• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.3
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• pp.122-126
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• 2006

In this study, composite materials were put to dry interfacial treatment by use of plasma technology It has been presented that the optimum parameters for the best wettability of the samples at the time of generation of plasma were oxygen atmosphere, 0.1 Torr of system pressure, 100 W of discharge power, and 3 minutes of discharge time. The decrease in surface potential of charged samples by corona discharge indicates that the amount of accumulated electrical charges reduces and the charges that have been injected lessen rapidly when the duration of UV irradiation increases. The surface resistivity and the tensile strength of plasma treated samples, a longer UV irradiation time resulted in decreased insulation.

• Journal of the Korean Society for Heat Treatment
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• v.33 no.6
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• pp.284-289
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• 2020

Since the dissimilar bonded interface usually consists of intermetallic compounds (IMCs) layer and cracks, their mechanical and electrical properties can be influenced by microstructure at interface between two different metals. In this study, the friction welded Cu-Al busbar, which is widely used to connect a secondary battery and their component, is selected to analyze the influence of interfacial characteristic on their tensile strength and electric conductivity. Then, the electrical characteristics of Cu busbar and Cu-Al busbar were investigated by thermal flow analysis and temperature rise test. In addition, the relationship between the maximum saturation temperature and the electrical conductivity were discussed in terms of interfacial characteristics of the friction welded Cu-Al busbar.

• Bulletin of the Korean Chemical Society
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• v.8 no.1
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• pp.19-26
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• 1987

A statistical thermodynamical treatment for polymer adsorption from solution is presented. The canonical partition function for the polymer solution in the presence of a surface or an impermeable interface is formulated on the basis of usual quasi-crystalline lattice model, Bragg-Williams approximation of random mixing, and Pak's simple treatment of liquid. The present theory gives the surface excess ${\Gamma}_{exc}$ and the surface coverage ${\phi}^s_2$ of the polymer as a function of the chain length x, the Flory-Huggins parameter x, the adsorption energy parameter $x_s$, and polymer concentration $v_2$. Present theory is also applicable to the calculation of interfacial tension of polymer solution against water. For the idealized flexible polymer, interfacial tensions according to our theory fit good to the experimental data to the agreeable degrees.

• Polymer(Korea)
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• v.37 no.3
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• pp.373-378
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• 2013

The interfacial adhesion strength is very important in $SiO_x$ deposited PC film for the barrier enhanced polycarbonate (PC) flexible substrate. In this study, PC films were treated by undercoating, UV/$O_3$ and low temperature plasma and then the effect of physical and chemical surface modifications on the interfacial adhesion strength between PC film and $SiO_x$ barrier layer were studied. It was found that untreated PC film shows significantly low interfacial adhesion strength due to the smooth surface and low surface free energy of PC. Low temperature plasma treatments resulted in the increase of both surface roughness and surface free energy due to etching and the appearance of polar molecules on the PC surface. However, UV/$O_3$ treatment only shows the increase of surface free energy by developed polar molecules on the surface. These surface modifications caused the enhancement of surface interfacial strength between PC film and $SiO_x$ barrier. In the case of undercoating, it was found that the increase of surface interfacial strength was achieved by adhesion between various acrylic acid on acrylate coated surface and $SiO_x$ without increase of polar surface energy. In addition, the barrier property is also improved by organic-inorganic hybrid multilayer structure.

• Composites Research
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• v.28 no.1
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• pp.22-27
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• 2015

Although it is important to have high strength of each of fiber and matrix, interface between fiber and matrix is most important. If NaCl water penetrates the interface, that area will be weak. So experiment about increasing interfacial strength is in process. In this study, the change of properties by mechanical, interfacial and micromechanical tests was observed after NaCl and aging treatment. The changes in mechanical properties of glass fiber were investigated using single-fiber tensile test. Interfacial properties between glass fiber and epoxy resin were evaluated using nondestructive acoustic emission (AE) and micromechanical test applied to fatigue test. Through change of fatigue properties, relative interfacial properties were evaluate. In conclusion, glass fiber diameter decreased and the reduction of mechanical and interfacial was observed with NaCl solution and aging treatment.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.52-59
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• 2023

The effects of dielectric curing temperature and temperature/humidity treatment conditions on the interfacial adhesion energies between Ti diffusion barrier/polybenzoxazole (PBO) dielectric layers were systematically investigated for Cu redistribution layer applications of fan-out wafer level package. The initial interfacial adhesion energies were 16.63, 25.95, 16.58 J/m² for PBO curing temperatures at 175, 200, and 225 ℃, respectively. X-ray photoelectron spectroscopy analysis showed that there exists a good correlation between the interfacial adhesion energy and the C-O peak area fractions at PBO delaminated surfaces. And the interfacial adhesion energies of samples cured at 200 ℃ decreased to 3.99 J/m² after 500 h at 85 ℃/85 % relative humidity, possibly due to the weak boundary layer formation inside PBO near Ti/PBO interface.

• Carbon letters
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• v.6 no.2
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• pp.106-110
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• 2005

In this work, the effects of atmospheric oxygen plasma treatment of carbon fibers on mechanical interfacial properties of carbon fibers-reinforced epoxy matrix composites was studied. The surface properties of the carbon fibers were determined by acid/base values, Fourier-transform infrared spectrometer (FT-IR), and X-ray photoelectron spectroscopy (XPS) analyses. Also, the crack resistance properties of the composites were investigated in critical stress intensity factor ($K_{IC}$), and critical strain energy release rate mode II ($G_{IIC}$) measurements. As experimental results, FT-IR of the carbon fibers showed that the carboxyl/ester groups (C=O) at 1632 $cm^{-1}$ and hydroxyl group (O-H) at 3450 $cm^{-1}$ were observed for the plasma treated carbon fibers, and the treated carbon fibers had the higher O-H peak intensity than that of the untreated ones. The XPS results also indicated that the $O_{1S}/C_{1S}$ ratio of the carbon fiber surfaces treated by the oxygen plasma led to development of oxygen-containing functional groups. The mechanical interfacial properties of the composites, including $K_{IC}$ (critical stress intensity factor) and $G_{IIC}$ (critical strain energy release rate mode II), were also improved for the oxygen plasma-treated carbon fibersreinforced composites. These results could be explained that the oxygen plasma treatment played an important role to increase interfacial adhesions between carbon fibers and epoxy matrix resins in our composite system.

• Journal of Korea Foundry Society
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• v.22 no.2
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• pp.89-96
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• 2002

This study examined the effects of adding Zn to Sn-3.5Ag solder on the microstructure changes and behavior of interface reaction of the solder joint with Cu substrate. The solder/Cu joints were examined with microscope to observe the characteristics of microstructure changes and interfacial reaction layer with aging treatment for up to 120 days at $150^{\circ}C$. Results of the microstructure changes showed that the microstructures were coarsened with aging treatment, while adding 1%Zn suppresses coarsening microstructures. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-1Zn at the aging temperature of $150^{\circ}C$. Through the SEM/EDS analysis of solder joint, it was proved that intermetallic layer was $Cu_6Sn_5$ phase and aged specimens showed that intermetallic layer grew in proportion to $t^{1/2}$, and the precipitate of $Ag_3Sn$ occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, $Cu_6Sn_5$ phase formed at the side of substrate and Cu-Zn-Sn phase formed at the other side in double layer. It seems that Cu-Zn-Sn phase formed at solder side did a roll of banrier to suppress the growth of the $Cu_6Sn_5$ layer during the aging treatment.

• Korean Journal of Metals and Materials
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• v.50 no.12
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• pp.939-948
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• 2012

A 3-ply clad metal consisting of aluminum and copper was fabricated by roll bonding process and the microstructures and mechanical properties of the roll-bonded and post-roll-bonding heat treated Cu/Al/Cu clad metal were investigated. A brittle interfacial reaction layer formed at the Cu/Al interfaces at and above $400^{\circ}C$. The thickness of the reaction layer increased from $12{\mu}m$ at $400^{\circ}C$ to $28{\mu}m$ at $500^{\circ}C$. The stress-strain curves demonstrated that the strength decreased and the ductility increased with heat treatment up to $400^{\circ}C$. The clad metal heat treated at $300^{\circ}C$ with no indication of a reaction layer exhibited an excellent combination of the strength and ductility and no delamination of layers up to final fracture in the tensile testing. Above $400^{\circ}C$, the ductility decreased rasxpidly with little change of strength, reflecting the brittle nature of the intermetallic interlayers. In Cu/Al/Cu clad heat treated above $400^{\circ}C$, periodic parallel cracks perpendicular to the stress axis were observed at the interfacial reaction layer. In-situ optical microscopic observation revealed that cracks were formed in the Cu layer due to the strain concentration in the vicinity of horizontal cracks in the intermetallic layer, promoting the premature fracture of Cu layer. Vertical cracks parallel to the stress axis were also formed at 15% strain at $500^{\circ}C$, leading to the delamination of the Cu and Al layers.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.11-18
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• 2011

The quantitative interfacial adhesion energy of the Cu-Cu direct bonding layers was evaluated in terms of the bonding temperature and Ar+$H_2$ plasma treatment on Cu surface by using a 4-point bending test. The interfacial adhesion energy and bonding quality depend on increased bonding temperature and post-annealing temperature. With increasing bonding temperature from $250^{\circ}C$ to $350^{\circ}C$, the interfacial adhesion energy increase from $1.38{\pm}1.06$ $J/m^2$ to $10.36{\pm}1.01$ $J/m^2$. The Ar+$H_2$ plasma treatment on Cu surface drastically increase the interfacial adhesion energy form $1.38{\pm}1.06$ $J/m^2$ to $6.59{\pm}0.03$ $J/m^2$. The plasma pre-treatment successfully reduces processing temperature of Cu to Cu direct bonding.