• 에너지공학
• /
• 제11권3호
• /
• pp.254-261
• /
• 2002

The fabrication method for the main components of the polymer electrolyte membrane fuel cell stack such as electrodes, membrane-electrode assemblies, and bipolar plates was established for the effective electrode area of 240 ㎠. A counter-flow type 100-cell stack was fabricated by using the above components and then a maximum power of 7.44 kW for H$_2$/O$_2$ and 5.56 kW for H$_2$/air could be obtained at 70$\^{C}$ and 1 atm. It was seen that the distribution of the OCV for unit cells in the stack was uniform but the voltage deviation increased as the load increased due to the IR drop and the electrode polarization. The stack was applied to the power source of the fuel cell/battery hybrid electric golf car. It produced about 1 kW at a room temperature operation during the test run, which occupied about 43% of the total power required by the 2.3 kW motor.

• Journal of information and communication convergence engineering
• /
• 제12권3호
• /
• pp.186-192
• /
• 2014

Monolithic three-dimensional integrated chips (3D ICs) are an emerging technology that offers an integration density that is some orders of magnitude higher than the conventional through-silicon-via (TSV)-based 3D ICs. This is due to a sequential integration process that enables extremely small monolithic inter-tier vias (MIVs). For a monolithic 3D memory, we first explore the static random-access memory (SRAM) design. Next, for digital logic, we explore several design styles. The first is transistor-level, which is a design style unique to monolithic 3D ICs that are enabled by the ultra-high-density of MIVs. We also explore gate-level and block-level design styles, which are available for TSV-based 3D ICs. For each of these design styles, we present techniques to obtain the graphic database system (GDS) layouts, and perform a signoff-quality performance and power analysis. We also discuss various challenges facing monolithic 3D ICs, such as achieving 50% footprint reduction over two-dimensional (2D) ICs, routing congestion, power delivery network design, and thermal issues. Finally, we present design techniques to overcome these challenges.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2009년도 제40회 하계학술대회
• /
• pp.967_968
• /
• 2009

For lighting application, high-power LED nowadays is driven at 350mA and a sensing resistor is used to provide feedback for LED-current regulation. This method adds an IR drop at the output branch, and limits power efficiency as LED current is large and keeps increasing. In this paper, a power efficient LED-current sensing circuit is proposed. The circuit does not use any sensing resistor but extracts LED-current information from the output capacitor of the driver. Controlling the brightness of LEDs requires a driver that provides a constant, regulated current. In one case, the converter may need to step down the input voltage, and, in another, it may need to boost up the output voltage. These situations often arise in applications with wide-ranging ""dirty"" input power sources, such as automotive systems. And, the driver topology must be able to generate a large enough output voltage to forward bias the LEDs. So, to provide this requirements, 13W prototype Buck-Boost Converter is used.

• Journal of Microbiology and Biotechnology
• /
• 제23권9호
• /
• pp.1229-1243
• /
• 2013

In this paper, an air isolate (NITT6L) has been screened based on hemolytic activity, emulsification activity, drop collapsing test, and oil displacement test, as well as lipase activity. It was found that strain NITT6L was able to reduce the surface tension of the medium from 61.5 to 39.83 mN/m and could form stable emulsions with tested vegetable oils. Morphological, biochemical, 16S rRNA sequencing analyses, and fatty acid methyl ester analysis using gas chromatography confirmed that the air isolate under study was Pseudomonas aeruginosa. Characterization of the biosurfactant using agar double diffusion assay revealed that the biosurfactant was anionic in nature, and CTAB-methylene blue assay and Molisch test revealed its glycolipid nature. The FT-IR spectrum confirmed that the crude biosurfactant was a rhamnolipid. Using unoptimized medium containing sucrose as the carbon source, the isolate was found to produce 0.3 mg/ml of rhamnolipid in batch cultivation (shake flask) at $37^{\circ}C$ and pH 7. Optimization of the medium components was carried out using design of experiments and the yield of rhamnolipid has been enhanced to 4.6 mg/ml in 72 h of fermentation.

• 한국환경과학회지
• /
• 제21권6호
• /
• pp.705-711
• /
• 2012

Adsorption experiment of carbon dioxide was performed on MCM41 silica with a 30 wt.% EDA(ethylenediamine) loading at different $CO_2$ inlet concentration and various adsorption temperature. The surface characteristics of $CO_2$ capturing agent were carried out using BET analysis, X-ray diffraction and FT-IR. The results of BET showed 781 $m^2/g$ for MCM41 and 464 $m^2/g$ for EDA/MCM41. X-ray diffraction results reveled typical hexagonal pore system. The higher sorption capacity of EDA/MCM41 was about 80 $mg_{CO2}/g_{sorbent}$ with 50% $CO_2$ inlet concentration and 303 K adsorption temperature. The isosteric heat of adsorption in 303-353 K ranged from -25.47 to -28.24 KJ/mole for EDA/MCM41, which indicates $CO_2$-EDA/MCM41 interaction with exothermic adsorption process. Finally, the performance of EDA/MCM41 in 10 consecutive sorption-desorption runs was a stable with only a minor drop in its sorption capacity.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2010년도 하계학술대회 논문집
• /
• pp.64-64
• /
• 2010

This paper presents the results of changes of optical properties of front materials in crystalline PV modules. If PV modules on the outdoor, transmittance of front materials is reduced by solar light. That is UV, IR included Solar spectrum will have change the properties of glass. Therefore decrease in transmittance leads to loss of the PV modules output. All the PV modules showed the loss in Isc by 1~5% within few hors. To investigate the changes we are analyzed using spectrophotometer from raw glass to laminated glass.

• 대한안전경영과학회:학술대회논문집
• /
• 대한안전경영과학회 2004년도 춘계학술대회
• /
• pp.247-257
• /
• 2004

Electrodes were fabricated based on activated carbon powder BP-20, conducting agent such as Super P, vapor grown carbon fiber (VGCF) and acetylene black (AB), and the mixed binders of flexible poly(vinylidenefluoridehexafluoropropylene) [P(VdF-co-HFP)] and cross linking dispersion agent of polyvinylpyrrolidone (PVP) to increase mechanical strength. According to impedance measurement of the electrode with the addition of conducting agent, we found that it was possible to charge rapidly by the fast steady-state current convergence due to low equivalent series resistance (AC-ESR, fast charge transfer rate at interface between electrode and electrolyte and low RC time constant. The self-discharge of unit cell showed that diffusion process was controlled by the ion concentration difference of initial electrolyte due to the characteristics of Electric Double Layer Capacitor (EDLC) charged by ion adsorption in the beginning, but this by current leakage through the double-layer at the electrode/electrolyte interface had a minor effect and voltages of curves were remained constant regardless of electrode material. We found that the 2.3V/230F grade EDLC would be applied to industrial safety usage such as uninterrupted power supply (UPS) because of the constant DC-ESR by IR drop regardless of discharge current.

• KIEE International Transactions on Electrophysics and Applications
• /
• 제4C권3호
• /
• pp.111-116
• /
• 2004

The Ni/SiC Schottky diode was fabricated with the $\alpha$-SiC thin film grown by the ICP-CVD method on a (111) Si wafer. $\alpha$-SiC film has been grown on a carbonized Si layer in which the Si surface was chemically converted to a very thin SiC layer achieved using an ICP-CVD method at $700^{\circ}C$. To reduce defects between the Si and $\alpha$-SiC, the surface of the Si wafer was slightly carbonized. The film characteristics of $\alpha$-SiC were investigated by employing TEM (Transmission Electron Microscopy) and FT-IR (Fourier Transform Infrared Spectroscopy). Sputterd Ni thin film was used as the anode metal. The boundary status of the Ni/SiC contact was investigated by AES (Auger Electron Spectroscopy) as a function of the annealing temperature. It is shown that the ohmic contact could be acquired beyond a 100$0^{\circ}C$ annealing temperature. The forward voltage drop at 100A/cm was I.0V. The breakdown voltage of the Ni/$\alpha$-SiC Schottky diode was 545 V, which is five times larger than the ideal breakdown voltage of the silicon device. As well, the dependence of barrier height on temperature was observed. The barrier height from C- V characteristics was higher than those from I-V.

• Current Applied Physics
• /
• 제18권12호
• /
• pp.1546-1552
• /
• 2018

The polymer nanocomposite as a gate dielectric film was prepared via sol-gel method. The formation of crosslinked structure among nanofillers and polymer matrix was proved by Fourier transform infrared spectroscopy (FT-IR). Differential thermal analysis (DTA) results showed significant increase in the thermal stability of the nanocomposite with respect to that of pure polymer. The nanocomposite films deposited on the p- and n-type Si substrates formed very smooth surface with rms roughness of 0.045 and 0.058 nm respectively. Deconvoluted $Si_{2s}$ spectra revealed the domination of the Si-OH hydrogen bonds and Si-O-Si covalence bonds in the structure of the nanocomposite film deposited on the p- and n-type Si semiconductor layers respectively. The fabricated n-channel field-effect-transistor (FET) showed the low threshold voltage and leakage currents because of the stronger connection between the nanocomposite and n-type Si substrate. Whereas, dominated hydroxyl groups in the nanocomposite dielectric film deposited on the p-type Si substrate increased trap states in the interface, led to the drop of FET operation.

• 마이크로전자및패키징학회지
• /
• 제29권1호
• /
• pp.1-6
• /
• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.