• Journal of Adhesion and Interface
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• v.20 no.1
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• pp.9-14
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• 2019

The change of three different reagents for electrical conductive paint using aircraft coating with elapsing time of exposure to different condition was investigated. Three different reagents were poured into the vial bottles, stored in air condition and room temperature and observed with elapsing days. In addition, adhesion property of paint was tried using cross cut tape test after storage of $N_2$ atmosphere. The weight of each different reagent was measured along with elapsing time. To confirm the change of chemical component with exposure of air atmosphere, FT-IR was performed. The weight of part A and Part B decreased slightly whereas the weight of part C decreased rapidly and the precipitation was remained. The part B was cured after exposure of $N_2$ atmosphere and the 2250 cm-1 from FT-IR peak decreased slowly at the same time. It was considered that the water contained in air accelerated the reaction of -NCO functional groups and it caused the curing whereas $N_2$ atmosphere not contained water and it resulted in the retardancy of curing.

• Journal of Adhesion and Interface
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• v.21 no.4
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• pp.143-155
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• 2020

Hydrophobic Organic-Inorganic (O-I) hybrid materials prepared by sol-gel process have been widely used at functional coating fields such as coatings for anti-corrosion, anti-icing, self-cleaning, anti-reflection. The key point for fabricating hydrophobic surface is to optimize the surface energy and roughness of the coating films. There are typical processes to control the surface energy and roughness which are 'In situ fabricating', 'Pre-fluorinating/Post-roughening', 'Pre-roughening/ Post-fluorinating'. In this study, particle-binder process was used for in-situ fabrication of hydrophobic coating films. Various O-I hybrid compounds prepared using several kinds of alkoxysilane compounds were used as a binder for silica nanoparticles at particle-binder process. To study effect of fluorine content and weight ratio of particle : binder on the hydrophobicity and surface morphology, Hydrophobic coating films were prepared onto glass substrate at various content of fluorine content of O-I hybrid binder and weight ratio of particle : binder. The coating films prepared using O-I hybrid binder (GPTi-HF10) having 10 wt% of fluorine content showed the highes water contact angle (107.52±1.6°). The coating films prepared at 1:3 weight ratio of GPTi-HF10 : silica nanoparticle exhibited the highest water contact angle (130.84±1.99°).

• Journal of the Microelectronics and Packaging Society
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• v.6 no.1
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• pp.51-58
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• 1999

The effects of glass composition on the wettability and reactivity with $ZrO_2$substrate was evaluated and fabrication variables and glass compositions was investigated. Various glass compositions was investigated. Alkaline earth silicate glass show good wettability and lower viscosity and crystallization of glass could be prevented by $B_2O_3$.The sealant glass begin to wet on $ZrO_2$substrate below $900^{\circ}C$ and porosity occurred in various glass compositions, the crystallization and porosity in the glass could be prevented by the addition of flux into glass composition. But flowability and reactivity of glass with $ZrO_2$substrate was enhanced. Processing variables should be optimized to reduce the porosity by enhancing the sintering of glass powder. Many silicate glasses were investigated for the applications of high temperature sealants. Wetting and bonding of glass was good enough to seal together between $ZrO_2$and other ceramic components of SOFC. But porosity and reaction layer were occurred in the sealant glass. It will be possible to produce glass sealant without porosity and reaction layer at the interface by optimization of processing variable and modify the glass compositions. In present study, wettability of glass-filler composite was investigated. The porosity, shape of filler and interfacial reactions of sealant glass with fillers were examined.

• Applied Chemistry for Engineering
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• v.7 no.2
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• pp.228-236
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• 1996

An electrolysis system with a vertically circulating mercury capillary bundle electrode was developed with a very large electrode area in a minimum space. This system was operated by forcedly feeding mercury and aqueous solution containing metal ion into a fiber bundle packed densely within a small porous glass tube. In order to test the characteristics and stability of the electrolysis system, the reduction voltammograms of uranyl and ferric ions were measured with changes of the mercury flow rate and the aqueous flow rate. The aqueous flow rate had a large effect on the electrochemical reaction of metal ion occurring at the interface between the mercury and the aqueous solution and had to be regulated as an appropriate value to have a good limiting current shape. The limiting current was linearly proportional to the aqueous flow rate, and complete reductions of uranyl and ferric ions were rapidly and continuously accomplished at the potential showing limiting current. With a mercury flow rate high enough to keep a capillary continuum of mercury in the fiber bundle, the mercury flow rate had almost no effect on the electrochemical reaction. This system was confirmed to be effective and stable enough to control rapidly and continuously the oxidation state of metal ions fed into the system under an appropriate aqueous flow rate.

• Composites Research
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• v.12 no.3
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• pp.84-90
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• 1999

High alumina cement(HAC) and polyvinyl alcohol(PVA) based macro-defect-free(MDF) cement composites were reinforced using short carbon fibers, 3mm in length, 1-4% in weight fraction and insoluble polymers such as polyurethane, epoxy, phenol resin, in order to increase mechanical properties and water stability. The specimens were manufactured by the low heat-press(warmpress) method. In addition, the interface and the cross-linking reaction of cement and polymers was also studied by the SEM and TEM. Flexural strength of HAC/PVA based MDF cementitious composites was proportionally decreased with increasing fiber contents due to the undensified structure around fibers. The flexural strength of insoluble polymer added specimen was decreased with increasing fiber contents, while water stability was dramatically improved. Epoxy resin added specimen showed the highest strength with increasing fiber contents, compared with other specimens. The water stability of fiber content 4% added specimen immersed in water presented about 95%, 87% at 3 and 7 days immersed in water, respectively. The interfacial adhesive strength of fiber-matrix was very much improved due to cross linking reaction of polymer and metal ions of cement. Tensile strength of insoluble polymers added composites as linearly increased with increasing the fiber contents. The epoxy resin added specimen also showed highest tensile strength. The 4% fiber added specimen presented 30~80% higher strength than controlled specimen.

• Science of Emotion and Sensibility
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• v.12 no.4
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• pp.519-530
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• 2009

Today various interfaces are created with the advancement of technology. The flat 2D and static interfaces are general in the past but 3D and motion factors are imported in user interfaces today. It is important to use the motion factors adequately appropriate timing, situation and so on. This study focuses on the motion factor, especially the squash & stretch principle which affects the style of movement. This study investigates the effect of cartoon style(squash & stretch principle) for motion on attraction, emotion and attention. In experiment 1, participants evaluated attraction and emotion words relating to movement after they saw spheres applied to squash & stretch principle and spheres not applied to. The results indicate the squash & stretch principle can make motion not only more attractive but also brighter and more active than the general motion. In experiment 2, a sphere applied to squash & stretch principle and a sphere not applied to were presented at the same time and we measured the reaction time when participants detected change in one of the two spheres. As a result, the reaction time was faster when a sphere applied to squash & stretch principle changed. This suggests that the squash & stretch principle can make motion attract the attention of users.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.47-53
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• 2015

The effects of electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the in-situ intermetallics reaction and the electromigration (EM) reliability of Sn-3.0Ag-0.5Cu (SAC305) solder bump were systematically investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of the ENIG surface finish at solder top side, while at the OSP surface finish at solder bottom side,$ Cu_6Sn_5$ and $Cu_3Sn$ IMCs were formed. Mean time to failure on SAC305 solder bump at $130^{\circ}C$ with a current density of $5.0{\times}10^3A/cm^2$ was 78.7 hrs. EM open failure was observed at bottom OSP surface finish by fast consumption of Cu atoms when electrons flow from bottom Cu substrate to solder. In-situ scanning electron microscope analysis showed that IMC growth rate of ENIG surface finish was much lower than that of the OSP surface finish. Therefore, EM reliability of ENIG surface finish was higher than that of OSP surface finish due to its superior barrier stability to IMC reaction.

• Applied Chemistry for Engineering
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• v.8 no.3
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• pp.395-402
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• 1997

The $SiO_2$ films were prepared by ECR(electron cyclotron resonance) plasma diffusion method, Deal-Grove model and Wolters-Zegers-van Duynhoven model were used to estimate the oxidation rate which was correlated with surface morphology for different orientation of Si(100) and Si(111). It was seen the $SiO_2$ thickness increased linearly with initial oxidation time. But oxidation rate slightly decrease with oxidation time. It was also shown that the oxidation process was controlled by the diffusion of the reactive species through the oxide layer rather than by the reaction rate at the oxide interface. The similar time dependency has been observed for thermal and plasma oxidation of silicon. From D-G model and W-Z model, the oxidation rate of Si(111) was 1.13 times greater than Si(100) because Si(111) had higher diffusion and reaction rate, these models more closely fits the experimental data. The $SiO_2$ surface roughness was found to be uniform at experimental conditions without etching although oxidation rate was increased, and to be nonuniform due to etching at experimental condition with higher microwave power and closer substrate distance.

• Applied Chemistry for Engineering
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• v.9 no.4
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• pp.565-568
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• 1998

Amphipathic compounds (bis-sulfonate Gemini type) with double or triple long chain alkyl groups were prepared by the reaction of N-(long chain acyl)diethanolamine diglycidyl ethers with fatty alcohols, followed by the reaction with propanesultone. All these new Gemini type surfactants were soluble in water and showed much better micelle forming ability and lowering surface tension than sodium dodecyl sulfonate with one sulfonate group. cmc and ${\Upsilon}$ cmc values of the triple-chain compounds were still much smaller than those of the corresponding double-chain compounds with two common alkyl groups. The efficiency of adsorption at the water/air interface ($pC_{20}$) of these surfactants was very high. Their foaming properties, wetting ability toward a felt chip, and lime-soap dispersing requirement (LSDR) were measured. Their initial foaming properties were high but showed good low foam stability, wettability and LSDR.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.95-103
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• 2005

The interfacial reaction between 42Sn-58Bi solder (in wt.$\%$ unless specified otherwise) and electroless Ni-P/immersion Au has been investigated before and after thermal aging, with a focus on formation and growth of an intermetallic compound (IMC) layer, consumption of under bump metallurgy (UBM), and bump shear strength. The immersion Au layer with thicknesses of 0 (bare Ni), 0.1, and $1{\mu}m$ was plated on the $5{\mu}m$ thick electroless Ni-P ($14{\~}15 at.\%$P) layer. Then, the 42Sn-58Bi solder balls were fabricated on three different UBM structures by screen-printing and pre-reflow. The $Ni_3Sn_4$ layer (IMC1) was formed at the joint interface after pre-reflow for all the three UBM structures. On aging at $125^{\circ}C$, a quaternary phase (IMC2) was observed above the $Ni_3Sn_4$ layer in the Au-containing UBM structures, which was identified as $Sn_{77}Ni{15}Bi_6Au_2$ (in at.$\%$). The thick $Sn_{77}Ni{15}Bi_6Au_2$ layer deteriorated the integrity of the solder joint and the shear strength of the solder bump was decreased by about $40\%$ compared with non-aged joints.