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The Growth Kinetics of Intermetallic Compound Layer in Lead-Free Solder Joints  

이창배 (성균관대학교 신소재공학과)
이창열 (성균관대학교 신소재공학과)
서창제 (성균관대학교 신소재공학과)
정승부 (성균관대학교 신소재공학과)
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Journal of Welding and Joining / v.20, no.3, 2002 , pp. 16-23 More about this Journal
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