Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
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Characteristics of copper wire wedge bonding

  • Tian, Y. (University of Waterloo) ;
  • Zhou, Y. (University of Waterloo) ;
  • Mayer, M. (University of Waterloo) ;
  • Won, S.J. (MK Electronics) ;
  • Lee, S.M. (MK Electronics) ;
  • Cho, S.Y. (University of Seoul) ;
  • Jung, J.P. (University of Seoul)
  • Published : 2005.06.23
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Abstract

Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with $25{\mu}m$ copper wire on Au/Ni/Cu metallization of a PCB substrate was performed at ambient temperature. The central composite design of experiment (DOE) approach was applied to optimize the copper wire wedge bonding process parameters. After that, pull test of the wedge bond was performed to study the bond strength and to find the optimum bonding parameters. SEM was used to observe the cross section of the wedge bond. The pull test results show good performance of the wedge bond. Additionally, DOE results gave the optimized parameter for both the first bond and the second bond. Cross section analysis shows a continuous interconnection between the copper wire and Au/Ni/Cu metallization. The diffusion of Cu into the Au layer was also observed.

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