• The Journal of Korean Institute of Communications and Information Sciences
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• v.18 no.3
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• pp.397-409
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• 1993

This paper proposed the design methodology of the 8 bit binary parallel adder with carry book-ahead scheme via current-mode CMOS multivalued logic and simulated the proposed adder under $5{\mu}m$ standard IC process technology. The threshold conditions of $G_K$ and $P_K$ which are needed for m-valued parallel adder with CLA are evaluated and adopted for quaternary logic. The design of quaternary CMOS logic circuits, encoder, decoder, mod-4 adder, $G_K$ and $P_K$ detecting circuit and current-voltage converter is proposed and is simulated to prove the operations. These circuits are necessary for binary arithmetic using multivalued logic. By comparing with the conventional binary adder and the CCD-MVL adder, We show that the proposed adder cab be designed one look-ahead carry generator with 1-level structure under standard CMOS technology and confirm the usefulness of the proposed adder.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.53-58
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• 2013

An innovative packaging solution, Flip Chip with Copper (Cu) Column bond on lead (BOL) Enhanced Process (fcCuBE$^{(R)}$) delivers a cost effective, high performance packaging solution over typical bond on capture pad (BOC) technology. These advantages include improved routing efficiency on the substrate top layer thus allowing conversion functionality; furthermore, package cost is lowered by means of reduced substrate layer count and removal of solder on pad (SOP). On the other hand, as electronic packaging technology develops to meet the miniaturization trend from consumer demand, reliability testing will become an important issue in advanced technology area. In particular, electromigration (EM) of flip chip bumps is an increasing reliability concern in the manufacturing of integrated circuit (IC) components and electronic systems. This paper presents the results on EM characteristics on BOL and BOC structures under electrical current stressing in order to investigate the comparison between two different typed structures. EM data was collected for over 7000 hours under accelerated conditions (temperatures: $125^{\circ}C$, $135^{\circ}C$, and $150^{\circ}C$ and stress current: 300 mA, 400 mA, and 500 mA). All samples have been tested without any failures, however, we attempted to find morphologies induced by EM effects through cross-sectional analysis and investigated the interfacial reaction characteristics between BOL and BOC structures under current stressing. EM damage was observed at the solder joint of BOC structure but the BOL structure did not show any damage from the effects of EM. The EM data indicates that the fcCuBE$^{(R)}$ BOL Cu column bump provides a significantly better EM reliability.

• Composites Research
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• v.24 no.1
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• pp.37-44
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• 2011

In this paper, Particle Swarm Optimization(PSO) is applied to the design of the Frequency Selective Surface(FSS) and residual stresses of hybrid radome is predicted. An equivalent circuit model with Square Loops arrays was derived and then PSO was applied for acquiring the optimized geometrical parameters with proper resonant frequency. Residual stresses occur in the FSS embedded composite structures after cocuring and have a great influence on the strength of the FSS embedded composite structures. They also effect transmission quality because of delamination. Therefore, the thermal residual stresses of FSS embedded composite structures were analyzed using finite element analysis with considering the effects of FSS pattern, and composite stacking sequence.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.144-144
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• 1999

최근 국내 반도체 기술의 비약적인 발전으로 전자 기기 전반에 소형화, 고주파화, 고기능화 등이 진행되는데 반해, 반도체 소자등에 전원을 공급하거나 회로 전체를 운용하는 전기 신호를 변조.증폭시키는데 반해, 반도체 소자등에 전원을 공급하거나 회로 전체를 운용하는 전기신호를 변조.증폭시키는 인덕터, 트랜스 포머와 같은 수동 자기 소자는 아직도 3차원 벌크 형태로 사용되고 있다. 일본을 중심으로 각국에서는 자기 소자의 박막.소형화에 대한 다각도의 연구가 진행되었으나 국내서는 아직 미미한 실정이다. 따라서 고집적 전원 공급 장치나 지능 센서 등에 반도체와 자기 소자의 사용 주파수 대역과 크기가 통합된 반도체-자성체 IC(semiconductor-magnetic integrated circuit)의 필요성이 절실히 요구되고 있다. 현재 사용중인 벌크형 인덕터나, 트랜스 포머의 경우 10NHz이상의 고주파 대역에는 응용되지 못하고 있다. 이는 적용된 자성체가 페라이트(ferrite)로서 초투자율은 크지만 고주파대역에서의 공진 현상에 의해 저투자율을 나타내고, 포화 자속밀도가 낮기 때문이다. 이러한 페라이트 자성체의 대체품으로 주목받고 있는 것이 Fe, Co계 고비저항 자성마이다. 그러나 Co는 낮은 포화자속밀도를 나타내기 때문에 이러한 조건을 충족시키는 자성막으로 Fe계 미세 결정막을 사용하였다. 본 연구에서는 선택적 전기 도금법(selective electroplating method)과 LIGA like process를 이용하여 공시형 인덕터(air core inductor)의 라이브러리(library)를 구축한 뒤, 고주파 대역에서의 우수한 연자기 특성을 가지는 Ti/FeTaN막을 적용한 자기 박막 인덕터(magnetic thin film inductor)를 제작하여 비교.분석하였다. 제조된 인덕터의 특성 추정은 impedence analyzer를 이용하여 주파수에 따른 저항(resistance), 인덕턴스(inductance)를 측정, 계산한 성능지수(quality factor)로서 인덕터의 성능을 평가하였다. 제조된 박막 인덕터의 코일 형상은 5턴의 double rectangular spiral 구조였으며, 적용된 자성막의 유효 투자율9effective permeability)은 1500, 자성막, 절연막 그리고 코일의 두께는 각각 2$\mu\textrm{m}$, 1$\mu\textrm{m}$, 20$\mu\textrm{m}$이며 코일의 폭은 100$\mu\textrm{m}$, 코일간의 간격은 100$\mu\textrm{m}$였다. 제조된 박막 인덕터는 5MHz에서 1.0$\mu$H의 인덕턴스를 나타내었으며 dc current dervability는 100mA까지 유지되었다.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.2
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• pp.301-306
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• 2015

An ultra-compact and wideband low noise amplifier (LNA) in a quad flat non-leaded (QFN) package is presented. The LNA monolithic microwave integrated circuit (MMIC) is implemented in a $0.25{\mu}m$ GaN IC technology on a Silicon Carbide (SiC) substrate provided by Triquint. A source degeneration inductor and a gate inductor are used to obtain the noise and input matching simultaneously. The resistive feedback and inductor peaking techniques are employed to achieve a wideband characteristic. The LNA chip is mounted in the $3{\times}3-mm^2$ QFN package and measured. The supply voltages for the first and second stages are 14 V and 7 V, respectively, and the total current is 70 mA. The highest gain is 13.5 dB around the mid-band, and -3 dB frequencies are observed at 0.7 and 12 GHz. Input and output return losses ($S_{11}$ and $S_{22}$) of less than -10 dB measure from 1 to 12 GHz; there is an absolute bandwidth of 11 GHz and a fractional bandwidth of 169%. Across the bandwidth, the noise figures (NFs) are between 3 and 5 dB, while the output-referred third-order intercept points (OIP3s) are between 26 and 28 dBm. The overall chip size with all bonding pads is $1.1{\times}0.9mm^2$. To the best of our knowledge, this LNA shows the best figure-of-merit (FoM) compared with other published GaN LNAs with the same gate length.

• Journal of Advanced Navigation Technology
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• v.18 no.4
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• pp.364-370
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• 2014

In this paper, high reliable trench formation technique and a novel fabrication techniques for trench gate MOSFET is proposed which is a key to expend application of power MOSFET in the future. Trench structure has been employed device to improve Ron characteristics by shrinkage cell pitch size in DMOSFET and to isolate power device part from another CMOS device part in some power integrated circuit. A new process method for fabricating very high density trench MOSFETs using mask layers with oxide spacers and self-align technique is realized. This technique reduces the process steps, trench width and source and p=body region with a resulting increase in cell density and current driving capability and decrease in on resistance.

• The Transactions of the Korean Institute of Power Electronics
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• v.7 no.5
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• pp.419-426
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• 2002

A new active lossless snubber for half-bridge dual converter(that is called'dual converter') is proposed in this paper It features soft switching(ZVS) as well as turn-off snubbing in both main and auxiliary switches. Therefore, it helps the dual converter to operate at the higher frequency with a higher efficiency and smaller-sized reactive components. Moreover, since it uses parasitic components, such as leakage inductances and switch output capacitances etc, to achieve the ZVS of power switches, it has simpler structure and lower cost of production. The operational principle, theoretical analysis, and design consideration are presented. To confirm the operation, features, and validity of the proposed circuit, experimental results from a 200w, 24V/DC-200V/DC proto-type are presented.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.6
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• pp.50-56
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• 2015

An efficient fast response hysteretic buck converter suitable for mobile application is propoesed. The problems of large output ripple and difficulty in using of small power inductor that conventional hysteretic converter has are improved by adding ramp generator. and the changeable switching frequency with load current is fixed by adding a delay time control circuit composed of PLL structure resulting in decrease of EMI noise. The circuits are implemented by using BCDMOS 0.35um 2-polt 4-metal process. Measurement results show that the converter operates with a switching frequency of 1.85MHz when drives 80mA load current. As the converter drives over 170mA load current, the switching frequency is fixed on 2MHz. The converter has output ripple voltage of less 20mV and more than efficiency 85% with 50~500mA laod current condition.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.2
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• pp.100-105
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• 2010

In this paper, a FM radio receiver integrated circuit has been developed based on $0.5{\mu}m$ CMOS process for Zero-Crossing FM demodulator over the 88MHz to 108MHz band. The receiver is designed with the low-IF architecture, and includes Low Noise Amplifier(LNA), Down-Conversion Mixer, Phase Locked Loop(PLL), IF LPF, and a comparator. The measured results of the LNA and Mixer show that the conversion gain of 23.2 dB, the input PldB of -14 dBm, and the noise figure of 15 dB. The measured analog block of the LPF and comparator show the voltage gain of over 89 dB, and the IF LPF can configure the passband from 600KHz to 1.3MHz with 100KHz step through the internal control register banks. The designed FM radio receiver operates at 4.5V with the total current consumption of 15.3mA, so the total power consumption is about 68.85mW. The commercial FM radio has been successfully received.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.7
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• pp.103-110
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• 2014

Recent TSV based 3D Integrated Circuit (IC) technology needs more powerful thermal management techniques. However, because cooling cost and form factor are restricted, thermal management are emphasis on software based techniques. But in case of throttling thermal management which one of the most candidate technique, increasing bus occupation induce total performance decrease. To solve communication bottleneck issue in TSV based 3D SoC, we proposed adaptive throttling technique Experimental results show that the proposed method can improve throughput by about 72% compare with minimal path routing.