• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.7
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• pp.11-19
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• 1998

A signal line potential variation due to the delta-I noise was physically investigated in CMOS integrated circuits. An equivalent circuit for the noise analysis was presented. The signal line was modeled as segmented RC-lumped circuits with the ground noise. Then the equivalent circuit was mathematically analyzed. Therebvy a new signal line potential variation model due to the switching mosie was developed. Th emodel was verified with 0.35.mu.m CMOS deivce model parameters. The model has an excellent agreement with HSPICE simulation. Thus the proposed model can be dirctly employed in the industry to design the high-performance integrted circuit design as well as integrated circuit package design.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.135-139
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• 1996

It is difficult to fabricate precise resistors for the analog integrated circuits using MOS technology. Until now polysilicon resistors were used at the analog integrated circuits, but some deviations of resistance and sensitive variation processes still cause their misactions. In order to improve these misactions, we suggest a CMOS resistor cell which provides precise resistance and excellant linearity. Also we designed the second order active low pass filter using the CMOS resistor cells and verified their superior performances compared to the actual resistors.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.627-628
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• 2006

A low-voltage switched-capacitor $2^{nd}$-order $\Sigma\Delta$ modulator using full feed-forward is introduced. It has two advantages: the unity signal transfer function and reduced signal swings inside the $\Sigma\Delta$ loop. These features greatly relax the DC gain and output swing requirements for Op-Amp in the low-voltage $\Sigma\Delta$ modulator. Implemented by a 0.18-${\mu}m$ CMOS technology, the $\Sigma\Delta$ modulator satisfies performance requirements for WCDMA and CDMA2000 standards.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.615-616
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• 2006

Nowadays, the need of multi-mode/multi-band transceiver is rapidly increasing, so we design a direct conversion RF front-end for multi-mode/multi-band receiver that support WCDMA/CDMA2000/WIBRO standard. It consists of variable gain reconfigurable LNA and single input double balanced Mixer and complementary differential LC Oscillator. The circuit is implemented in 0.18 um RF CMOS technology and is suitable for low-cost mode/multi-band.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.617-618
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• 2006

A CMOS quadrature Up-converter for a direct-conversion receiver of 5.15-5.825GHz wireless LAN is described. The Up-converter consists of two sub-harmonic mixers, for I and Q channels, and an LO generation network. In order to decrease the number of inductor, I and Q path are merged. The simulation results including all the parasitics show -17.3dB conversion gain at center and -8 dBv oIP3 while consuming 22.968mW under 1.8V supply. The quadrature Up-converter is under fabrication with the other transmitter blocks in a $0.18{\mu}m$ CMOS technology.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.67-70
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• 2009

Printed electronics are emerging technology to realize various microelectronic devices via a cost-effective method. Here we introduce high performance inkjet printed polymer field-effect transistors and application to complementary integrated circuits with p-type and n-type conjugated polymers. The performance of devices highly depends on the selection of dielectrics, printing condition and device architecture. The device optimization and performances of various integrated circuits, e.g., complementary inverters and ring oscillators will be mainly discussed in this talk.

• Electronics and Telecommunications Trends
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• v.36 no.3
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• pp.53-64
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• 2021

As the 5G service market is expected to grow rapidly, the development of high-power, high-efficiency power amplifiers for the 5G communication infrastructure is indispensable. Gallium nitride (GaN) is attracting great interest as a key device in power devices and integrated circuits due to its wide bandgap, high carrier concentration, high electron mobility, and high-power saturation characteristics. In this study, we investigate the technology trends of Ka-band GaN radio frequency (RF) power devices and integrated circuits for operation in the millimeter-wave band of recent 5G mobile communication services. We review the characteristics of GaN RF high electron mobility transistor (HEMT) devices to implement power amplifiers operating at frequencies around 28 GHz and compare the technology of foreign companies with the device characteristics currently developed by the Electronics and Telecommunication Research Institute (ETRI). In addition, the characteristics of Ka-band GaN monolithic microwave integrated circuit (MMIC) power amplifiers manufactured using various GaN HEMT device technologies are reviewed by comparing characteristics such as frequency band, output power, and output power density of integrated circuits. In addition, by comparing the performance of the power amplifier developed by ETRI, the current status and future direction of domestic GaN power devices and integrated circuit technology will be discussed.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1680-1682
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• 2007

The integrated circuits such as inverters, ring oscillators, NAND and NOR gates, and rectifiers were fabricated on PEN substrate by using pentacene TFTs. The OTFTs used bottom contact structure and produced the average mobility of $0.26\;cm^2/V.sec$ and on/off current ratio of $10^5$. All circuits worked successfully like the simulation results. Especially, the rectifier was able to operate up to 1 MHz input signals, and ring oscillator exhibited oscillation frequency of 1MHz at-40V.

• Journal of Korean Vacuum Science & Technology
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• v.3 no.1
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• pp.66-73
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• 1999

In this paper, the design of one-chip FED system integrated with driving circuits in reported on the basis of MOSFET controlled FEA (MCFEA). To integrate a MOSFET with a FEA efficiently, a new fabrication process is proposed. It is confirmed that the MOSFET with threshold voltage of about 2volts controls the FEA emission current up to 20 ${\mu}$A by applying driving voltage of 15 volts, which is enough current level to utilize the MCFEA as a pixel for FED. The drain breakdown voltage of the MOSFET is measured to be 70 volts, which is also high enough for 60 volt operation of FED. The circuits for row and column driver are designed stressing on saving area, reducing malfunction probability and consuming low power to maximize the merit of on-chip driving circuits. Dynamic logic concept and bootstrap capacitors are used to meet these requirements. By integrating the driving circuit with FEA, the number of external I/O lines can be less than 20, irrespectively of the number of pixels.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.534-536
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• 2009

We have fabricated solution-processed zinc-tin oxide thin film transistors (TFTs) and simple circuits on glass substrates. We report a solutionprocessed zinc-tin oxide TFTs on silicon wafer with mobility greater than 9 $cm^2/V{\cdot}s$ (W/L = 100/5 ${\mu}m$) and threshold voltage variation of less than 1 V after bias-stressing. Also, we fabricated solution-processed zinc-tin oxide circuits including inverters and 7-stage ring oscillators fabricated on glass substrates using the developed zinc-tin oxide TFTs.