectronics and Packaging Society
• /
• v.9 no.1
• /
• pp.35-41
• /
• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of micro-electronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder bump and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6/Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• Korean Journal of Materials Research
• /
• v.18 no.1
• /
• pp.38-44
• /
• 2008

The micro-structural changes, strength characteristics, and micro-fractural behaviors at the joint interface between a Sn-4.0wt%Ag-0.5wt%Cu solder ball and UBM treated by isothermal aging are reported. From the reflow process for the joint interface, a small amount of intermetallic compound was formed. With an increase in the isothermal aging time, the type and amount of the intermetallic compound changed. The interface without an isothermal treatment showed a ductile fracture. However, with an increase in the aging time, a brittle fracture occurred on the interface due mainly to the increase in the size of the intermetallic compounds and voids. As a result, a drastic degradation in the shear strength was observed. From a microshear test by a scanning electron microscope, the generation of micro-cracks was initiated from the voids at the joint interface. They propagated along the same interface, resulting in coalescence with neighboring cracks into larger cracks. With an increase in the aging time, the generation of the micro-structural cracks was enhanced and the degree of propagation also accelerated.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 1998.04b
• /
• pp.11-12
• /
• 1998

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2001.11a
• /
• pp.107-107
• /
• 2001

• Journal of Welding and Joining
• /
• v.20 no.3
• /
• pp.16-23
• /
• 2002

• Korean Journal of Materials Research
• /
• v.31 no.1
• /
• pp.38-42
• /
• 2021

In this study, high temperature wetting analysis and AZ80/Ti interfacial structure observation are performed for the mixture of AZ80 and Ti, and the effect of Al on wetting in Mg alloy is examined. Both molten AZ80 and pure Mg have excellent wettability because the wet angle between molten droplets and the Ti substrate is about 10° from initial contact. Wetting angle decreases with time, and wetting phenomenon continues between droplets and substrate; the change in wetting angle does not show a significant difference when comparing AZ80-Ti and Mg-Ti. As a result of XRD of the lower surface of the AZ80-Ti sample, in addition to the Ti peak of the substrate, the peak of TiAl3, which is a Ti-Al intermetallic compound, is confirmed, and TiAl3 is generated in the Al enrichment region of the Ti substrate surface. EDS analysis is performed on the droplet tip portion of the sample section in which pure Mg droplets are dropped on the Ti substrate. Concentration of oxygen by the natural oxide film is not confirmed on the Ti surface, but oxygen is distributed at the tip of the droplet on the Mg side. Molten AZ80 and Ti-based compound phases are produced by thickening of Al in the vicinity of Ti after wetting is completed, and Al in the Mg alloy does not affect the wetting. The driving force of wetting progression is a thermite reaction that occurs between Mg and TiO2, and then Al in AZ80 thickens on the Ti substrate interface to form an intermetallic compound.

• Journal of Powder Materials
• /
• v.21 no.5
• /
• pp.338-342
• /
• 2014

In the present work, we investigated the mechanical alloying of binary Ga-Se(1:1) and Ga-Te(1;1) sysyems. The high-energy ball-milling was performed at $40^{\circ}C$ where one of constituents (Ga) is molten state. The purpose of the work was to see whether reactions between constituent elements are accelerated by the presence of a liquid phase. During the ball-milling, the liquid Ga phase completely disappeared and the resulting powders consist of nanocrystalline grain of ~20 nm with partly amorphized phases. However, no intermetallic compounds formed in spite of the presence of the liquid phases which has much higher diffusivity than solid constituents. By subsequent heat-treatments, the intermetallic compounds such as GaSe and GaTe formed at relatively low temperatures. The formation temperature of theses compound was much lower than those predicted by equilibrium phase diagram. The comparison of the ball-milled powders with un-milled ones indicated that the easy formation of intermetallic compound or allying occurs at low temperatures.

• Journal of Welding and Joining
• /
• v.21 no.2
• /
• pp.97-101
• /
• 2003

The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GID-111 was investigated. Bonds were fabricated using a series of holding times(0~7.2ks) at three different temperatures. The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of samples was evaluated. A TiW/Cu/electroplated Cu UBM structure was selected and the samples were aging treated to analyze the effect of intermetallic compounds with the time variations. An FIB technique was applied to the preparation of samples for TEM observations. An FIB technique is very useful to prepare TEM thin foil specimens from the solder joint interface. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the solder and the UBM was observed by using SEM, TEM and EDS. As a result, the shear strength was decreased of about 21% in the 100${\mu}{\textrm}{m}$ sample at 17$0^{\circ}C$ aging compared with the maximum shear strength of the sample with the same pad size. In the case of the 12$0^{\circ}C$ aging treatment, 18% of decrease in shear strength was measured at the 100${\mu}{\textrm}{m}$ pad size sample. An intermetallic compound of Cu6Sn5 and Cu3Sn were also observed through the TEM measurement by using.

• Journal of Korea Foundry Society
• /
• v.38 no.3
• /
• pp.55-59
• /
• 2018

To optimize the conductivity and to reduce the weight by as much as possible, Al-Cu composites were prepared through a suction-casting procedure. Pure copper metal foam was infiltrated by melted aluminum with the use of the vacuum, after which warm rolling was conducted to remove several remaining pores at the interface between the Cu foam and the aluminum matrix. Despite the short casting time, significant dissolution of Cu into the melt was observed. Moreover, it was found that various Al-Cu intermetallic compounds arose at the interface during the isothermal heating process after the casting and rolling steps. The average thickness of the Al-Cu intermetallic compound tended to increase in proportion to the heating time. The electrical and thermal conductivity levels of the cast composites were found to be comparatively low, mainly due to the dissolution of the Cu foam and the formation of intermetallics at the interface.

• Journal of Powder Materials
• /
• v.11 no.2
• /
• pp.105-110
• /
• 2004

In this study the possibility to obtain a homogeneous mixture and to produce solid solutions and intermetallic compounds of Fe and Al nano particles by simultaneous pulsed wire evaporation (S-PWE) have been investigated. The Fe and Al wires with 0.45 mm in diameter and 35 mm in length were continuously co-fed by a special mechanism to the explosion chamber and simultaneously exploded. The characteristics, e.g., phase composition, particle shape, and specific surface area of Fe-Al nano powders have been analyzed. The synthesized powders, beside for Al and $\alpha$-Fe, contain significant amount of a high-temperature phase of $\gamma$-Fe, Fe Al and traces of other intermetallics. The phase composition of powders could be changed over broad limits by varying initial explosion conditions, e.g. wire distance, input energy, for parallel wires of different metals. The yield of the nano powder is as large as 40 wt ％ and the powder may include up to 46 wt % FeAl as an intermetallic compound.