• 동력기계공학회지
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• 제14권3호
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• pp.52-57
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• 2010

Interlaminar stresses near the free edges of composite laminates have been analyzed considering wall effects. Interface modeling of bonding layer was introduced to explain the wall effect. Using Lekhnitskii stress functions and the principle of complementary virtual work, the interlaminar stresses were obtained, which satisfied the traction free boundary conditions not only at the free edges, but also at the top and bottom surfaces of laminates. The interface modeling provides not singular stresses but concentrated finite interlaminar stresses. The significant amount of reductions of stresses at the free edge are observed compared to the results without interface modeling. The real stress state can be predicted accurately and the results demonstrate the usefulness of the proposed interface modeling for the strength design of composite laminates.

• 마이크로전자및패키징학회지
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• 제28권2호
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• pp.65-70
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• 2021

본 연구에서는 레이저 접합 공정을 이용하여 flame retardant-4 (FR-4) 인쇄회로기판 (printed circuit board, PCB)의 organic solderability preservative (OSP) 표면처리 된 Cu pad와 전자부품을 Sn-57Bi-1Ag 저온 솔더 페이스트로 접합을 한 후 접합부의 계면 특성과 기계적 특성에 대하여 보고 하였다. 레이저 접합 공정은 레이저 파워 및 시간 등을 다르게 진행하여 접합 공정 조건이 접합부의 계면 및 기계적 특성에 미치는 영향을 살펴보았다. 레이저 접합 공정의 산업적 적용을 위하여 산업적으로 많이 이용되고 있는 리플로우 접합 공정을 이용한 접합부의 특성과도 비교 하였다. 레이저 접합 공정 적용 결과 2, 3 s의 짧은 공정 시간에도 계면에 Cu₆Sn₅ 금속간화합물 (intermetallic compound, IMC)를 생성하여 접합부를 안정적으로 형성함을 확인 하였다. 또한, 리플로우 공정과 비교해 보았을 때 레이저 접합 공정을 적용할 경우 접합부의 보이드 형성이 억제됨을 확인할 수 있었으며 접합부의 전단강도도 리플로우 공정 접합부보다 높은 기계적 강도를 나타냈다. 따라서, 레이저 접합 공정을 적용할 경우 짧은 접합 공정 시간에도 불구하고 안정적인 접합부 형성 및 높은 기계적 강도를 확보할 수 있는 것으로 기대된다.

• Journal of Welding and Joining
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• 제26권3호
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• pp.30-36
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• 2008

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

• Steel and Composite Structures
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• 제19권3호
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• pp.569-583
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• 2015

Recent years, explosive welding structures have been widely used in many engineering fields. The bonding state detection of explosive welding structures is significant to prevent unscheduled failures and even catastrophic accidents. However, this task still faces challenges due to the complexity of the bonding interface. In this paper, a new method called dual-tree complex wavelet transform based permutation entropy (DTCWT-PE) is proposed to detect bonding state of such structures. Benefiting from the complex analytical wavelet function, the dual-tree complex wavelet transform (DTCWT) has better shift invariance and reduced spectral aliasing compared with the traditional wavelet transform. All those characters are good for characterizing the vibration response signals. Furthermore, as a statistical measure, permutation entropy (PE) quantifies the complexity of non-stationary signals through phase space reconstruction, and thus it can be used as a viable tool to detect the change of bonding state. In order to more accurate identification and detection of bonding state, PE values derived from DTCWT coefficients are proposed to extract the state information from the vibration response signal of explosive welding structure, and then the extracted PE values serve as input vectors of support vector machine (SVM) to identify the bonding state of the structure. The experiments on bonding state detection of explosive welding pipes are presented to illustrate the feasibility and effectiveness of the proposed method.

• The Journal of Advanced Prosthodontics
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• 제8권1호
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• pp.1-8
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• 2016

PURPOSE. The purpose of this study was to evaluate the efficacy of two different metal conditioners for non-precious metal alloys for the bonding of porcelain to a cobalt-chromium (Co-Cr) alloy. MATERIALS AND METHODS. Disk-shaped specimens ($2.5{\times}10.0mm$) were cast with Co-Cr alloy and used as adherend materials. The bonding surfaces were polished with a 600-grid silicon carbide paper and airborne-particle abraded using $110{\mu}m$ alumina particles. Bonding specimens were fabricated by applying and firing either of the metal conditioners on the airborne-particle abraded surface, followed by firing porcelain into 5 mm in diameter and 3 mm in height. Specimens without metal conditioner were also fabricated. Shear bond strength for each group (n=8) were measured and compared (${\alpha}=.05$). Sectional view of bonding interface was observed by SEM. EDS analysis was performed to determine the chemical elements of metal conditioners and to determine the failure modes after shear test. RESULTS. There were significant differences among three groups, and two metal conditioner-applied groups showed significantly higher values compared to the non-metal conditioner group. The SEM observation of the sectional view at bonding interface revealed loose contact at porcelain-alloy surface for non-metal conditioner group, however, close contact at both alloy-metal conditioner and metal conditioner-porcelain interfaces for both metal conditioner-applied groups. All the specimens showed mixed failures. EDS analysis showed that one metal conditioner was Si-based material, and another was Ti-based material. Si-based metal conditioner showed higher bond strengths compared to the Ti-based metal conditioner, but exhibited more porous failure surface failure. CONCLUSION. Based on the results of this study, it can be stated that the application of metal conditioner is recommended for the bonding of porcelain to cobalt-chromium alloys.

• 대한금속재료학회지
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• 제50권4호
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• pp.316-323
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• 2012

The aim of this study is to investigate the effect of post heat treatment on bonding properties of roll cladded Ti/MS/Ti materials. First grade Ti sheets and SPCC mild steel sheets were prepared and then Ti/MS/Ti clad materials were fabricated by a cold rolling and post heat treatment process. Microstructure and point analysis of the Ti/MS interfaces were performed using the SEM and EDX Analyser. Diffusion bonding was observed at the interfaces of Ti/MS. The thickness of the diffusion layer increased with post heat treatment temperature and the diffusion layer was verified as having $({\epsilon}+{\zeta})+({\zeta}+{\beta}-Ti)$ intermetallic compounds at $700^{\circ}C$ and an $({\zeta}+{\beta}-Ti)$ intermetallic compound at $800^{\circ}C$, respectively. The micro Knoop hardness of mild steel decreased with post heat treatment temperature; however, those of Ti decreased at a range of $500{\sim}600^{\circ}C$ and showed a uniform value until $800^{\circ}C$ and then increased rapidly up to $900^{\circ}C$. The micro Knoop hardness value of the diffusion layer increased up to $700^{\circ}C$ and then saturated with post heat treatment. A T-type peel test was used to estimate the bonding forces of Ti/Mild steel interfaces. The bonding forces decreased up to $800^{\circ}C$ and then increased slightly with post heat treatment. The optimized temperature ranges for post heat treatment were $500{\sim}600^{\circ}C$ to obtain the proper formability for an additional plastic deformation process.

• 한국결정성장학회지
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• 제32권5호
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• pp.212-217
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• 2022

고온의 탄화규소 단결정성장공정에서는 탄화규소-흑연간의 열팽창계수의 차이로 인한 열응력이 크게 발생할 수 있어 흑연부재로부터 탄화규소 종자정이 분리되어 성장 중에 종자정이 떨어지는 문제가 발생할 수 있다. 그러나 이러한 탄화규소 종자정 모듈의 접합특성에 대한 연구는 현재까지 거의 보고된 바가 없다. 본 연구에서는 탄화규소-흑연 간의 접합특성을 평가하기 위해 3점 굽힘시험법을 응용한 복합모드꺾임시험(Mixed-Mode Flexure Test)을 통해 탄화규소-흑연을 서로 다른 접합제를 적용하여 접합한 시편의 접합 특성을 확인하고, 흑연 접착제의 미세구조를 분석하기 위해 라만분광법(Raman spectroscopy), X선 광전자분광법(X-ray Photoelectron Spectroscopy) 및 X선 전산화 단층촬영법(X-ray Computed Tomography)을 활용하였다. 이러한 일련의 과정을 통하여 선별한 접착성이 우수한 접착제를 적용하여 직경 50 mm급의 탄화규소 종자결정모듈을 제작하고, 이를 적용하여 고온의 상부종자용액성장 공정을 이용하여 공정 중 종자정의 탈락없이 성공적으로 직경 50 mm급의 탄화규소 단결정을 성장시켰다.

• Journal of Photoscience
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• 제1권1호
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• pp.53-59
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• 1994

Molecular orientation and polarity of solubilization site of dipolar azobenzenes solubilized in micellar solutions are discussed. The polarity of solubilization was estimated by using Taft $\pi$$^*$ scale with linear solvation energy relationship, $\Delta$E=$\Delta$E$_0$ + S($\pi$$^*$ + d$\delta$)+a$\alpha$ + b$\beta$. Hydrogen bonding effects were taken into account for the estimation of micropolarity. The polarity that azobenzenes experienced in the miceliar solutions was close to water which represented that the azobenzenes were mostly solubilized at the interface. For the orientations of azobenzenes were concerned, the nitro group of NPNOH faced the interface and the hydroxy group of NPNO$^-$ located at the interfacial area.

• 접착 및 계면
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• 제5권2호
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• pp.1-7
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• 2004

A novel carboxyl terminated butadiene-acrylonitrile (CTBN) modified, low temperature cure epoxy film adhesive was developed in this paper. It can be cured at as low as $75^{\circ}C$ for 4 hours with a pressure of 0.1MPa. After post cure at $120^{\circ}C$ for 2 hours, the bonding strengths of Phosphoric Acid Anodizing(PAA) surface treated aluminum adherend were similar to those of structural film adhesives curing at $120^{\circ}C$. It is suitable to bond both metal/composite laminate-to-laminate and laminate to honeycomb structure.

• Structural Engineering and Mechanics
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• 제86권5호
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• pp.663-671
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• 2023

Freeze-thaw cycles induce strength loss at the frozen soil-concrete interface and deterioration of bonding, which causes construction engineering problems. To clarify the deterioration characteristics of the interface under the freeze-thaw cycle, a frozen soil-concrete sample was used as the research object, an interface scanning electron microscope test under the freeze-thaw cycle was carried out to identify the micro index information, and an interface shear test was carried out to explore the loss law of interface shear strength under the freeze-thaw cycle. The results showed that the integrity of the interface was destroyed, and the pore number and pore size of the interface increased significantly with the number of freeze-thaw cycles. The connection form gradually deteriorates from surface-to-surface contact to point-to-surface contact and point-to-point contact, and the interfacial shear strength decreases the most at 0-3 freeze-thaw cycles, with small decreases from to 3-8 cycles. After 12 freeze-thaw cycles, the interfacial shear strength tends to be stable, and shear the failure occurs internally in the soil.