• 한국표면공학회지
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• 제29권5호
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• pp.498-504
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• 1996

The synthesis of carbon nitride thin films with high nitrgen concentration was accomplished by reactive supttering at relatively high working pressure. In conventional reactive sputter-deposition of carbon nitride films, working pressure was 0.3-5Pa and the ratio of nitrogen to carbon(N/C ratio) in the films was less than 0.5. In this study, amorphous carbon nitride films with the N/C ratio $\tickapprox$ 1.0 were prepared on Si(100). substrates at higher pressure, 20-60 Pa. Structural analyses with Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy revealed that the films prepared consisted of triazine-like plain network.

• 융합신호처리학회논문지
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• 제18권1호
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• pp.1-5
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• 2017

It is important to train lower limb muscle strength using a tilting table to recover the lower extremity function of hemiplegia patients. It is known that the foot deformity and poor posture of hemiplegia patients can reduce the effectiveness of lower limb rehabilitation training. In this study, we developed a sensor system that can measure the foot pressure distribution of the patients for the load control of the lower extremity during lower limb rehabilitation training and it can be substituted for conventional high-cost technologies.

• 축산식품과학과 산업
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• 제8권1호
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• pp.2-7
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• 2019

• 축산식품과학과 산업
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• 제8권1호
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• pp.35-42
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• 2019

• 한국레이저가공학회지
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• 제15권3호
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• pp.7-10
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• 2012

Dimensions (line/space) of circuits in IC substrates for high-end chips (e.g. CPU, etc.) are anticipated to decrease as small as $10{\mu}m/10{\mu}m$ in 2014. Since current etch-based circuit-patterning processes are not able to address the urgent requirement from industry, laser-based circuit patterning processes are under active research in which UV laser is used to engrave embedded circuits patterns into IC substrates. In this paper, we used a nanosecond UV laser to directly fabricate embedded circuit patterns into IC substrates with/without ceramic powders. In experiments, we engraved embedded circuit patterns with dimensions (width/depth) of abut $10{\mu}m/10{\mu}m$ and $6{\mu}m/6{\mu}m$ into the IC substrates. Due to the recoil pressure occurring during ablation, the circuit patterning of the IC substrates with ceramic powders showed the higher ablation rate.

• 한국축산식품학회지
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• 제33권1호
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• pp.16-23
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• 2013

This study was carried out to investigate the effect of trans-cinnamaldehyde and high pressure treatment on milk. Cinnamon oil milk was manufactured by high speed homogenization (3,000 rpm) and high pressure homogenization (500 and 2,000 bar) processing UHT milk and trans-cinnamaldehyde of various concentrations (0 to 0.1% (w/v)). Cinnamon oil milk was inoculated with Escherichia coli (6.4 Log CFU/mL) and kept at $7^{\circ}C$ for 10 d to observe the antibacterial effect. The cinnamon oil milk containing 0.05% (w/v) trans-cinnamaldehyde initially began to show an antibacterial effect and Escherichia coli completely died in cinnamon oil milk added 0.1% (w/v) trans-cinnamaldehyde on the 6th day of storage. The result of the TBA value showed that the addition of 0.1% (w/v) trans-cinnamaldehyde was also effective to protect lipid oxidation. In the physical properties of cinnamon oil milk, particle sizes were enlarged in all samples during storage periods and the total color difference of cinnamon oil milk was slightly increased as level of high pressure. The surface tension of cinnamon oil milk treated 2,000 bar was remarkably higher than other samples. It seems that trans-cinnamaldehyde showed antibacterial activity and antioxidation effect at 0.05 and 0.1% (w/v) of concentration. Remarkably, high pressure treatment did not influence its microbial property but slightly affected the physical properties of cinnamon oil milk.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.269-272
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• 2006

The hydroforming processing is a relatively new technology in comparison with conventional stamping process. The hydroforming processing makes torsion beam in rear suspension of automobile. The durability of torsion beam is very important characteristic that operate in an automobile. In order to optimize the hydroforming process and satisfy the durability, the hydroforming simulation which could control an axial compression and high internal pressure with computer simulation has to be operated. This paper is about an optimum design to improve the kinematic and compliance characteristics of a torsion-beam of suspension system. The result from finite element analysis shows that the forming and the durability are optimized. If there is effect of First pressure in hydroforming processing that gap is in the die tool, the prototype of tube is not satisfied on the durability test.

• 한국분말재료학회지
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• 제17권3호
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• pp.190-196
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• 2010

In this paper, rapid solidified Mg-4.3Zn-0.7Y (at.%) alloy powders were prepared using an inert gas atomizer, followed by a severe plastic deformation technique of high pressure torsion (HPT) for consolidation of the powders. The gas atomized powders were almost spherical in shape, and grain size was as fine as less than $5\;{\mu}m$ due to rapid solidification. Plastic deformation responses during HPT were simulated using the finite element method, which shows in good agreement with the analytical solutions of a strain expression in torsion. Varying the HPT processing temperature from ambient to 473 K, the behavior of powder consolidation, matrix microstructural evolution and mechanical properties of the compacts was investigated. The gas atomized powders were deformed plastically as well as fully densified, resulting in effective grain size refinements and enhanced microhardness values.

• 센서학회지
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• 제24권1호
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• pp.10-14
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• 2015

This paper reports the results of a study on the optimization of the etching profile, which is an important factor in deep-reactive-ion etching (DRIE), i.e., dry etching. Dry etching is the key processing step necessary for the development of the Internet of Things (IoT) and various microelectromechanical sensors (MEMS). Large-area etching (open area > 20%) under a high-frequency (HF) condition with nonoptimized processing parameters results in damage to the etched sidewall. Therefore, in this study, optimization was performed under a low-frequency (LF) condition. The HF method, which is typically used for through-silicon via (TSV) technology, applies a high etch rate and cannot be easily adapted to processes sensitive to sidewall damage. The optimal etching profile was determined by controlling various parameters for the DRIE of a large Si wafer area (open area > 20%). The optimal processing condition was derived after establishing the correlations of etch rate, uniformity, and sidewall damage on a 6-in Si wafer to the parameters of coil power, run pressure, platen power for passivation etching, and $SF_6$ gas flow rate. The processing-parameter-dependent results of the experiments performed for optimization of the etching profile in terms of etch rate, uniformity, and sidewall damage in the case of large Si area etching can be summarized as follows. When LF is applied, the platen power, coil power, and $SF_6$ should be low, whereas the run pressure has little effect on the etching performance. Under the optimal LF condition of 380 Hz, the platen power, coil power, and $SF_6$ were set at 115W, 3500W, and 700 sccm, respectively. In addition, the aforementioned standard recipe was applied as follows: run pressure of 4 Pa, $C_4F_8$ content of 400 sccm, and a gas exchange interval of $SF_6/C_4F_8=2s/3s$.

• 센서학회지
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• 제32권1호
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• pp.22-30
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• 2023

Innovative and advanced technologies, including robots, augmented reality, virtual reality, the Internet of Things, and wearable medical equipment, have largely emerged as a result of the rapid evolution of modern society. For these applications, pressure monitoring is essential and pressure sensors have attracted considerable interest. To improve the sensor performance, several new designs of pressure sensors have been researched based on resistive, capacitive, piezoelectric, optical, and triboelectric types. In particular, optical pressure sensors have been actively studied owing to their advantages, such as robustness to noise and remote sensing capability. Herein, a review of recent research on optical pressure sensors with self-powered sensing, remote sensing, high spatial resolution, and multimodal sensing capabilities is presented from the viewpoints of design, fabrication, and signal processing.