• 대한전자공학회논문지
• /
• 제21권5호
• /
• pp.11-16
• /
• 1984

본 논문에서는 III-V족 반도체 소자의 제작에 사용되는 액상 에피층 성장 시스템의 제작 및 이를 이용한 AIGaAs/GaAs 이중 헤테로 구조의 성장 방법에 관하여 고찰하였다. 또한 이 헤테로 구조가 발광 다이오드에 이용될 수 있음을 확인하였다.

• 한국결정학회지
• /
• 제1권2호
• /
• pp.115-125
• /
• 1990

We have investigated bulk and hetero-epitaxial growth of GaAs single crystal. Various growth techniques such as HB, HZM, and VGF for high quality bulk GaAs were successfully developed by appling the specially designed DM(direct monitoring) furnace. Al GaAs/GaAs superlattice structure and In(x)Ga(1-x) As/GaAs epilayers were also grown by MOCVD and VPE, respectively. The characterization of GaAs single crystals and epilayers was made by X-ray diffraction, Hall effect, PL, chemical etching and angle lapping technique.

• 한국결정성장학회지
• /
• 제11권5호
• /
• pp.207-210
• /
• 2001

Metal-organic VPE (MOVPE) epitaxial growth procedure and related device fabrication technique are reported for GaInP-based epitaxial materials and devices. For GaInP/GaInAs two-dimensional electron-gas field-effect transistor (TEGFET), a promising epitaxial stacking structure resulting in enhanced electron mobility is given. In conjunction with this, a new device fabrication technique to improve luminous intensity of GaInP-based LED is also shown.

• E2M - 전기 전자와 첨단 소재
• /
• 제9권6호
• /
• pp.564-571
• /
• 1996

We calculated the drift-velocities of electrons and holes of I $n_{0.53}$(A $l_{x}$G $a_{1-x}$ )$_{0.47}$As, which is used for semiconductor materials of high performance HBTs, along with the various doping concentrations and Al mole fractions as well as the electric fields by Monte Carlo experiment. Especially, for the valence bands the accuracy of hole-drift-velocity was improved in the consideration of intervalley scattering due to the inelastic scattering of acoustic phonon. From the results the empirical formulas of the low- and high field mobility of electrons and holes were extracted by using nonlinear least square fitting method. The accuracy of the formulas was proved by comparing the formula of low-field electron mobility as well as drift-velocity of I $n_{0.53}$ G $a_{0.47}$As and of low-field hole mobility of GaAs with the measured values, where the error was below 10%. For the high-field mobilities of electron and hole the results calculated by the formulas were very well matched with the MC experimental results except at the narrow field range where the electrons produced the velocity overshoot and the corresponding error was about 30%.0%. 30%.0%.

• 대한전자공학회논문지SD
• /
• 제39권1호
• /
• pp.83-88
• /
• 2002

HFET 소자의 선형성과 게이트-트레인 항복특성을 향상시키기 위해 부분채널 도핑된 Al/sub 0.25/Ga/sub 0.75/As/In/sub 0.25/Ga/sub 0.75/As/Al/sub 0.25/Ga/sub 0.75/As 이종접합 구조를 갖는 FET를 제안하였다. 제안된 HFET는 게이트 전극 아래로 도핑되지 않은 AlGaAs 진성공급층을 두어 -2OV 의 높은 항복전압을 얻었다. 또한 소자의 InGaAs 채널에 부분 도핑을 실시하여, 균일 채널 도핑을 실시한 경우보다 향상된 선형성을 유도하였고, 2차원 전산모사 견과와 제작 및 측정결과를 통해 선형성의 향상을 확인하였다. 본 실험에서 제안된 HFET소자는 DC측정 결과와 고주파측정 결과 모두에서 기존의 FET소자들에 비해 향상된 선형성을 나타내었다.

• KEPCO Journal on Electric Power and Energy
• /
• 제5권1호
• /
• pp.39-43
• /
• 2019

에너지 고갈 문제에 대한 대처 방안으로 수소에너지는 직간접적인 긍정적 효과를 가져온 반면, 사용시 안정성이 매우 중요한 사항이기 때문에 수소가스에 대한 정확하고 빠른 감지를 가능하게 하는 센서 기술이 요구된다. 본 연구에서는 AlGaN/GaN 이종접합 반도체 플렛폼을 활용하여 Pd 촉매 기반의 수소센서를 개발하였으며 감도를 높이기 위하여 식각 구조를 도입하였다. 온도 및 바이어스 전압이 센서의 반응도에 미치는 영향을 수소가스 위험도 최하한선 농도인 4% 수소 농도에 노출된 경우에 대하여 세심하게 분석하였다. AlGaN/GaN 이종접합의 우수한 특성에 식각 구조가 도입된 결과 56%의 높은 반응도와 0.75 초의 빠른 응답 속도 성능을 달성하였다.

• 전자공학회논문지A
• /
• 제31A권9호
• /
• pp.104-113
• /
• 1994

We have fabricated n-p-n HBTs using 3-inchAlgaAs/GaAs hetero structure epi-wafers grown by MBE. DC and AC characteristics of HBT devices were measured and analyzed. For HBT epi-structure, Al composition of emitter was graded in the region between emitter cap and emitter. And base layer was designed with concentration of 1${\times}10^{19}/cm^{3}$ and thickness of 50nm, and Be was used as the p-type dopant. Principal processes for device fabrication consist of photolithography using i-line stepper, wet mesa etching, and lift-off of each ohmic metal. The PECVD SiN film was used as the inslator for the metal interconnection. HBT device with emitter size of 3${\times}10{\mu}m^{2}$ resulted in cut-off frequency of 35GHz, maximum oscillation frequency of 21GHz, and current gain of 60. The distribution of the ideality factor of collector and base current was very uniform, and the average values of off-set voltage and current was very uniform, and the average values of off-set voltage and current gain were 0.32V and 32 within a 3-inch wafer.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2018년도 춘계학술대회 논문집
• /
• pp.55-55
• /
• 2018

Recently, amorphous oxides such as InGaZnO (IGZO) and InZnO (IZO) as a channel layer of an oxide TFT have been attracted by advantages such as high mobility, good uniformity, and high transparency. In order to apply such an amorphous oxide TFTs to a display, the stability in various environments must be ensured. In the InGaZnO which has been studied in the past, Ga elements act as a suppressor of oxygen vacancy and result in a decreased mobility at the same time. Previous studies have been showed that the InZnO, which does not contain Ga, can achieve high mobility, but has relatively poor stability under various instability environments. In this study, the TFTs using $IZO/Al_2O_3$ double layer structure were studied. The introduction of an $Al_2O_3$ interlayer between source/drain and channel causes superior electrical characteristics and electrical stability as well as reduced contact resistance with optimally perfect ohmic contact. For the IZO and $Al_2O_3$ bilayer structures, the IZO 30nm IZO channels were prepared at $Ar:O_2=30:1$ by sputtering and the $Al_2O_3$ interlayer were depostied with various thickness by ALD at $150^{\circ}C$. The optimal sample exhibits considerably good TFT performance with $V_{th}$ of -3.3V and field effect mobility of $19.25cm^2/Vs$, and reduced $V_{th}$ shift under positive bias stress stability, compared to conventional IZO TFT. The enhanced TFT performances are closely related to the nice ohmic contact properties coming from the defect passivation of the IZO surface inducing charge traps, and we will provide the detail mechanism and model via electrical analysis and transmission line method.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1987년도 전기.전자공학 학술대회 논문집(I)
• /
• pp.465-468
• /
• 1987

This paper describes a model to calculate the equilibrium electron density of MODFET at the interface that takes into account the simultaneous shallow and deep level in the Al-GaAs layer. In the present study we have made an investigation of the interface electron density with different values of the AlGaAs doping density and spacer layer thickness, considering simultaneously two doner levels. In this case, the ratio of the shallow to the deep donor concentraction is considered. From the comparison with early experimental results we could find the deep level and that the deep donor concentration is about 50% with the Al mole fraction X ${\sim}0.3$, activation energy Edx=65meV, temperature $77^{\circ}K$ and spacer thickness range $50A{\sim}100A$. Also we have investigated the effect of the temperature. As temperature increase, at critical mole fraction X the nature of the donor concentration changes from $\Gamma$ to L and X.

• 한국표면공학회지
• /
• 제36권2호
• /
• pp.135-140
• /
• 2003

The difference in lattice parameter and thermal expansion coefficient between GaN and Si which results in many defects into the grown GaN is larger than that between GaN and sapphire. In order to obtain high quality GaN films on Si substrate, it is essential to understand growth characteristics of GaN. In this study, GaN layers were grown on Si(111) substrates by MOCVD at three different GaN growth temperatures ($900^{\circ}C$, $1,000^{\circ}C$ and $1,100^{\circ}C$), using AlN and LT-GaN buffer layers. Using TEM, we carried out the comparative investigation of growth characteristics of GaN by characterizing lattice coherency, crystallinity, orientation relationship and defects formed (transition region, stacking fault, dislocation, etc). The localized region with high defect density was formed due to the lattice mismatch between AlN buffer layer and GaN. As the growth temperature of GaN increases, the defect density and surface roughness of GaN are decreased. In the case of GaN grown at $1,100^{\circ}$, growth thickness is decreased, and columns with out-plane misorientation are formed.