Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 12 Issue 2 Serial No. 35
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- Pages.95-103
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- 2005
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Interfacial Reaction between 42Sn-58 Bi Solder and Electroless Ni-P/Immersion Au UBM during Aging
시효 처리에 의한 42Sn-58Bi 솔더와 무전해 Ni-P/치환 Au UBM 간의 계면 반응
- Cho Moon Gi (Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology) ;
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Lee Hyuck Mo
(Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology) ;
- Booh Seong Woon (Computational Science Engineering Center, Samsung Advanced Institute of Technology) ;
- Kim Tae-Gyu (Computational Science Engineering Center, Samsung Advanced Institute of Technology)
- Published : 2005.06.01
Abstract
The interfacial reaction between 42Sn-58Bi solder (in wt.
42Sn-58Bi 솔더(이하 wt.