• Journal of the Microelectronics and Packaging Society
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• v.20 no.1
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• pp.1-5
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• 2013

Wafer-to-Wafer (W2W) integration technology is an emerging technology promising many benefits, such as reduced size, improved performance, reduced power, lower cost, and divergent integration. As the maturity of W2W technology progresses, new applications will become more viable. However, at present the cost for W2W integration is still very high and both manufacturing yield and reliability issues have not been resolved yet for high volume manufacturing (HVM). Especially for WTW integration resolving compound yield issue can be a key factor for HVM. To have the full benefits of WTW integration technology more than simple wafer stacking technologies are necessary. In this paper, the manufacturing yield for W2W integration is described and the challenges of WTW integration will be discussed.

• Korean Journal of Optics and Photonics
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• v.16 no.3
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• pp.196-200
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• 2005

A 40 channel arrayed-waveguide grating (AWG) filter operating in C-band and L-band wavelength regions has been fabricated using PLC (Planar Lightwave Circuit) processes with 0.75 refractive index difference. Its design was optimized for matching the center wavelength with the ITU-recommended wavelength. The characteristics of the fabricated C-band AWG are as follows; average insertion loss < 2.5 dB, polarization-dependent loss < 0.3 dB, non-adjacent crosstalk >35dB, and the loss uniformity of 0.8 dB. In the L-band AWG, wavelength accuracy is below 0.02nm.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.3
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• pp.141-157
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• 2001

Highly reliable packaged 64kbit ferroelectric memories with $0.8{\;}\mu\textrm{m}$ CMOS ensuring ten-year retention and imprint at 125^{\circ}C$ have been successfully developed. These superior reliabilities have resulted from steady integration schemes free from the degradation, due to layer stress and attacks of process impurities. The resent results of research and development for ferroelectric memories at Hynix Semiconductor Inc. are summarized in this invited paper.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.12
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• pp.98-107
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• 1993

This paper describes a design of a multi-bit oversampling noise-shaping D/A converter which achieves a resolution of 12 bits using oversampling technique. In the architecture the essential block which determines the whole accuracy is the analog internal D/A converter, and the designed charge-integration internal D/A converter adopts a differential structure in order to minimize the reduction of the resolution due to process variation. As the proposed circuit is driven by signal clocks which contains the information of the data variation from the noise-shaping coder, it minimizes the disadvantage of a charge-integration circuit in the time axis. In order to verify the circuit, it was integrated with the active area of 950$\times$650${\mu}m^{2}$ in a double metal 1.5-$\mu$m CMOS process, and testified that it can achieve a S/N ratio of 75 dB and a S/(N+D) ratio of 60 dB for the signal bandwidth of 9.6 kHz by the measurement with a spectrum analyzer.

• Journal of Advanced Navigation Technology
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• v.22 no.2
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• pp.84-89
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• 2018

Due to the development of domestic technology, a variety of aircraft launch weapons have been developed, and the importance of aircraft-store integration certification is increasing. The aircraft-Store integration certification is to certify compliance with the armaments/stores integration criteria set out in the Standard ACC and to prove that there is no problem with the safety flight. Therefore, it is necessary to reflect the requirements of the aircraft in the store development process to reduce the design change requirement in the compatibility verification stage. In this paper, the relationship between the Standards ACC, aircraft-store compatibility reference document MIL-HDBK-1763, and the development process of cruise guided weapons have been analyzed. As a result of the analysis, it was concluded that the design changes in the aircraft-store integration certification stage could be reduced if the aerodynamic and structural design requirements were reflected from the conceptual design stage.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.2
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• pp.76-82
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• 2003

The robust stack storage node and sufficient cell capacitance for high performance is indispensable for 90 nm DRAM capacitor. For the first time, we successfully demonstrated MIS capacitor process integration for 90 nm DRAM technology. Novel cell layout and integration technology of 90 nm DRAM capacitor is proposed and developed, and it can be extended to the next generation DRAM. Diamond-shaped OCS with 1.8 um stack height is newly developed for large capacitor area with better stability. Furthermore, the novel $Al_2O_3/HfO_2$ dielectric material with equivalent oxide thickness (EOT) of 25 ${\AA}$ is adopted for obtaining sufficient cell capacitance. The reliable cell capacitance and leakage current of MIS capacitor is obtained with ~26 fF/cell and < 1 fA/ceil by $Al_2O_3/HfO_2$ dielectric material, respectively.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.35 no.1B
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• pp.35-41
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• 2010

In this paper, we propose a 3D view design scheme which arranges 2D information in a 3D virtual space with a flexible interface and voice information. The scheme allows the user interface of the 2D image in 3D virtual space anytime from any view point. Voice information can be easily attached. It is this simple and efficient image and voice information arrangement in 3D virtual space that improves information transfer.

• 한국HCI학회:학술대회논문집
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• 2006.02a
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• pp.486-492
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• 2006

본 논문에서는 비디오에서의 특징점 추적을 통해 얻은 2D 좌표를 이용한 3D 구조를 추정하는 방법과 네 점 이상의 공통점을 이용한 융합 방법을 제안한다. 영상의 각 프레임에서 공통되는 특징점을 이용하여 형상을 추정한다. 영상의 각 프레임에 대한 특징점의 추적은 Lucas-Kanade 방법을 사용하였다. 3D 좌표 추정 방법으로 개선된 직교분해기법을 사용하였다. 개선된 직교분해기법에서는 3D 좌표를 복원함과 동시에 카메라의 위치와 방향을 계산할 수 있다. 복원된 부분 데이터들은 전체를 이루는 일부분이므로, 융합을 통해 완성된 모습을 만들 수 있다. 복원된 부분 데이터들의 서로 다른 좌표계를 기준 좌표계로 변환함으로써 융합할 수 있다. 융합은 카메라의 모션에 해당하는 카메라의 위치와 방향에 의존된다. 융합 과정은 모두 선형으로 평균 0.5초 이하의 수행 속도를 보이며 융합의 오차는 평균 0.1cm 이하의 오차를 보였다.

• Proceedings of the KSR Conference
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• 2009.05b
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• pp.233-237
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• 2009

In this study, we suggest that several approaches to evaluate the collision acceleration value of a car in the article 35 and the guideline 16 of Korean rolling stock safety regulation. There are various methods to evaluate collision acceleration such as; a displacement comparison method by the double integration of filtered acceleration data, a velocity comparison method by the integration of filtered acceleration data, an analysis method of time-velocity curve, or a differential method of time-velocity curve. We compared these methods one another using 1D dynamic simulation model composed of nonlinear dampers, springs and bars, and masses. Also, we applied these methods to a hybrid model, which is made of 3D shell element model and 2D collision dynamics model, in order to evaluate whether 1D force-displacement curve modeling for energy absorbing structures have an effect on the collision acceleration levels or not.

• Journal of the Korean Operations Research and Management Science Society
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• v.32 no.2
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• pp.163-175
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• 2007

[ $ulcorner$ ]Cost-Effectiveness Analysis$\lrcorner$ has been wifely used to evaluate economic efficiency of R&D projects, but most of cost-effectiveness evaluation systems have some problems such as systematic method for setting and evaluating cost factors, estimation of single effect on each R&D project, and estimation of cross effects among R&D projects. To solve these problems, we have designed a new evaluation indicator called a $ulcorner$Cost-Cross Effect Integration Indicator$lrcorner$ including cross effects developed in this research. The major research findings are summarized as follows : (1) $ulcorner$Coist Estimation Model$lrcorner$, which estimates the cost factors divided into two classes of assembly product and system product and then integrates the total cost values, has been designed. (2) A new method for estimating parameters of cross effects among R&D projects has been developed. (3) $ulcorner$Cross Effects Estimation Model$lrcorner$ to estimate multi-effects and cross effects by completion time among several projects has been designed. (4) $ulcorner$Integration Estimation Indicator$lrcorner$ for setting priority on a project group has been extracted by combination of total cost value and total effect value.