• 한국자기학회지
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• 제12권5호
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• pp.168-173
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• 2002

본 연구에서는 인체모델(humman body model; HBM)을 터널링 자기저항(tunneling magneto resistance; TMR)소자에 연결하여 정전기에 대한 방전특성을 연구하였다. 이를 위해 제조된 TMR 시편을 전기적 등가회로 바꿔 HBM에 연결하여 PSPICE를 이용해 시뮬레이션 하였다. 이러한 등가회로에서 접합부분의 모델링 요소들의 값을 변화시켜 방전특성을 관찰할 수 있었다. 그 결과 시편의 저항과 정전용량 성분의 값이 다른 요소들에 비해 수배에서 수백 배까지 커서 정전기 방전(electrostatic discharge; ESD) 민감도를 좌우하는 주요한 요소임을 알 수 있었다. 여기에서 ESD현상에 대한 내구성을 향상시키기 위해서는 정전용량을 증가시키는 것 보다 접합면과 도선의 저항값을 줄이는 것이 유리하다. 그리고 직류 전압에 대해 절연층의 전위 장벽이 낮아져 많은 전류가 흐르게 되는 항복(breakdown)전압과 셀의 물리적 구조 및 성질이 변형되어 회복되지 못하는 파괴(failure)전압을 측정하여 DC 상태에서의 내구성을 연구하였다. 이 결과를 HBM 전압에 대한 파괴 전압으로 간주하여 TMR 소자가 견딜 수 있는 HBM 전압을 예측할 수 있었다.

• 한국정보통신학회논문지
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• 제6권7호
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• pp.1079-1083
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• 2002

반도체 소자의 정전기 내성을 알아보기 위해 필요한 HBM ESD 테스터를 작자하였다 .HBM ESD 테스트는 MMIC의 정전기 내성을 측정하는 데 가장 많이 사용하는 방식이다. 고전압의 ESD 신호론 얻기 위하여 DC-DC converter의 일종인 flyback 방식온 도입하였다. Flyback 방식으로 제자된 HBM ESD 테스터는 고전압 부분과 저전압 부분을 서로 격리시킬 수 있는 장점이 있다 스위치로 사용된 relay의 air gap을 이용하여 정전기의 rise time이 국제 규격에 맡도록 설계하였다. 결과적으로, flyback 방식과 relay의 air gap을 이용하여 기생 성분이 최소화된 ESD 테스터를 제작하였다.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2002년도 추계종합학술대회
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• pp.469-472
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• 2002

반도체 소자의 정전기 내성을 알아보기 위해 필요한 HBM ESD 테스터를 제작하였다. HBM ESD 테스트는 MMIC의 정전기 내성을 측정하는데 가장 많이 사용하는 방식이다. 고전압의 ESD 신호를 얻기 위하여 DC-DC converter의 일종인 flyback 방식을 도입하였다. Flyback 방식으로 제작된 HBM ESD 테스터는 고전압 부분과 저전압 부분을 서로 격리시킬 수 있는 장점이 있다. 스위치로 사용된 relay의 air gap을 이용하여 정전기의 rise time이 국제 규격에 맞도록 설계하였다. 결과적으로, flyback 방식과 relay의 air gap을 이용하여 기생 성분이 최소화된 ESD 테스터를 제작하였다.

• 한국전기전자재료학회논문지
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• 제11권8호
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• pp.587-595
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• 1998

Transient thermal analysis simulations are carried out using a modeling program to understand the human body model HBM ESD. The devices were simulated a one-dimensional device subjected to ESD stress by solving Poison's equation, the continuity equation, and heat flow equation. A ramp rise with peak ESD voltage during rise time is applied to the device under test and then discharged exponentially through the device. LDD and NMOS structures were studied to evaluate ESD performance, snap back voltages, device heating. Junction heating results in the necessity for increased electron concentration in the space charge region to carry the current by the ESD HBM circuit. The doping profile adihacent to junction determines the amount of charge density and magnitude of the electric field, potential drop, and device heating. Shallow slopes of LDD tend to collect the negative charge and higher potential drops and device heating.

• 한국안전학회지
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• 제26권3호
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• pp.15-22
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• 2011

Explosion and fire cause about 30 reported industrial major accidents a year by ignition source which discharge of electrostatic generated to flammable gas, vapor, dust and mixtures. It brings economically and humanly very large loss that accident was caused by fire and explosion from electrostatic discharge. Thus, it is very important that electrostatic discharge energy is to be control below not to be igniting flammable mixtures. There are two kinds of analysis model for electrostatic discharge, human body model and machine model. Human body model is available the parameter of human's electrical equivalent that capacitance is 100 pF, resistance is $1.5k{\Omega}$. To simulate and visualize the electrostatic discharge from human body need a very expensive and high voltage simulator. In this paper, we measured the value of capacitance and resistance concerned with test materials and sizing of specimen and the value of charged voltage concerned with test specimen and distance to develop an electrostatic charge/discharge simulating tool for teaching with which concerned industrial employee and students. The result of experiments, we conformed that the minimum ignition energy of methane-oxygen mixtures meets well the equation $W=1/2CV^2$, and found out that the insulating material and sizing of equivalent value having human body mode are the poly ethylene of 200 mm and 300 mm of diameter. Developed electrostatic charge/discharge simulating tool has many merits; simple mechanism, low cost, no need of electric power and so on.

• 전자공학회논문지A
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• 제30A권12호
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• pp.88-97
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• 1993

Electrostatic Discharge(ESD) is one of the major reliability, issues for today's VLSI production. Since the gate oxide with a thickness of 100~300$\AA$ is vulnerable to several thousand volt of ESD surge, it is necessary to control the ESD events and design an efficient protection circuit. In this paper, physical mechanism of the catastrophic ESD damage is investigated by transient analysis based upon Human Body Model(HBM). Using two-dimensional electrothermal simulator, we study the failure mechanism of the output protection devices by ESD and discuss the design issues for the optimun protection network.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권1호
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• pp.1-7
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• 2014

A bidirectional transient voltage suppression (TVS) diode consisting of specially designed $p^--n^{{+}+}-p^-$ multi-junctions was developed using low temperature (LT) epitaxy and fabrication processes. Its electrostatic discharge (ESD) performance was investigated using I-V, C-V, and various ESD tests including the human body model (HBM), machine model (MM) and IEC 61000-4-2 (IEC) analysis. The symmetrical structure with very sharp and uniform bidirectional multi-junctions yields good symmetrical I-V behavior over a wide range of operating temperature of 300 K-450 K and low capacitance as 6.9 pF at 1 MHz. In addition, a very thin and heavily doped $n^{{+}+}$ layer enabled I-V curves steep rise after breakdown without snapback phenomenon, then resulted in small dynamic resistance as $0.2{\Omega}$, and leakage current completely suppressed down to pA. Manufactured bidirectional TVS diodes were capable of withstanding ${\pm}4.0$ kV of MM and ${\pm}14$ kV of IEC, and exceeding ${\pm}8$ kV of HBM, while maintaining reliable I-V characteristics. Such an excellent ESD performance of low capacitance and dynamic resistance is attributed to the abruptness and very unique profiles designed very precisely in $p^--n^{{+}+}-p^-$ multi-junctions.

• 한국자동차공학회논문집
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• 제21권2호
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• pp.159-165
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• 2013

ESD damage by Charged Cable Model (CCM) is introduced. Due to its own impedance characteristic unlike Human Body Model (HBM) or Machine Model (MM) electric component can be destroyed even though it is located after typical protection circuit. Possible mechanism of ESD damage to automotive electric control unit (ECU) in vehicle environment by CCM discharge was investigated. Based on investigation, field-returned vehicle whose ECU is expected to be damaged by CCM discharge was tested to reproduce it and similar electric component destruction inside ECU was observed. Suggestions to reduce the possibility of ESD damage by CCM are introduced.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 학술대회지
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• pp.455-459
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• 2004

Electrostatic discharge(ESD) is a serious reliability concern. It causes approximately most of all field failures of integrated circuits. Inevitably, future IC technologies will shrink the dimensions of interconnects, gate oxides, and junction depths, causing ICs to be increasingly susceptible to ESD-induced damage [1][2][3]. This thesis shows the optimization of the ESD protection circuit based on the tested results of MM (Machine Model) and HBM (Human Body Model), regardless of existing Reference in fully silicided 0.18 um CMOS process. His thesis found that, by the formation of silicide in a source and drain contact, the dimensions around the contact had a less influence on the ESD robustness and the channel width had a large influence on the ESD robustness [8].

• JSTS:Journal of Semiconductor Technology and Science
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• 제17권3호
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• pp.401-410
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• 2017

In this work, we show that the excessive lattice heating problem due to parasitic pnp transistor action in the diode electrostatic discharge (ESD) protection device in the diode input protection circuit, which is favorably used in CMOS RF ICs, can be solved by adopting a symmetrical cathode structure. To explain how the recipe works, we construct an equivalent circuit for input human-body model (HBM) test environment of a CMOS chip equipped with the diode protection circuit, and execute mixed-mode transient simulations utilizing a 2-dimensional device simulator. We attempt an in-depth comparison study by varying device structures to suggest valuable design guidelines in designing the protection diodes connected to the $V_{DD}$ and $V_{SS}$ buses. Even though this work is based on mixed-mode simulations utilizing device and circuit simulators, the analysis given in this work clearly explain the mechanism involved, which cannot be done by measurements.