• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.10a
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• pp.39-45
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• 2000

A small camera module fabricated by including bare chip bonding methods is utilized to realize advanced mobile devices. One of the driving forces is the TOG (Tape On Glass) bonding method which reduces the packaging size of the image sensor clip. The TOG module is a new thinner and smaller image sensor module, using flip chip interconnection method with the ACP (Anisotropic Conductive Paste). The TOG production process was established by determining the optimum bonding conditions for both optical glass bonding and image sensor clip bonding lo the flexible PCB. The bonding conditions, including sufficient bonding margins, were studied. Another bonding method is the flip chip bonding method for DSP (Digital Signal Processor) chip. A new AC\ulcorner was developed to enable the short resin curing time of 10 sec. The bonding mechanism of the resin curing method was evaluated using FEM analysis. By using these flip chip bonding techniques, small camera module was realized.

• Journal of Aerospace System Engineering
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• v.3 no.4
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• pp.11-18
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• 2009

This paper is about EO sensor module control based on the image processing. The main purpose of this research is acquiring a latitude and longitude of the target located on the ground by using image processing. For image processing, OpenCV is employed which is a computer vision library originally developed by Intel, and ATmega128 is used for the EO sensor module control. This task also involves realization of control programs and acquisition of sensor view angle for the position of the target.

• The Journal of the Korea institute of electronic communication sciences
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• v.7 no.5
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• pp.999-1004
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• 2012

In this paper, camera modules and lens's images were analyzed for the compensation of distortion image by wide angle lens based WDR(Wide Dynamic Range) with high resolution sensor(2-Mega CMOS Image sensor). Due to wide angle ($176^{\circ}$) of designed wide angle camera modules, the compensation result of distorted image was analyzed, and the application of these modules was proposed for smart NUX(Natural User eXprience).

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.3
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• pp.555-562
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• 2007

In order to display Bayer input stream received from CMOS image sensor to the display device, image signal processing must be performed. That is, the hardware performing the image signal processing for Bayer data is called ISP(Image Signal Processor). We can see real image through ISP processing. ISP executes functionalities for gamma correction, interpolation, color space conversion, image effect, image scale, AWB, AE and AF. In this paper, we obtained the optimum algorithm through software verification of ISP module for CMOS camera image sensor and described using VHDL and verified in ModelSim6.0a simulator. Also we downloaded into Xilinx XCV-1000e for the designed ISP module and completed the board level verification using PCI interface.

• The Journal of Korea Robotics Society
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• v.16 no.4
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• pp.291-298
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• 2021

In this study, we present a multi-sensor module for snake robot searching survivors in a narrow space. To this end, we integrated five sensor systems by considering the opinions of the first responders: a gas sensor to detect CO₂ gases from the exhalation of survivors, a CMOS camera to provide the image of survivors, an IR camera to see in the dark & smoky environment, two microphones to detect the voice of survivors, and an IMU to recognize the approximate location and direction of the robot and survivors. Furthermore, we integrated a speaker into the sensor module system to provide a communication channel between the first responders and survivors. To integrated all these mechatronics systems in a small, compact snake head, we optimized the positions of the sensors and designed a stacked structure for the whole system. We also developed a user-friendly GUI to show the information from the proposed sensor systems visually. Experimental results verified the searching function of the proposed sensor module system.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.809-813
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• 2004

In this paper, we developed a network camera for CMOS camera module inspection. The design, implementation details including embedded linux porting and CPLD logics, and performance of network camera are described. The network camera consists of SoC(S3C4530A), CPLD and CMOS image sensor. In order to image data of CMOS image sensor we designed capture logics on CPLD by using VHDL program. Embedded Linux such as uClinux is performed on the network camera to utilize development environment and TCP/IP protocol specification. The application is based on socket communication between GUI on PC and Embedded Linux based network camera. When JPEG compression is applied, the transmission speed was improved enough for this system to be used for an alternative of expensive CCTV or remote monitoring system in a power plant and uninhabited places.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.45 no.7
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• pp.600-609
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• 2017

We designed a target management integration system that enables us to select the final target manually or automatically from seeker's sensor image. The integrated system was developed separately for the air vehicle system and the ground system. The air vehicle system simulates the motion dynamics and the sensor image of the air vehicle, and the ground system is composed of the target template image module and the ground control center module. The flight maneuver of the air vehicle is based on pseudo 6-degree of freedom motion equation and the proportional navigation guidance. The sensor image module was developed using the known infrared(IR) image rendering method, and was verified by comparing the rendered image to that of a commercial software. The ground control center module includes an user interface that can display as much information to meet user needs. Finally, we verified the integrated system with simulated impact target mission of the air vehicle, by confirming the final target change and the shot down result of the user's intervention.

• The Journal of Korea Robotics Society
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• v.13 no.4
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• pp.237-247
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• 2018

In this paper, we describe a sensor module that monitors fire environment by analyzing fire characteristics. We analyzed the smoke characteristics of indoor fire. Six different environments were defined according to the type of smoke and the flame, and the sensors available for each environment were combined. Based on this analysis, the sensors were selected from the perspective of firefighter. The sensor module consists of an RGB camera, an infrared camera and a radar. It is designed with minimum weight to fit on the robot. the enclosure of sensor is designed to protect against the radiant heat of the fire scene. We propose a single camera mode, thermal stereo mode, data fusion mode, and radar mode that can be used depending on the fire scene. Thermal stereo was effectively refined using an image segmentation algorithm, SLIC (Simple Linear Iterative Clustering). In order to reproduce the fire scene, three fire test environments were built and each sensor was verified.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.12
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• pp.1197-1202
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• 2009

We present a power-efficient driving scheme that consists of piezoelectric actuator and driver IC for AF (Auto-Focus) on ISM (Image Sensor Module). The piezoelectric actuator is more power-efficient than conventional voice coil motor actuator. And high power-efficiency driver IC is designed. So the proposed driving scheme using designed piezoelectric actuator and driver IC is more close to recent trend of green IT. The diver IC should guarantee fast and accurate performance. So, the optimum driving method and high accurate frequency synthesizer are proposed. The die area of designed driver IC is $2.0{\times}1.6mm^2$ and power consumption is 2.8mW.

• Transactions on Electrical and Electronic Materials
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• v.18 no.6
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• pp.341-344
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• 2017

Infrared (IR) filters were developed to implement integrated three-dimensional (3D) image sensors that are capable of obtaining both color image and depth information at the same time. The combination of light filters applicable to the 3D image sensor is composed of a modified IR cut filter mounted on the objective lens module and on-chip filters such as IR pass filters and color filters. The IR cut filters were fabricated by inorganic $SiO_2/TiO_2$ multilayered thin-film deposition using RF magnetron sputtering. On-chip IR pass filters were synthetized by dissolving various pigments and dyes in organic solvents and by subsequent patterning with photolithography. The fabrication process of the filters is fairly compatible with the complementary metal oxide semiconductor (CMOS) process. Thus, the IR cut filter and IR pass filter combined with conventional color filters are considered successfully applicable to 3D image sensors.