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http://dx.doi.org/10.4313/TEEM.2017.18.6.341

Fabrication of Infrared Filters for Three-Dimensional CMOS Image Sensor Applications  

Lee, Myung Bok (Department of Industrial Technology Management, Gwangju University)
Publication Information
Transactions on Electrical and Electronic Materials / v.18, no.6, 2017 , pp. 341-344 More about this Journal
Abstract
Infrared (IR) filters were developed to implement integrated three-dimensional (3D) image sensors that are capable of obtaining both color image and depth information at the same time. The combination of light filters applicable to the 3D image sensor is composed of a modified IR cut filter mounted on the objective lens module and on-chip filters such as IR pass filters and color filters. The IR cut filters were fabricated by inorganic $SiO_2/TiO_2$ multilayered thin-film deposition using RF magnetron sputtering. On-chip IR pass filters were synthetized by dissolving various pigments and dyes in organic solvents and by subsequent patterning with photolithography. The fabrication process of the filters is fairly compatible with the complementary metal oxide semiconductor (CMOS) process. Thus, the IR cut filter and IR pass filter combined with conventional color filters are considered successfully applicable to 3D image sensors.
Keywords
3D image sensor; Depth sensor; Color filter; Infrared filter; Thin-film multilayer;
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