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http://dx.doi.org/10.3740/MRSK.2008.18.1.038

In-situ Observation on Micro-Fractural Behavior and Strength Characteristics in Sn-4.0wt%Ag-0.5wt%Cu Solder Joint Interface  

Lee, Kyung-Keun (School of Advanced Materials Engineering, Chonbuk National Univerisity)
Choi, Eun-Geun (School of Advanced Materials Engineering, Chonbuk National Univerisity)
Chu, Yong-Ho (Research Institue of Advanced Materials Development, Chonbuk National Univerisity)
Kim, Jin-Soo (School of Advanced Materials Engineering, Chonbuk National Univerisity)
Lee, Byung-Soo (School of Advanced Materials Engineering, Chonbuk National Univerisity)
Ahn, Haeng-Keun (School of Advanced Materials Engineering, Chonbuk National Univerisity)
Publication Information
Korean Journal of Materials Research / v.18, no.1, 2008 , pp. 38-44 More about this Journal
Abstract
The micro-structural changes, strength characteristics, and micro-fractural behaviors at the joint interface between a Sn-4.0wt%Ag-0.5wt%Cu solder ball and UBM treated by isothermal aging are reported. From the reflow process for the joint interface, a small amount of intermetallic compound was formed. With an increase in the isothermal aging time, the type and amount of the intermetallic compound changed. The interface without an isothermal treatment showed a ductile fracture. However, with an increase in the aging time, a brittle fracture occurred on the interface due mainly to the increase in the size of the intermetallic compounds and voids. As a result, a drastic degradation in the shear strength was observed. From a microshear test by a scanning electron microscope, the generation of micro-cracks was initiated from the voids at the joint interface. They propagated along the same interface, resulting in coalescence with neighboring cracks into larger cracks. With an increase in the aging time, the generation of the micro-structural cracks was enhanced and the degree of propagation also accelerated.
Keywords
BGA solder ball; solder joint interface; intermetallic compound(IMC); micro-fracture behavior; in-situ observation;
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