• KSBB Journal
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• v.23 no.1
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• pp.77-82
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• 2008

We investigated several biological activities using the ethanol extract and its fractions from Pimpinella komarovii leaves to evaluate the usefulness of its extract as a functional biomaterial. The ethanol extract showed antioxidant activities, such as DPPH scavenging activity $(IC_{50}=231.8{\mu}g/m{\ell})$. superoxide scavenging activity $(IC_{50}=23.6{\mu}g/m{\ell})$, and xanthine oxidase inhibitory activity $(IC_{50}=587.8{\mu}g/m{\ell})$. Its EtOAc fraction showed the strongest antioxidant activities among several fractions. The inhibitory effect of ethanol extract on tyrosinase activity was higher than water fraction. When $50{\mu}g/m{\ell}$ of EtOAc fraction was applied, the inhibition ratio of tyrosinase activity was much higher (42%) than that of melasolv. The EtOAc fraction also showed higher inhibitory effect on melanogenesis in Melan-a cells. The n-hexane and EtOAc fractions dose-dependently inhibited the NO production in a RAW 264.7 cells. These results suggest that extract of Pimpinella komarovii could be used as functional biomaterial in developing a skin whitening agent having the antioxidant activity.

• The KIPS Transactions:PartA
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• v.19A no.1
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• pp.51-60
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• 2012

IC(Integrated circuits)card, generally be named smard card, embedded MPU(Micro Processor Unit) of small-size, memory, EEPROM, Card Operating System(COS) and security algorithm. The IC card is used in almost all industry such as a finance(credit, bank, stock etc.), a traffic, a communication, a medical, a electronic passport, a membership management and etc. Recently, a application field of IC card is on the increase by method for payments of T-commerce, as T-commerce is becoming a new growth engine of the broadcating industry by trend of broadcasting and telecommunication convergence, smart mechanization of TV. For example, we can pay in IC credit card(or IC cash card) on T-Commerce. or we can be provided TV banking service in IC cash card such as ATM. However, so far, T-commerce payment services have weakness in security such as storage and disclosure of card information as well as dropping sharply about custom ease because of taking advantage of card information input method using remote control. To solve this problem, This paper developed processing payment module for implementing TV electronic payment system using IC credit card payment standard, EMV.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.10a
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• pp.291-292
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• 2014

High-speed video transmission modes of master bridge IC are implemented, which supports MIPI (Mobile Industry Processor Interface) DSI (Display Serial Interface) standard. MIPI DSI master bridge IC sends RGB data and various commands to display module (slave) in order to test it. The master bridge IC consists of buffers storing video data of two lines, packet generation block, and D-PHY layer that distributes packets to data lanes and transmits them to slave. In addition, it supports four bpp (bit per pixel) formats and three transmission modes including Burst and Non-Burst (Sync Events, Sync Pulses types). The designed bridge IC is verified by RTL simulations showing that it functions correctly for various operating parameters.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.55 no.2
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• pp.121-128
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• 2022

The aims of this study were to optimize the processing procedure of high-quality semi-alternating temperature dried Israeli carp Cyprinus carpio (SAD-IC) and to investigate the sensory properties of the product. Based on the differences in moisture content of the dorsal and ventral muscles, high quality SAD-IC was prepared by alternating the drying temperature between 4 h at 35℃, and 2 h at 5℃, three times before final drying for 2 h at 35℃. The surface in SAD-IC produced under the optimal alternating-temperature drying process had a markedly superior browning index value and softer texture compared to products produced using constant-temperature drying. SAD-IC produced from dorsal and ventral muscle had significantly superior taste values than the raw material. These results suggest that SAD-IC has the potential to be industrialized.

• Journal of Fashion Business
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• v.27 no.5
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• pp.121-134
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• 2023

With the development of information and communication technology, interest in new educational approaches that can enhance the learning performance of learners with improved information literacy skills is increasing, and universities are actively promoting educational innovation to foster the talents required by society. In the field of fashion studies education, which is closely related to the fashion industry, there is a strong need to develop field-linked educational programs that reflect the trends in the industry and changes in the educational system. The purpose of this study was to introduce industry-coupled problem-based learning (IC-PBL) to the course "Understanding Fashion Consumption Trends" for non-fashion majors to reflect the current needs and strengthen the educational effectiveness of the learners through a survey. A seven-step curriculum (introduction to the class, practitioner's problem, learner's problem analysis, organizing concepts related to variables, information collection and scenario writing, presentation and scenario proposal, and evaluation) not only enhanced learners' understanding of fashion consumption trends and the fashion industry but also greatly amplified learners' satisfaction with the class. The results of the survey showed that the seven-step curriculum was effective in increasing learners' self-directed learning ability, problem-solving ability, and confidence in learning. Self-directed learning ability was stronger than other factors, consistent with the core principle of problem-based learning to empower learners to take the initiative and promote self-directed learning. Each factor analyzed was positively correlated.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.3
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

• Laser Solutions
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• v.15 no.3
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• pp.7-10
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• 2012

Dimensions (line/space) of circuits in IC substrates for high-end chips (e.g. CPU, etc.) are anticipated to decrease as small as $10{\mu}m/10{\mu}m$ in 2014. Since current etch-based circuit-patterning processes are not able to address the urgent requirement from industry, laser-based circuit patterning processes are under active research in which UV laser is used to engrave embedded circuits patterns into IC substrates. In this paper, we used a nanosecond UV laser to directly fabricate embedded circuit patterns into IC substrates with/without ceramic powders. In experiments, we engraved embedded circuit patterns with dimensions (width/depth) of abut $10{\mu}m/10{\mu}m$ and $6{\mu}m/6{\mu}m$ into the IC substrates. Due to the recoil pressure occurring during ablation, the circuit patterning of the IC substrates with ceramic powders showed the higher ablation rate.

• International Commerce and Information Review
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• v.12 no.2
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• pp.133-158
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• 2010

Since 11 September 2001, the awareness of terrorists' actions has clearly risen. The potential threat of terrorists using containers poses a large risk to our economies and to our societies. In order to protect cargo from damage and terrorist threats, business and government turn to RFID and IC tags, and tradition container is replaced by IC smart container. In this study, presented application of IC tag and future tasks to Container transport by sea in viewpoint of security strengthening. First, realization and international SCM realization structural order that cover container supply chain whole of international standardization and association between industry are certainly needed. Second, it may have to try in technical development for IC tag Ratio that can read elevation moment develop suitable IC tag or reader in International Standard. Third, Need to establish concrete use policy as soon as possible in national dimension at the same time effort for international standard normalization of frequency. Finally, it shows to uses jointly with electron sealing and must solve problem about usable plan and information leak.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.286-291
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• 2001

Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

• Korean Management Science Review
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• v.18 no.1
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• pp.1-13
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• 2001

Despite that the semiconductor industry plays an important role to our economy, it has abnormal industrial structure stressing too much on memory chips. Thus, it is essential for our corporate to develop nonmemory chips to obtain technological leadership in a highly competitive semiconductor market. In this study, we demonstrate how benefit/cost analysis using the Analytic Hierarchy process (AHP) can be used for the proper selection of nonmemory semiconductor chips: Microprocessor, ASIC, digital IC and Analogue IC. The final results show that ASIC is the most attractive chip to develop, followed by Analogue IC, digital IC and Microprocessor. This is Somewhat consistent with the information that we found with respect to the elements that were taken into consideration. Sensitivity analysis is also provided here.