• Journal of the Korean Institute of Telematics and Electronics B
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• v.28B no.10
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• pp.807-821
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• 1991

A mulitpath MIN(Multistage Interconnection Network), CSMP(Chained Shuffle Multi-Path) network, is proposed, having fault-tolerance and dynamic reroutability. The number of stages and the number of links between adjacent stagges are the same as in single path MINs, so the overall hardware complexity is considerably reduced in comparison with other multipath MINs. The CSMP networks feature links between switches belonging to the same state, forming loops of switches. The network can tolerate multiple faults, up to (N/4)*(log$_2$N-1), having occured in any stages including the first and the last ones(N:NO. of input). To analyze reliability, terminal reliability (TR) and mean time to failure( MTTE) age given for the networks, and the TR figures are compared to those of other static and dynamic rerouting multipath MINs. Also the MTTE figures are compared. The performance of the proposed network with respect to its bandwidth (BW) and probability of acceptance(PA) is analyzed and is compared to that of other more complex multipath MINs. The cost efficiency analysis of reliability and performance shows that the network is more cost-effective than other previously proposed fault-tolerant multipath MINs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05d
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• pp.105-108
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• 2003

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, We have studied the CMP (chemical mechanical polishing) characteristics of slurry by adding of raw alumina abrasive and annealed alumina abrasive. As a experimental results, we obtained the comparable slurry characteristics compared with original silica slurry in the view point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.1
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• pp.222-233
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• 1995

For effective module generation, a detailed router which can handle complicated routing regions on multimple layers of interconnection under various constraints is necessary. In this paper, a new improved maze routing technique is described, which can find the shortest path for each net without allowing stacked vias. In this method, two cost values are stored at each grid point. The cost values represent the routing costs from the terminal of the net being routed to the grid point. One cost value shows the cost of the shortest path without making a via at the grid point and the other cost value shows that with making a via at the grid point. This is the first systematic maze routing technique which can find the shortest path without via-stacking.

• Proceedings of the IEEK Conference
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• 2001.06c
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• pp.199-202
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• 2001

In this paper, we proposed and analyzed a new class of irregular fault-tolerant multistage interconnection network named as Extended-QT(Quad Tree) network. E-QT network is extended QT network. A unique path MIN usually is low hardware complexity and control algorithm. So we proposes a class of multipath MIN which are obtained by adding self-loop auxiliary links at the a1l stages in QT(Quad Tree) networks so that they can provide more paths between each source-destination pair. The routing of proposed structure is adaptived and is based by a routing tag. Starting with the routing tag for the minimum path between a given source-destination pair, routing algorithm uses a set of rules to select switches and modify routing tag. Trying the self-loop auxiliary link when both of the output links are unavailable. If the trying is failure, the packet discard. In simulation, an index of performance called reliability and cost are introduced to compare different kinds of MINs. As a result, the prouosed MINs have better capacity than 07 networks.

• Journal of Korea Multimedia Society
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• v.17 no.6
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• pp.725-732
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• 2014

The Pancake graph is node symmetric and useful interconnection network in the field of data sorting algorithm. The Half Pancake graph is a new interconnection network that reduces the degree of the Pancake graph by approximately half and improves the network cost of the Pancake graph. In this paper, we analyze topological properties of the Half Pancake graph $HP_n$. Fist, we prove that $HP_n$ has maximally fault tolerance and recursive scalability. In addition, we show that in $HP_n$, there are isomorphic graphs of low-dimensional $HP_n$. Also, we propose that the Bubblesort $B_n$ can be embedded into Half Pancake $HP_n$ with dilation 5, expansion 1. These results mean that various algorithms designed for the Pancake graph and the Bubble sort graph can be executed on $HP_n$ efficiently.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2009.10a
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• pp.223-226
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• 2009

Various database and analysis system has been used for the cost effective maintenance of distribution facility but it is not effective because of the lack of interconnection among these systems. In order to overcome this problem this paper proposes reliability centered maintenance system based on the on-line monitoring of distribution system through intelligent distribution equipment. This system is made by the interconnection of distribution automation system, asset management system, failure analysis system and failure mode effect analysis system.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.34-36
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• 2005

Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with $25{\mu}m$ copper wire on Au/Ni/Cu metallization of a PCB substrate was performed at ambient temperature. The central composite design of experiment (DOE) approach was applied to optimize the copper wire wedge bonding process parameters. After that, pull test of the wedge bond was performed to study the bond strength and to find the optimum bonding parameters. SEM was used to observe the cross section of the wedge bond. The pull test results show good performance of the wedge bond. Additionally, DOE results gave the optimized parameter for both the first bond and the second bond. Cross section analysis shows a continuous interconnection between the copper wire and Au/Ni/Cu metallization. The diffusion of Cu into the Au layer was also observed.

• Proceedings of the IEEK Conference
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• summer
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• pp.325-329
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• 2004

Linear size expanders have been studied in many fields for the practical use, which is possibility to connect large numbers of device chips in parallel communication systems. One major limitation on the efficiency of parallel computer designs has been the prohibitively high cost of parallel communication between processors and memories. Linear size expanders can be used to construct theoretically optimal interconnection networks. In current, the defined constructions have large constant factors, thus rendering them impractical for reasonable sized networks. This paper presents an improvement on constructing concentrators using an $(n,\;k,\;2rs/(r^2-s^2))expander,$ which realizes the reduction of the size in a superconcentrator by a constant factor.

• The Journal of Korean Association of Computer Education
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• v.17 no.2
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• pp.115-124
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• 2014

Hypercube and star graph are widely known as interconnection network. The embedding of an interconnection network is a mapping of a network G into other network H. The possibility of embedding interconnection network G into H with a low cost, has an advantage of efficient algorithms usage in network H, which was developed in network G. In this paper, we provide an embedding algorithm between HCN and HON. HCN(n,n) can be embedded into HON($C_{n+1},C_{n+1}$) with dilation 3 and HON($C_d,C_d$) can be embedded into HCN(2d-1,2d-1) with dilation O(d). Also, star graph can be embedded to half pancake's value of dilation 11, expansion 1, and average dilation 8. Thus, the result means that various algorithms designed for HCN and Star graph can be efficiently executed on HON and half pancake, respectively.

• The KIPS Transactions:PartA
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• v.9A no.3
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• pp.333-340
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• 2002

Embedding is a mapping an interconnection network G to another interconnection network H. If a network G can be embedded to another network H, algorithms developed on G can be simulated on H. In this paper, we first propose a method to embed between Hierarchical Cubic Network HCN(n, n) and Hierarchical Folded-hypercube Network HFN(n, n). HCN(n, n) and HFN(n, n) are graph topologies having desirable properties of hypercube while improving the network cost, defined as degree${\times}$diameter, of Hypercube. We prove that HCN(n, n) can be embedded into HFN(n, n) with dilation 3 and congestion 2, and the average dilation is less than 2. HFN(n, n) can be embedded into HCN(n, n) with dilation 0 (n), but the average dilation is less than 2. Finally, we analyze the fault tolerance of HCN(n, n) and prove that HCN(n, n) is maximally fault tolerant.