Browse > Article
http://dx.doi.org/10.3365/KJMM.2012.50.4.316

Effect of Post Heat Treatment Temperature on Interface Diffusion Layer and Bonding Force in Roll Cladded Ti/Mild steel/Ti Material  

Lee, Sangmok (Advanced Forming Tech. Center, Korea Institute of Industrial Technology)
Kim, Su-Min (Dept. of Materials Science & Engineering, Dong-Eui University)
We, Se-Na (Dept. of Materials Science & Engineering, Dong-Eui University)
Bae, Dong-Hyun (Korea Clad Tech Co., Ltd.)
Lee, Geun-An (Advanced Forming Tech. Center, Korea Institute of Industrial Technology)
Lee, Jong-Sup (Advanced Forming Tech. Center, Korea Institute of Industrial Technology)
Kim, Yong-Bae (Advanced Forming Tech. Center, Korea Institute of Industrial Technology)
Bae, Dong-Su (Dept. of Materials Science & Engineering, Dong-Eui University)
Publication Information
Korean Journal of Metals and Materials / v.50, no.4, 2012 , pp. 316-323 More about this Journal
Abstract
The aim of this study is to investigate the effect of post heat treatment on bonding properties of roll cladded Ti/MS/Ti materials. First grade Ti sheets and SPCC mild steel sheets were prepared and then Ti/MS/Ti clad materials were fabricated by a cold rolling and post heat treatment process. Microstructure and point analysis of the Ti/MS interfaces were performed using the SEM and EDX Analyser. Diffusion bonding was observed at the interfaces of Ti/MS. The thickness of the diffusion layer increased with post heat treatment temperature and the diffusion layer was verified as having $({\epsilon}+{\zeta})+({\zeta}+{\beta}-Ti)$ intermetallic compounds at $700^{\circ}C$ and an $({\zeta}+{\beta}-Ti)$ intermetallic compound at $800^{\circ}C$, respectively. The micro Knoop hardness of mild steel decreased with post heat treatment temperature; however, those of Ti decreased at a range of $500{\sim}600^{\circ}C$ and showed a uniform value until $800^{\circ}C$ and then increased rapidly up to $900^{\circ}C$. The micro Knoop hardness value of the diffusion layer increased up to $700^{\circ}C$ and then saturated with post heat treatment. A T-type peel test was used to estimate the bonding forces of Ti/Mild steel interfaces. The bonding forces decreased up to $800^{\circ}C$ and then increased slightly with post heat treatment. The optimized temperature ranges for post heat treatment were $500{\sim}600^{\circ}C$ to obtain the proper formability for an additional plastic deformation process.
Keywords
Ti/Mild steel/Ti clad material; post heat treatment; bonding interface property; intermetallic compound; diffusion layer; bonding force;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 S. H. Choi, K. H. Kim, K. H. Oh, and D. N. Lee, Mater. Sci. Eng. A 222, 158 (1997).   DOI   ScienceOn
2 T. Mori and S. Kurimoto, Trans. ASME 120, 179(1998).   DOI   ScienceOn
3 S. H. Jeong, J. M. Do, and J. Y. Byeon, J. Kor. Inst. Met. & Mater. 42, 197 (2004).
4 N. Kahraman, B. Gulenc, and F. Findik, J. Mater. Process. Technol. 169, 127 (2005).   DOI   ScienceOn
5 K. Y. Rhee, W. Y. Han, H. J. Park, and S. S. Kim, Mater. Sci. Eng. A 384, 70 (2004).   DOI   ScienceOn
6 K. Raghukandan, J. Mater. Process. Technol. 139, 573 (2003).   DOI   ScienceOn
7 D. S. Bae, S. K. Kim, S. P. Lee, T. Shibayama, and D. H. Bae, Key Eng. Mater. 345, 1497 (2007).
8 S. S. Park, D. S. Bae, J. H. Lee, and D. H. Bae, Trans. Mater. Processing 16, 375 (2007).   DOI   ScienceOn
9 D. H. Bae, S. J. Jung, Y. R. Cho, W. S. Jung, H. S. Jung, C. Y. Kang, and D. S. Bae, J. Kor. Inst. Met. & Mater. 47, 573 (2009).
10 J. Y. Song, I. K. Kim, Y. S. Lee, and S. I. Hong, Korean J. Met. Mater. 49, 910 (2011).
11 H. S. Lee, J. H. Yoon, and Y. M. Yi, Thermochim. Acta, 455, 105 (2007).   DOI   ScienceOn
12 H. Okamoto, Desk Handbook, Phase Diagrams for Binary Alloys, 29 ASM International, Ohio, USA (2000).