Laser Solutions (한국레이저가공학회지)

Korean Society of Laser Processing (한국레이저가공학회)
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Characteristics of direct laser micromachining of IC substrates using a nanosecond UV laser

나노초 UV 레이저 응용 IC 기판 소재 조성별 가공 특성

  • Sohn, Hyon-Kee (Dept. of High-density & High-energy Beam Processing, KIMM) ;
  • Shin, Dong-Sig (Dept. of High-density & High-energy Beam Processing, KIMM) ;
  • Choi, Ji-Yeon (Dept. of High-density & High-energy Beam Processing, KIMM)
  • 손현기 (광응용기계연구실, 한국기계연구원) ;
  • 신동식 (광응용기계연구실, 한국기계연구원) ;
  • 최지연 (광응용기계연구실, 한국기계연구원)
  • Received : 2012.09.14
  • Accepted : 2011.03.20
  • Published : 2012.09.30
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Abstract

Dimensions (line/space) of circuits in IC substrates for high-end chips (e.g. CPU, etc.) are anticipated to decrease as small as $10{\mu}m/10{\mu}m$ in 2014. Since current etch-based circuit-patterning processes are not able to address the urgent requirement from industry, laser-based circuit patterning processes are under active research in which UV laser is used to engrave embedded circuits patterns into IC substrates. In this paper, we used a nanosecond UV laser to directly fabricate embedded circuit patterns into IC substrates with/without ceramic powders. In experiments, we engraved embedded circuit patterns with dimensions (width/depth) of abut $10{\mu}m/10{\mu}m$ and $6{\mu}m/6{\mu}m$ into the IC substrates. Due to the recoil pressure occurring during ablation, the circuit patterning of the IC substrates with ceramic powders showed the higher ablation rate.

Keywords