The Growth Kinetics of Intermetallic Compound Layer in Lead-Free Solder Joints |
이창배
(성균관대학교 신소재공학과)
이창열 (성균관대학교 신소재공학과) 서창제 (성균관대학교 신소재공학과) 정승부 (성균관대학교 신소재공학과) |
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The reaciton between electroless Ni-Cu-P deposit and 63Sn-37Pb flip ship solder bumps during reflow
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DOI ScienceOn |
2 |
Reactive isothermal solidification in the Ni-Sn System
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DOI ScienceOn |
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4 |
Intermetallic compound layer formation beween copper and got-dipped 100In, 50In-50Sn, 100Sn and 63Sn-37Pb coatings
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DOI ScienceOn |
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Theory for intermetallic phase growth between Cu and liquid Sn-Pb solder based on grain boundary diffusion control
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DOI |
6 |
Metallurgy oflow temperature Pb-free solders for electronic assembly
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DOI ScienceOn |
7 |
Diffusion in solids
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8 |
The growth of intermetallinc compounds on common base materials coated with tin and tin-lead alloys
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Effect of surface finishes on ball shear strength in BGA joints with sn-3.5 mass% Ag solder
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Cu/Sn interfacial reactions: thin-film case versus bulk case
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DOI ScienceOn |
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Formation and growth of interfacial intermetallic layers in eutectic Sn-Ag solder and its composite solder joints
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DOI ScienceOn |
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Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substrates
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DOI ScienceOn |
14 |
Kinetic anlaysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening
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15 |
Solid state intermetallic compound growth between copper and high temperature, Tin-rich solders-Part 1: Experimental analysis
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DOI ScienceOn |
16 |
The dependence of the activation energies of intermetallic formation onthe composition of composite Sn/Pb solders
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17 |
Intermetallic compound growth on Ni, Au/Ni, and Pd/Ni substrates with Sn/Pb, Sn/Ag and Sn solder
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18 |
The formation and growth of intermetallic in composite solder
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DOI ScienceOn |
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21 |
The growth kinetics of intermetallic layer at the interface between Sn-3.5Ag base solder and (Cu, electroless Ni-P/Cu, immersion Au/Ni-P/Cu) substrate
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22 |
On the growth of alloy layer between solid copper and liquid tin
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23 |
The growth of Cu-Sn intermetallics at a pretinned copper/solder interface
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24 |
Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn Solder and Copper
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DOI ScienceOn |
25 |
Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate
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DOI ScienceOn |
26 |
Diffusion in the systems Iron-Tin and Copper-Tin
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27 |
Lead-free solder in microelectronics
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DOI ScienceOn |
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29 |
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30 |
Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging
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DOI |