• 마이크로전자및패키징학회지
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• 제16권2호
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• pp.1-9
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• 2009

Conductive adhesives have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-containing solders. Numerous studies have shown that the conductive adhesives have many advantages over conventional soldering such as environmental friendliness, finer pitch feasibility and lower temperature processing. This review focuses on the recent research trends on the reliability and property evaluation of anisotropic and non-conductive films that interconnect the integrated circuit component to the printed circuit board or other types of substrate. Major topics covered are the conduction mechanism in adhesive interconnects; mechanical reliability; thermo-mechanical-hygroscopic reliability and electrical performance of the adhesive joints. This review article is aimed at providing a better understanding of adhesive interconnects, their principles, performance and feasible applications.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권2호
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• pp.175-183
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• 2014

In this paper, we present the design and implementation of real-time sound localization based on $0.13{\mu}m$ CMOS process. Time delay of arrival (TDOA) estimation was used to obtain the direction of the sound signal. The sound localization chip consists of four modules: data buffering, short-term energy calculation, cross correlation, and azimuth calculation. Our chip achieved real-time processing speed with full range ($360^{\circ}$) using three microphones. Additionally, we developed a dedicated sound localization circuit (DSLC) system for measuring the accuracy of the sound localization chip. The DSLC system revealed that our chip gave reasonably accurate results in an experiment that was carried out in a noisy and reverberant environment. In addition, the performance of our chip was compared with those of other chip designs.

• Journal of Audiology & Otology
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• 제24권4호
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• pp.174-179
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• 2020

Background and Objectives: The integration of auditory-visual speech information improves speech perception; however, if the auditory system input is disrupted due to hearing loss, auditory and visual inputs cannot be fully integrated. Additionally, temporal coincidence of auditory and visual input is a significantly important factor in integrating the input of these two senses. Time delayed acoustic pathway caused by the signal passing through digital signal processing. Therefore, this study aimed to investigate the effects of hearing loss and hearing aid digital delay circuit on sound-induced flash illusion. Subjects and Methods: A total of 13 adults with normal hearing, 13 with mild to moderate hearing loss, and 13 with moderate to severe hearing loss were enrolled in this study. Subsequently, the sound-induced flash illusion test was conducted, and the results were analyzed. Results: The results showed that hearing aid digital delay and hearing loss had no detrimental effect on sound-induced flash illusion. Conclusions: Transmission velocity and neural transduction rate of the auditory inputs decreased in patients with hearing loss. Hence, the integrating auditory and visual sensory cannot be combined completely. Although the transmission rate of the auditory sense input was approximately normal when the hearing aid was prescribed. Thus, it can be concluded that the processing delay in the hearing aid circuit is insufficient to disrupt the integration of auditory and visual information.

• ETRI Journal
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• 제45권3호
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• pp.462-478
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• 2023

In quantum computing, the use of Pauli frames through software traces of classical computers improves computation efficiency. In previous studies, error correction and Pauli operation tracking have been performed simultaneously using integrated Pauli frames in the physical layer. In such a complex processing structure, the number of simultaneous operations processed in the physical layer exponentially increases as the distance of the surface code encoding logical qubit increases. This study proposes a Pauli frame management architecture partitioned into two layers for a lattice surgery-based surface code and describes its structure and operation rules. To evaluate the effectiveness of our method, we generated a random circuit according to the gate ratios constituting the commonly known quantum circuits and compared the generated circuit with the existing Pauli frame and our method. Simulations show a decrease of about 5% over traditional methods. In the case of experiments that only increase the code distance of the logical qubit, it can be seen that the effect of reducing the physical operation through the logical Pauli frame becomes more important.

• 정보처리학회논문지A
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• 제9A권2호
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• pp.259-266
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• 2002

본 논문에서는 포맷 변환기를 사용하여 여러 가지 화상처리 필터링을 구현하였다. 이러한 설계 기법은 집적회로를 이용한 대규모 화소처리 배열을 근거로 하여 실현하였다. 집적구조의 두가지 형태는 연산병렬프로세서와 병렬 프로세스 DRAM(또는 SRAM) 셀로 분류할 수 시다. 1비트 논리의 설계 피치는 집적 구조에서의 고밀도 PE를 배열하기 위한 메모리 셀 피치와 동일하다. 이러한 포맷 변환기 설계는 효율적인 제어 경로 수행 능력을 가지고 있으며 하드웨어를 복잡하게 할 필요 없이 고급 기술로 사용 될 수 있다. 배열 명령어의 순차는 프로세스가 시작되기 전에 주 컴퓨터에 의해 생성이 되며 명령은 유니트 제어기에 저장이 된다. 주 컴퓨터는 프로세싱이 시작된 후에 저장된 명령어위치에서 시작하여 화소-병렬 동작을 처리하게 된다. 실험 결과 1) 단순한 평활화는 더 높은 공간의 주파수를 억제하면서 잡음을 감소시킬 뿐 아니라 에지를 흐리게 할 수 있으며, 2) 평활화와 분할 과정은 날카로운 에지를 보존하면서 잡음을 감소시키고, 3) 메디안 필터링기법은 화상 잡음을 줄이기 위해 적용될 수 있고 날카로운 에지는 유지하면서 스파이크 성분을 제거하고 화소 값에서 단조로운 변화를 유지 할 수 있었다.

• 전자공학회논문지S
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• 제36S권12호
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• pp.67-75
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• 1999

본 논문에서는 뛰어난 에너지 압축성능에 의해 영상압축을 포함한 여러 응용분야에서 널리 사용되고 있는 웨이브렛 변환 필터를 ASIC(Application Specific Intergrated Circuit) 설계하였으며, 동작 특성 및 성능은 Verilog-HDL(Hardware Discription Language)를 통해 구현 및 분석하였다. 본 논문에서 설계한 웨이브렛 변환 필터는 데이터의 처리 속도를 향상시키기 위해 라인메모리(line memory)를 사용하였다. 이는 일반적으로 fast-page mode로 DRAM 데이터를 읽고 쓸 때에 수평방향으로는 데이터의 입출력이 빠르게 행해지는 반면 수직방향으로는 수평방향에 비해 현저하게 입출력 속도가 떨어지게 되는 단점을 개선하기 위해서이다. 그 결과 칩의 크기가 커지는 반면 1 프레임 처리속도가 4.66ms로 TV 동영상 데이터 1 프레임 처리속도의 한계인 33ms를 충분히 만족하여 실시간 처리가 가능함을 알 수 있었다.

• 전기전자학회논문지
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• 제2권1호
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• pp.34-41
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• 1998

자기 띠 저장 시스템에서 데이터를 저장하고 복원할 수 있는 칩을 구현하였다. 구현된 칩은 아날로그 회로와 디지털 회로가 한 칩안에 같이 내장되어 있으며 F/2F 인코딩과 디코딩을 동시에 지원한다. 아날로그 부분은 초단 앰프, 첨두치 검출기, 비교기, 기준전압 생성회로 등으로 구현 되었으며 디지탈 회로 부분은 기준 윈도우 신호 발생부, F/2F 신호 길이를 측정하는 up/down 계수부, 비트 에러 검출부 및 기타 제어(control) 회로 등을 포함한다. 검출되는 신호특성을 파악하여 아날로그 회로부 설계를 최적화 함으로써 기존의 시스템에서 흔히 쓰이는 AGC(automatic gain control) 회로를 제거하였다. 또 일정한 비트의 길이를 초과한 파손 비트 또는 다분할로 파손된 비트 등을 감지한 경우 신속하게 기준 비트를 재 설정함으로서 데이터의 오인식을 없애주는 회로를 제안하였다. 제안된 회로는 $0.8{\mu}m$ CMOS N-well 일반 공정을 이용하여 구현 되었으며 3.3 V에서 부터 7.5 V의 공급 전압 범위에서 동작하도록 설계 되었다. 5 V의 전원 공급시 약 8 mW의 소모 전력을 보여 주고 있으며 칩 면적은 패드를 포함하여 $3.04mm^2(1.6mm{\times}1.9mm)$이다.

• 한국재료학회지
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• 제22권7호
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• 대한전자공학회논문지
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• 제26권2호
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• pp.118-123
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• 1989

본 논문에서는 저소비 전력이고 회로설계가 용이한 CMOS 회로를 이용하여 음성신호 처리용 SCF를 집적화 할때 OP AMP를 디지탈 부분과 공존할 수 있도록 ${\pm}$5V로 전원을 설정하여 CMOS OP AMP의 설계예를 들고 설계방법에 의해 구한 MOS 트랜지스터의 채널폭과 길이를 설계회로에 적용하여 LAYOUT 하였으며 시뮬레이션을 통하여 동작특성을 조사하였다. 또한 이 설계법은 주어지는 설계조건에 따라 설계 되어지므로 다른 용도의 CMOS OP AMP 설계에도 이용되어질 수 있을 것이다.

• ETRI Journal
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• 제38권5호
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• pp.981-987
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• 2016

We present a cost-effective dual polarization quadrature phase-shift coherent receiver module using a silica planar lightwave circuit (PLC) hybrid assembly. Two polarization beam splitters and two $90^{\circ}$ optical hybrids are monolithically integrated in one silica PLC chip with an index contrast of $2%-{\Delta}$. Two four-channel spot-size converter integrated waveguide-photodetector (PD) arrays are bonded on PD carriers for transverse-electric/transverse-magnetic polarization, and butt-coupled to a polished facet of the PLC using a simple chip-to-chip bonding method. Instead of a ceramic sub-mount, a low-cost printed circuit board is applied in the module. A stepped CuW block is used to dissipate the heat generated from trans-impedance amplifiers and to vertically align RF transmission lines. The fabricated coherent receiver shows a 3-dB bandwidth of 26 GHz and a common mode rejection ratio of 16 dB at 22 GHz for a local oscillator optical input. A bit error rate of $8.3{\times}10^{-11}$ is achieved at a 112-Gbps back-to-back transmission with off-line digital signal processing.