• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.9
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• pp.60-67
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• 2013

Test cost reduction is necessary to test a complex System-on-a-Chip(SoC) which adopts various Intellectual Properties (IP). In this paper, test architecture with low pin count which is able to IP-based SoC test, using IEEE Std. 1149.7 and IEEE Std. 1500, is proposed. IEEE Std. 1500 provides independent access mechanism for each IP in IP-based SoC test. In this paper, just two test pins are required by composing that these independent access mechanism can be controlled by IEEE Std. 1149.7. The number of Chips which are tested at the same time is increased by reducing required test pin count at wafer and package level test, and consequently the overall manufacturing test cost will be reduced significantly.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.2
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• pp.226-235
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• 2016

The yield of 3D stacked IC manufacturing improves with the pre-bond integrity testing of through silicon vias (TSVs). In this paper, an efficient pre-bond test method is presented based on IEEE std. 1500, which can precisely diagnose any happening of TSV defects. The IEEE std. 1500 wrapper cells are augmented for the proposed method. The pre-bond TSV test can be performed by adjusting the driving strength of TSV drivers and the test clock frequency. The experimental results show the advantages of the proposed approach.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.2
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• pp.114-121
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• 2013

As the weight of embedded memory within Systems-On-Chips(SoC) rapidly increases to 80-90% of the number of total transistors, the importance of testing embedded memory in SoC increases. This paper proposes IEEE std. 1500 wrapper based Programmable Memory Built-In Self-Test(PMBIST) architecture which can support various kinds of test algorithm. The proposed PMBIST guarantees high flexibility, programmability and fault coverage using not only March algorithms but also non-March algorithms such as Walking and Galloping. The PMBIST has an optimal hardware overhead by an optimum program instruction set and a smaller program memory. Furthermore, the proposed fault information processing scheme guarantees improvement of the memory yield by effectively supporting three types of the diagnostic methods for repair and diagnosis.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.1
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• pp.131-136
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• 2013

TSV based 3D ICs have been widely developed with new problems at die and IC levels. It is imperative to test at post-bond as well as pre-bond to achieve high reliability and yield. This paper introduces a new testable design technique which not only test microscopic defects at TSV input/output contact at a die but also test interconnect defects at a stacked IC. IEEE 1500 wrapper cells are augmented and through at-speed tests for pre-bond die and post-bond IC, known-good-die and defect free 3D IC can be massively manufactured+.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.1
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• pp.61-71
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• 2003

Interconnect test for highly integrated environments like SoC, becomes more important as the complexity of a circuit increases. This importance is from two facts, test time and complete diagnosis. Since the interconnect test between IPs is based on the scan technology such as IEEE1149.1 and IEEE P1500, it takes long test time to apply test vectors serially through a long scan chain. Complete diagnosis is another important issue because a defect on interconnects are shown as a defect on a chip. But generally, interconnect test algorithms that need the short test time can not do complete diagnosis and algorithms that perform complete diagnosis need long test time. A new interconnect test algorithm is developed. The new algorithm can provide a complete diagnosis for all faults with shorter test length compared to the previous algorithms.